Renesas 70T3319S133BFI

Overview

70T3319S133BFI from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and delivers 4.2ns max clock-to-data-out in flow-through mode - ideal for real-time packet buffering in telecom line cards and FPGA co-processor interconnects.

For engineers reviewing the 70T3319S133BFI datasheet, 70T3319S133BFI pinout, 70T3319S133BFI application, or 70T3319S133BFI equivalent, key selection criteria include industrial temperature support (−40°C to +85°C), JTAG IEEE 1149.1 compliance, pipelined/flow-through output mode selection, dual chip enable for depth expansion, and collision/interrupt flag generation for arbitration-critical systems.

Technical Context

The 70T3319S133BFI implements fully synchronous operation on both ports with registered address, data, and control inputs - achieving 1.5ns setup and 0.5ns hold times at 200MHz. Its self-timed write architecture enables fast cycle time without external timing constraints.

Each port features independent OPT pins to configure I/O voltage (2.5V or 3.3V), separate byte enables (UBL/LBL, UBR/LBR), and dedicated pipeline/flow-through mode control (PL/FTL, PL/FTR). Collision detection logic monitors simultaneous access to identical addresses and asserts COLL/INTR flags within 4.2ns.

Key Specifications

Pinout & Package

70T3319S133BFI is packaged in a 256-pin Ball Grid Array (BGA) with 1.0 mm ball pitch and 17 mm × 17 mm body size. Pin assignments are defined for left (L) and right (R) ports with dedicated clocks, address/data buses, control signals, and power/ground balls distributed across the array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZI and AS7C3256B-133BIN, the 70T3319S133BFI uniquely combines industrial temperature support, dual-voltage I/O flexibility, hardware collision detection, and IEEE 1149.1 JTAG - making it optimal for safety-critical, mixed-voltage, and debug-intensive embedded systems.

Availability

70T3319S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and FPGA-accelerated computing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3319S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T33xx family was designed specifically for high-bandwidth, low-latency inter-processor and protocol bridging applications - emphasizing deterministic timing, dual-port concurrency, and robust system-level debug capabilities.

FAQ

What is the maximum operating frequency of the 70T3319S133BFI under industrial temperature conditions?

The 70T3319S133BFI is rated for 133MHz operation across the full industrial temperature range of −40°C to +85°C, with guaranteed 7.5ns clock cycle time (tCYC2) and 4.2ns max clock-to-data-out (tCD2) in pipelined mode. This specification is validated per datasheet table 11 and applies to both left and right ports independently.

Does the 70T3319S133BFI support mixed-voltage operation between its left and right ports?

Yes, the 70T3319S133BFI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V, while setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V - enabling seamless integration into heterogeneous voltage systems without level shifters.

How does the collision detection feature work in the 70T3319S133BFI?

The 70T3319S133BFI monitors address comparisons between left and right ports in real time. When both ports access the same memory location simultaneously, the internal collision logic asserts COLL and COLR flags within 4.2ns (tCOLS), and holds them until the conflict ends. These open-drain outputs can drive external arbitration logic or generate interrupts to halt conflicting operations - preventing data corruption in shared-memory architectures.

What package type and pin count does the 70T3319S133BFI use?

The 70T3319S133BFI uses a 256-pin Ball Grid Array (BGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body dimensions (package code BC256). All VDD, VDDQ, and VSS balls are distributed across the array per datasheet drawing 02d, and pin A18L/A18R are No Connects as specified in note 1.

Can the 70T3319S133BFI operate in flow-through mode, and what is its access time in that mode?

Yes, the 70T3319S133BFI supports flow-through output mode when PL/FTL and PL/FTR are driven low (VIL). In this mode, the device achieves a maximum clock-to-data-out time of 15ns (tCD1) at 133MHz, with 25ns minimum clock cycle time (tCYC1). Flow-through mode eliminates pipeline latency, making it suitable for applications requiring immediate data visibility after clock assertion.