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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3319S166BFG

Name: 70T3319S166BFG
Brand: Renesas
SKU: 70T3319S166BFG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3319S166BFG

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3319S166BFG.pdf

Description:: IC SRAM 4.5MBIT PAR 208CABGA

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Product details

Overview

70T3319S166BFG from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (6ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes - used in high-bandwidth packet buffering for telecom line cards and FPGA co-processor interconnects.

For engineers reviewing the 70T3319S166BFG datasheet, 70T3319S166BFG pinout, 70T3319S166BFG application, or 70T3319S166BFG equivalent, key selection criteria include port-isolated voltage configuration (via OPTL/OPTR), collision detection flag timing (tCOLS ≤ 3.6ns), sleep mode current (Izz ≤ 15mA), and BGA-256 package compatibility with industrial temperature range (–40°C to +85°C).

Technical Context

This device implements fully synchronous dual-port operation on independent left/right ports, each with dedicated clock (CLKL/CLKR), address (A0L–A17L / A0R–A17R), and data (I/O0L–I/O17L / I/O0R–I/O17R) buses. All control signals - including CE0/CE1, R/W, OE, UB/LB, ADS, CNTEN, and REPEAT - are registered on the rising edge of their respective port clocks.

It integrates JTAG boundary-scan (IEEE 1149.1 compliant), interrupt/collision detection logic, and dual-cycle deselect (DCD) for pipelined output mode. Address A18 is NC for this variant, confirming its 256K × 18 (4,608Kb) density - distinct from 512K×18 (70T3339) and 128K×18 (70T3399) siblings in the same family.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 18 bits (4.6 Mbit); A18 pin is No Connect, confirming 18-bit addressing up to A17.
Max Clock Frequency	166 MHz (6 ns cycle time); validated for commercial & industrial temp ranges per datasheet S166 suffix.
I/O Voltage Support	Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins; VDDQ pins must match selected level.
Access Time	3.6 ns (clock-to-data out, pipelined mode); enables sub-7ns system-level latency in burst transfers.
Operating Temperature	–40°C to +85°C (industrial grade); validated at 133/166 MHz - 200 MHz only available in commercial grade.
Power Supply	2.5 V ±100 mV core (VDD); separate VDDQ rails per port for I/O voltage flexibility.
Package	256-pin Ball Grid Array (BGA), 17 mm × 17 mm, 1.0 mm ball pitch; BC256/BCG256 code.

Pinout & Package

70T3319S166BFG is housed in a 256-pin BGA (package code BCG256), with 17 mm × 17 mm body and 1.0 mm ball pitch. Pin assignments follow standard IDT dual-port layout with mirrored left/right port signal groups, JTAG interface, and dedicated sleep (ZZL/ZZR), pipeline control (PL/FTL/PL/FTR), and address strobe (ADSL/ADSR) pins.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock input	Synchronous timing reference for all registered inputs/outputs on respective port; no internal PLL.
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A18L/A18R are NC, confirming 256K depth.
I/O0L–I/O17L / I/O0R–I/O17R	Bidirectional data bus	18-bit parallel data path; byte enables (UBL/LBL, UBR/LBR) allow partial-word writes without read-modify-write.
CE0L/CE1L / CE0R/CE1R	Chip enable pair	Dual CE architecture enables depth expansion without external logic; CE0=VIL & CE1=VIH activates port.
OPTL / OPTR	I/O voltage select	Configures per-port I/O voltage: VDD (2.5V) → 3.3V I/O; VSS (0V) → 2.5V I/O.
ZZL / ZZR	Sleep mode enable	Asserting VIH disables dynamic inputs (except JTAG), reducing current to ≤15 mA.
INTL / INTR / COLL / COLR	Status flags	Open-drain outputs signaling interrupt or simultaneous access collision between ports.

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write to identical addresses - critical for real-time data exchange between independent processors or DMA engines.
Selectable pipelined or flow-through output	Pipelined mode achieves 3.6 ns tCD2 at 166 MHz; flow-through offers deterministic 12 ns tCD1 for timing-critical control paths.
Dual-cycle deselect (DCD)	Prevents bus contention during rapid port switching by delaying deactivation across two clock cycles.
Per-port voltage configuration	OPTL/OPTR pins allow mixed-voltage interfacing - e.g., 3.3V FPGA side ↔ 2.5V ASIC side - eliminating level shifters.
JTAG boundary-scan support	IEEE 1149.1 compliance enables in-system testability and debug without physical probe access.

