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Renesas 70T3319S166BC

Part No.:
70T3319S166BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3319S166BC.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,630

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Product details

Overview

70T3319S166BC from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location, 3.4 ns clock-to-data-out (pipelined), 166 MHz operation, and selectable 2.5V/3.3V I/O interface per port - deployed in high-bandwidth packet buffering for telecom line cards.

For engineers reviewing the 70T3319S166BC datasheet, 70T3319S166BC pinout, 70T3319S166BC application, or 70T3319S166BC equivalent, key selection criteria include pipelined vs. flow-through output mode timing, independent port voltage configuration via OPT pins, collision/interrupt flag behavior, JTAG 1149.1 compliance, and BGA package thermal-mechanical constraints for high-density routing.

Technical Context

This device implements fully synchronous dual-port SRAM logic with separate address, data, and control registers on each port, supporting concurrent access with minimal setup/hold requirements (1.5 ns setup, 0.5 ns hold). It features dual chip enables (CE0/CE1) for depth expansion without external logic and supports both pipelined (5 ns cycle, tCD2 = 3.6 ns) and flow-through (20 ns cycle, tCD1 = 12 ns) output modes selected per port via PL/FT pins.

The memory includes integrated address counter with ADS strobe, CNTEN enable, and REPEAT reset functionality - enabling burst-mode sequential addressing without external counters. Collision detection and interrupt flags (COLL/INTR) are generated synchronously to CLK and provide deterministic latency (tCOLS = 3.6 ns, tINS = 7 ns) for arbitration in shared-memory systems.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256K × 18 bits (4.5 Mbit total); supports 256K-word depth with 18-bit parallel I/O per port.
Max Clock Frequency166 MHz (6 ns tCYC2 min, pipelined mode); validated for commercial & industrial temperature range (–40°C to +85°C).
Access Time3.6 ns clock-to-data-out (tCD2) in pipelined mode; enables sub-6 ns system-level read cycles in pipeline-optimized designs.
I/O Voltage SupportSelectable 2.5V or 3.3V per port via OPTL/OPTR pins; VDDQ must match selected level (2.4–2.6V or 3.15–3.45V).
Core Supply2.5V ±100 mV (VDD); independent of I/O voltage - allows mixed-voltage system integration with core logic at 2.5V.
Power Consumption320 mA typical dynamic current (IDD) at 166 MHz; 5–15 mA full standby (ISB3) with CMOS-level CE asserts.
Package256-pin BGA (BC256), 17 mm × 17 mm, 1.0 mm ball pitch; NC on A17L/A18L confirms 256K configuration.

Pinout & Package

70T3319S166BC is housed in a 256-pin Ball Grid Array (BC256) package measuring 17 mm × 17 mm × 1.4 mm with 1.0 mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must be supplied at either 2.5V or 3.3V depending on OPT pin state per port. A17L and A18L are no-connects, confirming the 256K × 18 organization (18 address bits: A0–A16).

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputRising-edge triggered; all inputs registered on this edge - defines timing reference for setup/hold and data validity windows.
PL/FTL / PL/FTRPipeline/Flow-through mode selectVIH = pipelined (1-cycle latency, tCD2 = 3.6 ns); VIL = flow-through (0-cycle latency, tCD1 = 12 ns); DC-stable during operation.
OPTL / OPTRI/O voltage option controlVDD = 3.3V I/O mode (VDDQ = 3.3V); VSS = 2.5V I/O mode (VDDQ = 2.5V); sets VIH/VIL thresholds for associated port.
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables burst-mode sequential access without external address generation logic.
COLL / COLRCollision detection flag outputActive-high pulse (tCOLS = 3.6 ns) when both ports attempt write to same location - used for arbitration in multi-master systems.
INTL / INTRInterrupt flag outputAsserted on completion of write or counter overflow; provides hardware notification without polling - reduces CPU overhead in real-time buffers.
ZZL / ZZRSleep mode enable inputVIH places port into ultra-low-power sleep (Izz = 5–15 mA); JTAG remains active - enables dynamic power gating per port.

Key Features

FeatureDesign Value
True dual-port memory cellsEnables simultaneous independent read/write to identical addresses - eliminates arbitration logic in FPGA-to-ASIC bridging or DMA coherency paths.
Dual-cycle deselect (DCD)Allows pipelined output mode with guaranteed 2-cycle deassertion of CE - prevents bus contention during rapid port switching in burst-transfer protocols.
Separate byte controls (UBL/LBL, UBR/LBR)Permits partial-word writes (9-bit upper/lower bytes) without read-modify-write - critical for header/payload separation in packet processing engines.
JTAG IEEE 1149.1 supportEnables boundary-scan testing and in-system programming without dedicated test pads - reduces PCB test cost and improves manufacturing yield.
Self-timed write architectureRemoves external write-pulse timing constraints - simplifies controller design and improves timing margin in high-speed SerDes interfacing.

Applications

Telecom Packet BufferingFPGA-ASIC Coherency Bridge

Use Scenario: Line card buffers incoming/outgoing Ethernet or SONET frames before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress traffic managers running at independent clocks.

Use Value: 166 MHz pipelined throughput (14 Gbps bandwidth) sustains full-duplex 10G line rates; collision flags prevent data corruption during concurrent header updates.

