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Renesas 70T3319S133BC8
- Part No.:
- 70T3319S133BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3319S133BC8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
70T3319S133BC8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 256K × 18-bit organization (4.6 Mbit), 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and operates at 133MHz in industrial temperature range (−40°C to +85°C) in a 256-pin BGA package.
For engineers reviewing the 70T3319S133BC8 datasheet, 70T3319S133BC8 pinout, 70T3319S133BC8 application, or 70T3319S133BC8 equivalent, key selection criteria include simultaneous dual-port access latency, byte-selectable write control, JTAG-compliant boundary scan support, and low-power sleep mode with ZZ pins - all critical for real-time packet buffering and inter-processor communication in telecom and industrial controllers.
Technical Context
The 70T3319S133BC8 implements true dual-port SRAM cells enabling concurrent read/write access to the same memory location from independent left and right ports. Each port includes fully synchronous registers for address, data, and control inputs, achieving 1.5ns setup and 0.5ns hold times at 200MHz operation.
It supports independent voltage configuration per port via OPTL/OPTR pins: when set to VDD (2.5V), corresponding I/Os operate at 3.3V levels with VDDQX = 3.3V; when set to VSS (0V), I/Os operate at 2.5V with VDDQX = 2.5V. The device also integrates interrupt and collision detection flags (INTL/INTR, COLL/COLR) for arbitration-aware system designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18-bit (4.6 Mbit); A18 is NC - actual address space limited to A0–A17 |
| Max Clock Frequency | 133MHz - enables 5ns cycle time in pipelined mode for deterministic timing in real-time systems |
| Access Time (tCD2) | 4.2ns max (pipelined) - defines minimum latency from clock edge to valid data out on synchronized reads |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQL/VDDQR = 2.5V or 3.3V ±150mV (I/O) - supports mixed-voltage system interfacing |
| Operating Temperature | −40°C to +85°C - qualified for industrial embedded applications without derating |
| Power Dissipation | ISB1 = 140–190mA (standby, both ports), Izz = 5–15mA (sleep mode) - enables low-power idle states in always-on systems |
| JTAG Compliance | IEEE 1149.1 - allows in-system test and debug without external probes during production and field service |
Pinout & Package
70T3319S133BC8 is housed in a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body size. Pin assignments follow the BC256 package code per IDT documentation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Drives internal registers on rising edge; determines timing boundaries for all port operations |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs per port | Enable depth expansion without external logic: CE0X=VIL & CE1X=VIH activates port X |
| R/WL / R/WR | Read/write direction control | Asynchronous assertion sets port mode; synchronous sampling aligns with CLK edge for reliable bus handshaking |
| UBL / LBL, UBR / LBR | Upper/lower byte write enables | Allow granular 9-bit writes to I/O0–I/O8 (lower) or I/O9–I/O17 (upper) - essential for multiplexed bus compatibility |
| OPTL / OPTR | I/O voltage select input | Configures VDDQX supply level: VIH → 3.3V I/O, VIL → 2.5V I/O - enables mixed-voltage interconnect |
| ZZL / ZZR | Port-specific sleep mode input | Asserting VIH disables dynamic inputs (except JTAG), reducing current to ≤15mA while preserving state |
| INTL / INTR, COLL / COLR | Interrupt and collision flags | Open-drain outputs signal arbitration events: INTX asserts on write-to-read transition; COLX on simultaneous access to same address |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port architecture | Enables zero-cycle-latency concurrent access to identical memory locations - eliminates software arbitration overhead in multi-CPU systems |
| Selectable pipelined/flow-through output | Pipelined mode delivers 4.2ns tCD2 at 133MHz; flow-through mode provides deterministic 15ns tCYC1 - selectable per port via PL/FTL/FTR |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid chip disable by requiring two consecutive clock cycles before deactivation - improves reliability in burst-mode systems |
| Address counter with ADS/CNTEN/REPEAT | Supports auto-incrementing burst transfers: ADS loads address, CNTEN enables increment, REPEAT resets to last ADS value - reduces address bus traffic |
| JTAG boundary scan (IEEE 1149.1) | Enables full visibility into I/O pin states and internal logic during board-level test - reduces manufacturing test cost and debug time |
Applications
| Telecom Packet Buffering | Industrial PLC Data Exchange |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames between line cards and switching fabric in carrier-grade routers. IC Role / Device Role / Timing Role: Dual-port SRAM acts as asynchronous FIFO buffer - left port accepts ingress packets, right port services egress scheduler. Use Value: 4.2ns pipelined read latency and 133MHz throughput (≈4.8 Gbps) ensure line-rate processing without frame loss under sustained load. | Use Scenario: Real-time data sharing between master CPU and motion-control FPGA in CNC machine controllers. IC Role / Device Role / Timing Role: Shared memory resource enabling lock-free communication - CPU writes setpoints, FPGA reads and executes servo loops. Use Value: Collision detection flags (COLL/COLR) provide hardware-level arbitration awareness, eliminating software polling and reducing jitter below 100ns. |
| Avionics Sensor Fusion Hub | Medical Imaging Pipeline Memory |
