Renesas 70T3319S166BF8
- Part No.:
- 70T3319S166BF8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3319S166BF8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,504
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Product details
Overview
70T3319S166BF8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 256K × 18-bit organization (4.6 Mbit), 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and operates at 166MHz (6.0ns cycle time) across commercial and industrial temperature ranges (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards and FPGA co-processor data exchange.
For engineers reviewing the 70T3319S166BF8 datasheet, 70T3319S166BF8 pinout, 70T3319S166BF8 application, or 70T3319S166BF8 equivalent, key selection criteria include simultaneous dual-port access latency, voltage-flexible I/O compatibility, JTAG IEEE 1149.1 support, sleep-mode current (≤15mA), and BGA package footprint constraints for high-density PCB layouts.
Technical Context
This device implements true dual-port SRAM architecture with independent left/right address, data, and control buses-enabling concurrent read/write to the same memory location without arbitration logic. Each port includes dedicated clock, chip enable (CE0/CE1), byte enables (UB/LB), and pipeline/flow-through mode selection (PL/FT).
It integrates address strobe (ADS), counter enable (CNTEN), and repeat logic for burst addressing, plus interrupt (INT) and collision detection (COL) flags for inter-port synchronization. The 256-pin BGA package supports VDD = 2.5V ±100mV and VDDQ = 2.5V or 3.3V per port, controlled by OPT pins and corresponding VDDQ supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18-bit (4.6 Mbit); A18 is NC - actual address range is A0–A17 |
| Max Clock Frequency | 166MHz - enables 6.0ns cycle time in pipelined mode for deterministic timing |
| Access Time | 3.6ns (max) - clock-to-data-out delay in pipelined mode at 166MHz |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV (I/O per port) |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems |
| Power Consumption | ISB1 = 230mA max (standby, both ports active); Izz = 15mA max (sleep mode) |
| JTAG Compliance | IEEE 1149.1 - enables boundary-scan testing without external test fixtures |
Pinout & Package
70T3319S166BF8 is housed in a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require 2.5V; VDDQ pins must match OPT pin state (2.5V if OPT = VSS, 3.3V if OPT = VDD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for left/right port operations |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A18 is No Connect per datasheet Note 1 |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data I/O | 18-bit data path per port; byte-enabled via UBL/UBR and LBL/LBR |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable/disable port independently; allow depth expansion without external logic |
| PL/FTL / PL/FTR | Output mode select | VIH = pipelined (1-cycle latency); VIL = flow-through (0-cycle latency) |
| ZZL / ZZR | Sleep mode control | Assert high to disable dynamic inputs (except JTAG) and reduce current to ≤15mA |
| OPTL / OPTR | I/O voltage option | Select 2.5V or 3.3V I/O levels per port; sets required VDDQ supply voltage |
| INTL / INTR / COLL / COLR | Inter-port status flags | Indicate interrupt assertion or simultaneous access collision between ports |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to identical addresses on left and right ports without arbitration overhead |
| Selectable pipelined or flow-through output | Reduces system latency variability: pipelined for predictable timing, flow-through for minimal latency |
| Dual chip enables (CE0/CE1) | Supports seamless memory depth expansion using multiple devices without additional decode logic |
| Address counter with ADS/CNTEN/REPEAT | Automates sequential burst access; REPEAT reloads last ADS address for circular buffer implementation |
| Interrupt and collision detection flags | Provides hardware signaling for inter-port coordination in real-time multi-processor systems |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Interface |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line-card ASICs where ingress and egress paths operate concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency shared buffer between MAC and PHY layers. Use Value: Eliminates FIFO handshaking delays; 166MHz operation sustains >5.9 Gbps aggregate bandwidth (18-bit × 166MHz × 2 ports). | Use Scenario: High-speed data exchange between FPGA fabric and external DSP or microcontroller subsystems. IC Role / Device Role / Timing Role: Synchronous memory bridge enabling parallel instruction/data transfer without CPU intervention. Use Value: Pipelined mode ensures deterministic 3.6ns read latency; dual CE allows FPGA to manage memory partitioning dynamically. |
| Real-Time Industrial Control | Test Equipment Data Capture |