Use Scenario: Synchronizing data transfers between Xilinx FPGA fabric and ASIC-based signal processor in radar subsystems.

IC Role / Device Role / Timing Role: Provides asynchronous clock domain crossing with deterministic latency (tCO = 4–6 ns port-to-port offset) and interrupt-driven handshaking.

Use Value: Independent 2.5V/3.3V I/O per port matches FPGA bank voltage and ASIC IO standard; JTAG enables field-upgradable buffer configuration.

Industrial Motion ControllerMedical Imaging Data Pipeline

Use Scenario: Storing interpolated position trajectories and servo command queues in CNC machine controllers.

IC Role / Device Role / Timing Role: Dual-port RAM serves as real-time command FIFO between motion planning CPU and high-frequency PWM generator.

Use Value: Address counter with ADS/CNTEN/REPEAT enables auto-incremented burst writes without CPU intervention - freeing CPU for path computation.

Use Scenario: Temporary storage of reconstructed CT/MRI slices during parallel beamforming and display preprocessing.

IC Role / Device Role / Timing Role: Acts as frame buffer between ADC acquisition engine (left port) and GPU rendering pipeline (right port).

Use Value: Industrial-grade –40°C to +85°C operation ensures reliability in uncooled medical enclosures; low 5 mA sleep current extends battery runtime in portable units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-166AXC166 MHz, 256K × 18, 3.3V core/I/O; no OPT pin flexibility - fixed 3.3V interface; lacks JTAG and collision detection.Requires external level-shifting for 2.5V logic domains; no hardware arbitration signals - software-managed collision avoidance needed.Choose when 3.3V-only system simplifies power design and JTAG/test capability is not required.
AS7C3256B-166JCIN166 MHz, 256K × 18, 3.3V core/I/O; no pipelined mode - flow-through only (tCD1 = 15 ns); no address counter or REPEAT function.Higher read latency limits throughput in burst-oriented protocols; no burst-addressing capability - external counter logic required.Choose when cost sensitivity outweighs pipelined performance and burst addressing is unnecessary.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70T3319S166BC delivers unique value through per-port voltage configurability, hardware collision detection, JTAG testability, and integrated address counter - reducing BOM count and firmware complexity in high-reliability embedded systems.

Availability

70T3319S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3319S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T33xx family was designed specifically for high-throughput, low-latency shared-memory applications in networking equipment and real-time control systems - emphasizing deterministic timing, dual-port concurrency, and robust signal integrity at 166+ MHz.

FAQ

What is the maximum operating frequency of the 70T3319S166BC in pipelined mode?

The 70T3319S166BC supports up to 166 MHz in pipelined output mode (tCYC2 = 6 ns minimum), with verified 3.6 ns clock-to-data-out (tCD2) timing across commercial and industrial temperature ranges. This frequency is achievable using the BC256 BGA package; the BF208 fpBGA variant does not support 200 MHz or 166 MHz in industrial grade per datasheet note 7.

How does the OPT pin affect I/O voltage levels on the 70T3319S166BC?

The OPTL and OPTR pins independently configure each port's I/O voltage standard: when pulled to VDD (2.5V), the associated port operates at 3.3V logic levels (VIH = 2.0 V min, VDDQ = 3.3V); when pulled to VSS (0V), it operates at 2.5V levels (VIH = 1.7 V min, VDDQ = 2.5V). This enables mixed-voltage system integration without level shifters.

Does the 70T3319S166BC support hardware collision detection, and how is it implemented?

Yes, the 70T3319S166BC provides dedicated COLL and COLR outputs that assert within 3.6 ns (tCOLS) when both ports simultaneously write to the same memory location. The flag remains asserted until cleared by subsequent non-colliding accesses - enabling immediate hardware arbitration without software polling or additional logic.

What is the purpose of the ADS, CNTEN, and REPEAT signals on the 70T3319S166BC?

ADSL/ADSR latches the current address into an internal counter; CNTENL/CNTENR enables automatic address increment on each clock; REPEATL/REPEATR resets the counter to the last ADS-loaded address. Together, they enable burst-mode sequential memory access without external address generation - reducing controller overhead in packet buffering and video frame handling.

Can the 70T3319S166BC operate in sleep mode while maintaining JTAG functionality?

Yes, asserting ZZL or ZZR places the corresponding port into ultra-low-power sleep mode (Izz = 5–15 mA), but JTAG signals (TCK, TMS, TDI, TDO, TRST) remain fully functional and unaffected. The datasheet explicitly recommends avoiding boundary scan during sleep mode, but the TAP controller remains accessible for debug and programming.

70T3319S166BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3319S166BC FAQ

1.How can I place an order for 70T3319S166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3319S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3319S166BC reliable?

The price and inventory of 70T3319S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S166BC is usually 5 days.

3.What payment methods are accepted for 70T3319S166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3319S166BC transactions.

Note: Certain payment methods may incur a processing fee.

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70T3319S166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3319S166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3319S166BC?

For technical support, including 70T3319S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S166BC requirements.

6.How does Aetrix verify that 70T3319S166BC is sourced from the original manufacturer or authorized distributors?

All 70T3319S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S166BC meets industry standards.

7.What is the process for return or replacement of 70T3319S166BC?

All 70T3319S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3319S166BC part is unused and in its original packaging.

Return procedure for 70T3319S166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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