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Renesas 70T3319S133BFGI8

Part No.:
70T3319S133BFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3319S133BFGI8.pdf
Description:
IC SRAM 4.5MBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,366

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Product details

Overview

70T3319S133BFGI8 from Integrated Device Technology is a high-speed 2.5V synchronous dual-port static RAM with 128K × 18-bit organization, 4.2ns max access time at 133MHz, industrial temperature range (−40°C to +85°C), and selectable 2.5V/3.3V I/O interface per port. It enables simultaneous read/write access on independent left/right ports in telecom packet buffers and real-time DSP co-processing systems.

For engineers reviewing the 70T3319S133BFGI8 datasheet, 70T3319S133BFGI8 pinout, 70T3319S133BFGI8 application, or 70T3319S133BFGI8 equivalent, key selection criteria include pipelined vs. flow-through output mode timing, dual chip enable depth expansion support, JTAG-compliant boundary scan, collision/interrupt flag handling, and VDDQ voltage configuration per port.

Technical Context

The 70T3319S133BFGI8 implements true dual-port SRAM cells with fully synchronous operation on both ports, supporting independent clock domains and asynchronous OE/ZZ control. Its self-timed write architecture achieves 5ns cycle time at 200MHz (commercial grade) and 7.5ns at 133MHz (industrial grade).

It features dual-cycle deselect (DCD) for pipelined output mode, address counter with ADS/CNTEN/REPEAT control, and independent OPTL/OPTR pins enabling mixed-voltage operation-e.g., left port at 3.3V I/O (VDDQL = 3.3V, OPTL = VDD) and right port at 2.5V I/O (VDDQR = 2.5V, OPTR = VSS).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Size128K × 18-bit (2,304Kb total); supports 128K-word addressing with A0–A16 active; A17/A18 are NC per datasheet note 1
Max Access Time4.2ns (max) at 133MHz - defines minimum clock-to-data-out delay in flow-through mode for real-time data path alignment
Operating VoltageVDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port - enables mixed-signal SoC interfacing without level shifters
Temperature RangeIndustrial: −40°C to +85°C - qualified for base station, industrial control, and avionics applications requiring extended thermal stability
Cycle Time7.5ns (min) in pipelined mode - enables 133MHz continuous burst reads/writes with 1-cycle latency for deterministic throughput
JTAG SupportIEEE 1149.1 compliant (TCK, TMS, TDI, TDO, TRST) - allows in-system test and debug without halting memory operation
Power ModesFull standby (ISB3 ≤15mA), partial standby (ISB2 ≤250mA), and sleep mode (Izz ≤15mA) - reduces dynamic power in idle cycles while preserving state

Pinout & Package

70T3319S133BFGI8 is packaged in a 256-pin Ball Grid Array (BGA) with 1.0mm ball pitch and 17mm × 17mm body size (package code BFGI). All VDD pins require 2.5V; VDDQL/VDDQR must match OPTL/OPTR logic levels per port.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputIndependent rising-edge-triggered clocks enable asynchronous port operation; critical for inter-processor handshake timing
CE0L/CE1L, CE0R/CE1RDual chip enable inputs per portAllows depth expansion without external logic; CE0=VIL & CE1=VIH enables port, CE0=VIH disables regardless of CE1
PL/FTL / PL/FTRPipeline/Flow-Through mode selectVIH = pipelined (1-cycle latency, tCD2=4.2ns), VIL = flow-through (0-cycle latency, tCD1=15ns); configures timing model per port
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables burst addressing without external address generation logic
INTL / INTR, COLL / COLRInterrupt and collision detection flagsOpen-drain outputs signal concurrent access to same location; used for arbitration in multi-master systems
OPTL / OPTRI/O voltage option controlVDD = 2.5V → 3.3V I/O mode (VDDQX = 3.3V); VSS = 0V → 2.5V I/O mode (VDDQX = 2.5V); sets VIH/VIL thresholds per port
ZZL / ZZRSleep mode enableVIH disables dynamic inputs (except JTAG), reducing current to ≤15mA; static inputs (PL/FT, OPT) remain functional during sleep

Key Features

FeatureDesign Value
True Dual-Port ArchitectureSimultaneous independent read/write to identical memory locations on left/right ports - eliminates arbitration logic in FPGA-DSP bridging
Selectable Output ModePipelined (1-cycle latency, 133MHz) or flow-through (0-cycle latency, lower frequency) - configurable per port to match system timing budget
Dual Chip Enable LogicCE0/CE1 pair per port enables seamless depth expansion up to 512K×18 using multiple devices - no glue logic required
Address Counter with RepeatADS loads address; CNTEN increments; REPEAT resets to last ADS value - replaces external counter in sequential buffer applications
JTAG Boundary ScanIEEE 1149.1 compliance with TAP controller - enables production test and in-field diagnostics without interrupting memory operation

Applications

Telecom Packet BufferDSP Co-Processor Interface

Use Scenario: Storing incoming/outgoing Ethernet frames in a line card where ingress and egress paths operate independently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC and switch fabric ASICs, with left port handling ingress and right port egress.

Use Value: 4.2ns access time and pipelined mode enable full 133MHz throughput across both ports, eliminating frame loss during burst traffic.