Use Scenario: Aggregating time-stamped ADC samples from multiple inertial measurement units (IMUs) for Kalman filtering in flight control computers. IC Role / Device Role / Timing Role: Synchronous dual-port RAM buffers sensor streams - left port captures timestamped samples, right port feeds filter engine. Use Value: −40°C to +85°C operation and 2.5V core supply meet DO-254 environmental and power constraints; JTAG support enables in-flight diagnostics. | Use Scenario: Temporary storage of raw CT/MRI scan lines during real-time reconstruction in digital radiography systems. IC Role / Device Role / Timing Role: High-bandwidth memory staging buffer - left port receives parallel pixel data from ADC array, right port supplies GPU texture engine. Use Value: 256K × 18-bit capacity holds ≥128 scan lines at 16-bit depth; 1.5ns address setup ensures timing margin for 133MHz pixel clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 3.3V core (not 2.5V), 256K × 18, 133MHz, 208-pin TQFP - no JTAG, no sleep mode, higher IDD (370mA vs 260mA) | Lacks industrial temp grade and low-power sleep mode; requires 3.3V system rail instead of 2.5V core | Choose when legacy 3.3V-only design exists and JTAG/testability is not required |
| AS7C3256B-133JCIN | 256K × 16 (not 18-bit), 133MHz, 2.5V core, 208-pin BGA - no byte enables, no collision flags, no address counter | Reduced data width limits use in 18-bit bus systems; missing arbitration features increase software overhead | Choose only if 16-bit data path suffices and hardware collision detection is unnecessary |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70T3319S133BC8 uniquely combines 2.5V core efficiency, per-port voltage flexibility, hardware collision detection, and IEEE 1149.1 JTAG - making it optimal for new industrial and aerospace designs demanding low power, mixed-voltage interoperability, and testability.
Availability
70T3319S133BC8 is available at Aetrix Electronics and suitable for telecom packet buffering, industrial PLC data exchange, avionics sensor fusion, and medical imaging pipeline memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70T3319S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70T33xx family was designed specifically for high-reliability, high-bandwidth inter-processor communication and real-time buffering in telecom infrastructure, industrial automation, and defense systems - emphasizing deterministic timing, dual-port concurrency, and robust testability.
FAQ
What is the maximum operating frequency of the 70T3319S133BC8 in pipelined mode?
The 70T3319S133BC8 achieves a maximum operating frequency of 133MHz in pipelined output mode, corresponding to a 7.5ns clock cycle time (tCYC2). This is validated for industrial temperature range (−40°C to +85°C) and confirmed in the AC Electrical Characteristics table (Table 11) of the official datasheet. The 70T3319S133BC8 does not support 200MHz operation - that speed grade is restricted to commercial-grade variants in the same family.
Does the 70T3319S133BC8 support independent I/O voltage selection per port?
Yes, the 70T3319S133BC8 supports independent I/O voltage selection per port using OPTL and OPTR pins. When OPTL is set to VDD (2.5V), the left port's I/Os operate at 3.3V levels with VDDQL = 3.3V; when set to VSS (0V), they operate at 2.5V with VDDQL = 2.5V. The same applies independently to the right port via OPTR. This capability is explicitly defined in Pin Names table (page 5) and DC Operating Conditions (pages 7–8) of the datasheet.
What is the function of the ZZL and ZZR pins on the 70T3319S133BC8?
The ZZL and ZZR pins are port-specific sleep mode inputs on the 70T3319S133BC8. When asserted high (VIH), each pin disables dynamic inputs on its respective port - reducing standby current to 5–15mA - while preserving memory contents and allowing JTAG access. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain active during sleep. This behavior is documented in Notes 2 and 4 on page 5 and Table 9 (page 9) of the datasheet.
How does collision detection work on the 70T3319S133BC8?
Collision detection on the 70T3319S133BC8 is implemented via dedicated COLL and COLR output flags. A collision occurs when both ports attempt to access the same memory address simultaneously - one port writing while the other reads or both writing. The flag asserts within 4.2ns (tCOLS) and clears within 4.2ns (tCOLR) after the condition ends. This hardware arbitration signal eliminates software polling and is detailed in the Pin Names table (page 5) and AC Electrical Characteristics (Table 11, page 11).
Is the 70T3319S133BC8 pin-compatible with other members of the 70T33xx family?
No, the 70T3319S133BC8 is not fully pin-compatible with other 70T33xx variants due to address pin differences: A18L and A18R are No Connect (NC) on the 70T3319, whereas 70T3339 supports A18 and 70T3399 supports both A17 and A18. This NC assignment is explicitly noted in Footnotes 1 and 2 on pages 3 and 4 of the datasheet. While the BC256 package footprint is shared, PCB layout must account for these unused pins.
70T3319S133BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3319S133BC8 FAQ
1.How can I place an order for 70T3319S133BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3319S133BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3319S133BC8 reliable?
The price and inventory of 70T3319S133BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S133BC8 is usually 5 days.
3.What payment methods are accepted for 70T3319S133BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3319S133BC8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3319S133BC8?
70T3319S133BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3319S133BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3319S133BC8?
For technical support, including 70T3319S133BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S133BC8 requirements.
6.How does Aetrix verify that 70T3319S133BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3319S133BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S133BC8 meets industry standards.
7.What is the process for return or replacement of 70T3319S133BC8?
All 70T3319S133BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S133BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3319S133BC8 part is unused and in its original packaging.
Return procedure for 70T3319S133BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3319S133BC8 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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