Use Scenario: Storing sensor acquisition buffers and control command queues in PLC modules requiring deterministic response under jitter. IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by ARM Cortex-M7 real-time core and safety monitor MCU. Use Value: Collision detection flags trigger immediate fault handling; –40°C to +85°C rating ensures reliability in uncontrolled enclosures. | Use Scenario: Capturing high-speed analog waveform samples from ADCs and feeding them to analysis engines in automated test systems. IC Role / Device Role / Timing Role: Dual-port buffer decoupling sampling clock domain from processing clock domain. Use Value: Flow-through mode minimizes write-to-read turnaround; JTAG support enables in-system verification of memory integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-167BZXI | 256K × 18, 167MHz max, 3.3V core/I/O, 208-pin TQFP - no VDD/VDDQ separation or sleep mode | Requires 3.3V-only board design; lacks industrial temp support and low-power sleep capability | Choose when legacy 3.3V-only systems need drop-in replacement without voltage flexibility |
| AS7C3256B-15JIN | 256K × 16, 15ns async access, 3.3V only, 44-pin SOJ - asynchronous, not synchronous dual-port | No clock domain isolation; no pipelined mode or JTAG; unsuitable for high-speed deterministic interfaces | Choose only for cost-sensitive, non-timing-critical buffering where synchronous operation is unnecessary |
Compared with CY7C1362BV33-167BZXI and AS7C3256B-15JIN, the 70T3319S166BF8 provides voltage-flexible I/O, industrial temperature support, JTAG testability, and sub-4ns pipelined access-making it uniquely suited for new designs requiring mixed-voltage interoperability and deterministic real-time performance.
Availability
70T3319S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, FPGA-based prototyping, and automated test equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for 70T3319S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.
The 70T33xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in networking ASICs, FPGA co-processing, and real-time control systems requiring simultaneous read/write capability.
FAQ
What is the maximum operating frequency of the 70T3319S166BF8?
The 70T3319S166BF8 is rated for 166MHz operation in both commercial and industrial temperature ranges. Its pipelined mode achieves a 6.0ns clock cycle time, while flow-through mode supports up to 200MHz in commercial grade-but the S166 speed grade (166MHz) is the maximum validated for this specific part number across full temperature range.
Does the 70T3319S166BF8 support independent voltage selection for each port's I/O interface?
Yes, the 70T3319S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTL = VSS (0V) configures it for 2.5V I/O with VDDQL = 2.5V. The same applies independently to the right port.
What is the function of the ADS, CNTEN, and REPEAT pins on the 70T3319S166BF8?
ADS (Address Strobe) loads the current address into the internal counter; CNTEN (Counter Enable) activates automatic address increment on each clock; REPEAT resets the counter to the last valid ADS-loaded address. Together, they enable efficient burst and circular buffer operations without external address generation logic in the 70T3319S166BF8.
How does collision detection work between ports in the 70T3319S166BF8?
The 70T3319S166BF8 asserts COLL (left port) or COLR (right port) when both ports attempt simultaneous access to the same memory location. This signal is synchronous to the accessing port's clock and remains asserted until the conflicting access completes. It enables hardware-level arbitration or fault logging in real-time systems using the 70T3319S166BF8.
Is the 70T3319S166BF8 compatible with JTAG boundary-scan testing?
Yes, the 70T3319S166BF8 fully supports IEEE 1149.1 JTAG boundary-scan functionality via dedicated TDI, TDO, TCK, TMS, and TRST pins. JTAG remains operational even during sleep mode (ZZ asserted), enabling in-system test and debug without disrupting system power states.
70T3319S166BF8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3319S166BF8 FAQ
1.How can I place an order for 70T3319S166BF8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3319S166BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3319S166BF8 reliable?
The price and inventory of 70T3319S166BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S166BF8 is usually 5 days.
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Once your 70T3319S166BF8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3319S166BF8?
For technical support, including 70T3319S166BF8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S166BF8 requirements.
6.How does Aetrix verify that 70T3319S166BF8 is sourced from the original manufacturer or authorized distributors?
All 70T3319S166BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S166BF8 meets industry standards.
7.What is the process for return or replacement of 70T3319S166BF8?
All 70T3319S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S166BF8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3319S166BF8 part is unused and in its original packaging.
Return procedure for 70T3319S166BF8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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