Use Scenario: Real-time audio processing where DSP writes coefficients while host processor reads results in parallel.

IC Role / Device Role / Timing Role: Memory serves as synchronized data exchange point between host CPU and fixed-function DSP, with independent clock domains.

Use Value: Collision detection flags (COLL/COLR) provide hardware-level arbitration, preventing data corruption during concurrent access.

Industrial Motion ControllerRadar Signal Processing Buffer

Use Scenario: Storing position setpoints and encoder feedback in CNC systems requiring deterministic jitter-free updates.

IC Role / Device Role / Timing Role: Left port accepts motion profile commands from PLC; right port streams real-time encoder data to safety monitor.

Use Value: Industrial temperature rating (−40°C to +85°C) and 2.5V core ensure stable operation in uncooled control cabinets.

Use Scenario: Holding intermediate FFT results in phased-array radar where ADC samples stream in while DSP reads prior blocks.

IC Role / Device Role / Timing Role: Acts as ping-pong buffer between high-speed ADC interface (left port) and DSP compute engine (right port).

Use Value: Dual-cycle deselect (DCD) in pipelined mode ensures glitch-free switching between buffer halves at 133MHz sustained rate.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC128K × 18, 3.3V core, 133MHz, 4.5ns access, 208-pin TQFP - lacks JTAG, no sleep mode, single VDDQ supplyRequires external level shifting for 2.5V SoCs; no per-port I/O voltage selection; higher static current (ISB1 = 230mA)Choose when board space permits TQFP and JTAG/test capability is not required.
AS7C3128B-133BIN128K × 18, 3.3V core, 133MHz, 4.5ns access, 256-pin BGA - no pipelined mode, no address counter, no collision flagsSupports only flow-through timing; no hardware arbitration signals; limited power management (no ZZ sleep pin)Choose for cost-sensitive designs where burst addressing and collision detection are unnecessary.

Compared with CY7C1362BV33-133AXC and AS7C3128B-133BIN, the 70T3319S133BFGI8 provides per-port I/O voltage flexibility, JTAG testability, and hardware collision arbitration - critical for mixed-voltage, safety-critical, or high-assurance embedded systems.

Availability

70T3319S133BFGI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, radar signal processing, and real-time DSP co-processing applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70T3319S133BFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T33xx family was designed for high-bandwidth, low-latency dual-port memory applications in networking equipment, test instrumentation, and real-time embedded systems demanding deterministic timing and robust signal integrity.

FAQ

What is the maximum operating frequency of the 70T3319S133BFGI8 in pipelined mode?

The 70T3319S133BFGI8 supports up to 133MHz in pipelined mode (tCYC2 = 7.5ns min) under industrial temperature conditions (−40°C to +85°C). This is confirmed in Table 11 of the datasheet for the S133 speed grade. The device achieves 4.2ns clock-to-data-out (tCD2) in this mode, enabling deterministic burst transfers without wait states.

Does the 70T3319S133BFGI8 support mixed-voltage operation between its two ports?

Yes, the 70T3319S133BFGI8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O (VDDQL = 3.3V), while OPTR = VSS (0V) configures the right port for 2.5V I/O (VDDQR = 2.5V). This is explicitly defined in Pin Names table note 2 and DC Operating Conditions tables.

How does the address counter function in the 70T3319S133BFGI8?

The address counter in the 70T3319S133BFGI8 uses ADSx to load an initial address, CNTENx to increment on each clock edge, and REPEATx to reset to the last ADS-loaded address. As shown in Truth Table II, CNTEN = VIL enables auto-increment; REPEAT = VIH reloads the stored address. This eliminates need for external address generation in sequential buffer applications.

What is the purpose of the ZZL and ZZR pins on the 70T3319S133BFGI8?

The ZZL and ZZR pins are independent sleep mode enables that shut down dynamic inputs (except JTAG) when asserted high, reducing current to ≤15mA (Izz). Static inputs like PL/FTx and OPTx remain functional. Sleep mode recovery requires three clock cycles (tZZRC = 3 cycles), and the feature is validated in Table 9 for ISB3 and Izz parameters.

Can the 70T3319S133BFGI8 be used in depth-expanded configurations without additional logic?

Yes, the 70T3319S133BFGI8 supports depth expansion using dual chip enables (CE0/CE1 per port). When CE0 = VIL and CE1 = VIH, the port is enabled; if CE0 = VIH, the port is disabled regardless of CE1. This allows stacking multiple devices for larger memory maps without external decoding logic, as confirmed in the Features section and Truth Table I.

70T3319S133BFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T3319S133BFGI8 FAQ

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Please submit a Request for Quotation (RFQ) for 70T3319S133BFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 70T3319S133BFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S133BFGI8 is usually 5 days.

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70T3319S133BFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3319S133BFGI8?

For technical support, including 70T3319S133BFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S133BFGI8 requirements.

6.How does Aetrix verify that 70T3319S133BFGI8 is sourced from the original manufacturer or authorized distributors?

All 70T3319S133BFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S133BFGI8 meets industry standards.

7.What is the process for return or replacement of 70T3319S133BFGI8?

All 70T3319S133BFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S133BFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3319S133BFGI8 part is unused and in its original packaging.

Return procedure for 70T3319S133BFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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