Renesas 70T3319S133BFGI

Overview

70T3319S133BFGI from Integrated Device Technology is a high-speed 2.5V synchronous dual-port static RAM with 128K × 18-bit organization (2,304Kb), 133MHz operation, 4.2ns max access time, and industrial temperature support (–40°C to +85°C). It enables simultaneous read/write access on independent left/right ports in telecom switching fabric, network packet buffering, and real-time DSP co-processing.

For engineers reviewing the 70T3319S133BFGI datasheet, 70T3319S133BFGI pinout, 70T3319S133BFGI application, or 70T3319S133BFGI equivalent, key selection criteria include pipelined/flow-through output mode selection, dual-voltage I/O (2.5V/3.3V per port), JTAG IEEE 1149.1 compliance, collision/interrupt flag support, and BGA package thermal-mechanical suitability for high-density routing.

Technical Context

The 70T3319S133BFGI implements true dual-port SRAM cells with fully synchronous operation on both ports, using edge-triggered registers for address, data, and control inputs to achieve tight timing margins (1.5ns setup, 0.5ns hold). Its self-timed write architecture enables 5ns cycle time in pipelined mode at 133MHz.

Each port supports independent voltage configuration via OPTL/OPTR pins-selecting either 2.5V or 3.3V I/O levels-and includes dedicated sleep mode (ZZL/ZZR), byte-enable (UBL/LBL, UBR/LBR), and address strobe (ADSL/ADSR) logic. Collision detection and interrupt flags are generated synchronously to respective clocks, enabling deterministic inter-port coordination.

Key Specifications

Pinout & Package

70T3319S133BFGI uses a 256-ball fine-pitch BGA (BC256/BCG256) with 17mm × 17mm body and 1.0mm ball pitch. Pin mapping follows IDT's standard dual-port RAM layout with mirrored left/right signal groups, dedicated power/ground balls (VDD, VDDQ, VSS), and JTAG boundary-scan interface (TCK/TMS/TDI/TDO/TRST).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133AXC and AS7C33196B-133BIN, the 70T3319S133BFGI uniquely combines JTAG testability, per-port voltage selection, pipelined/flow-through mode flexibility, and hardware collision/interrupt signaling - making it optimal for high-reliability, high-bandwidth, and feature-rich embedded systems.

Availability

70T3319S133BFGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70T3319S133BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T33xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in packet-switched networks, real-time signal processing, and fault-tolerant control systems - emphasizing deterministic timing, mixed-voltage interoperability, and JTAG-enabled testability.

FAQ

What is the maximum operating frequency and access time specification for the 70T3319S133BFGI?

The 70T3319S133BFGI is rated for 133MHz operation with a maximum access time of 4.2ns in flow-through mode. This specification applies across the full industrial temperature range (–40°C to +85°C) and is validated under VDD = 2.5V ±100mV. The device achieves this performance using synchronous edge-triggered registers and self-timed write architecture.

Does the 70T3319S133BFGI support mixed-voltage operation between its two ports?

Yes, the 70T3319S133BFGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while setting OPTR to VSS configures the right port for 2.5V I/O levels (requiring VDDQR = 2.5V). This enables seamless interfacing with heterogeneous logic families without external level shifters.

How does the collision detection feature work on the 70T3319S133BFGI?

The 70T3319S133BFGI asserts COLL or COLR outputs when both ports simultaneously attempt read or write access to the same memory address. Detection is synchronous to the respective port's clock, with set/reset times of 4.2ns max. The flag remains asserted until the conflicting access completes, enabling external arbitration logic to resolve contention before next cycle.

What package type and dimensions does the 70T3319S133BFGI use?

The 70T3319S133BFGI uses a 256-ball fine-pitch BGA package (BC256/BCG256) with 17mm × 17mm body size and 1.0mm ball pitch. The package includes dedicated power/ground balls distributed across the array and a thermal pad compatible with standard PCB reflow profiles. Pinout matches IDT's 256-pin dual-port RAM standard.

Is JTAG boundary-scan supported on the 70T3319S133BFGI, and what standards does it comply with?

Yes, the 70T3319S133BFGI includes full IEEE 1149.1-compliant JTAG boundary-scan functionality with TCK, TMS, TDI, TDO, and TRST pins. It supports instruction register scan, data register scan, and EXTEST/INTEST operations. Boundary-scan operates independently of normal memory function and remains active even in sleep mode (ZZ asserted), enabling in-system test and debug throughout product lifecycle.