Applications

Telecom Packet Buffering	FPGA-CPU Co-Processing Interface
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between ingress and egress traffic managers. Use Value: Simultaneous access eliminates arbitration delay; 3.6 ns pipelined read enables <7 ns round-trip data transfer between ports.	Use Scenario: High-throughput data staging between Xilinx Kintex FPGA and ARM Cortex-A9 processor in embedded vision systems. IC Role / Device Role / Timing Role: Memory-mapped scratchpad bridging heterogeneous processing domains with independent clock domains. Use Value: Per-port voltage selection (OPTL=VSS for 2.5V FPGA I/O, OPTR=VDD for 3.3V CPU bus) avoids external level translation.
Industrial Motion Control	Test Equipment Data Acquisition
Use Scenario: Real-time coordination of multi-axis servo drives requiring synchronized position/velocity updates. IC Role / Device Role / Timing Role: Shared memory for deterministic inter-processor messaging between motion controller and safety monitor MCU. Use Value: Collision detection (COLL/COLR) flags provide hardware-enforced mutual exclusion for critical shared variables.	Use Scenario: Capturing high-speed analog samples from multiple ADCs into a unified buffer for post-processing. IC Role / Device Role / Timing Role: Dual-port SRAM serves as ping-pong buffer - one port streams data in, the other reads out to DSP. Use Value: Sleep mode (ZZL/ZZR) reduces power to ≤15 mA during idle intervals, extending thermal headroom in compact enclosures.

Telecom Packet Buffering

FPGA-CPU Co-Processing Interface

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between ingress and egress traffic managers.

Use Value: Simultaneous access eliminates arbitration delay; 3.6 ns pipelined read enables <7 ns round-trip data transfer between ports.

Use Scenario: High-throughput data staging between Xilinx Kintex FPGA and ARM Cortex-A9 processor in embedded vision systems.

IC Role / Device Role / Timing Role: Memory-mapped scratchpad bridging heterogeneous processing domains with independent clock domains.

Use Value: Per-port voltage selection (OPTL=VSS for 2.5V FPGA I/O, OPTR=VDD for 3.3V CPU bus) avoids external level translation.

Industrial Motion Control

Test Equipment Data Acquisition

Use Scenario: Real-time coordination of multi-axis servo drives requiring synchronized position/velocity updates.

IC Role / Device Role / Timing Role: Shared memory for deterministic inter-processor messaging between motion controller and safety monitor MCU.

Use Value: Collision detection (COLL/COLR) flags provide hardware-enforced mutual exclusion for critical shared variables.

Use Scenario: Capturing high-speed analog samples from multiple ADCs into a unified buffer for post-processing.

IC Role / Device Role / Timing Role: Dual-port SRAM serves as ping-pong buffer - one port streams data in, the other reads out to DSP.

Use Value: Sleep mode (ZZL/ZZR) reduces power to ≤15 mA during idle intervals, extending thermal headroom in compact enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166BZI	166 MHz, 256K × 18, 3.3V core/I/O; no per-port voltage select; 208-pin TQFP package.	Lacks OPT-driven I/O voltage flexibility; requires external level shifters for mixed-voltage systems.	Choose when board space permits TQFP and system uses uniform 3.3V logic.
AS7C3256B-166JIN	166 MHz, 256K × 18, 3.3V core/I/O; no JTAG; no collision/interrupt flags; 48-pin TSOP II package.	No hardware collision detection or sleep mode; limited debug/test capability.	Choose for cost-sensitive, non-safety-critical applications where status signaling is software-managed.

Compared with CY7C1362BV33-166BZI and AS7C3256B-166JIN, the 70T3319S166BFG uniquely delivers per-port I/O voltage selection, integrated collision detection, and IEEE 1149.1 JTAG - making it optimal for mixed-voltage, safety-aware, or high-integrity embedded systems.

Availability

70T3319S166BFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, FPGA co-processing, and test equipment applications requiring stable component supply, long-term lifecycle support, and industrial temperature qualification.

Supply support for 70T3319S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T33xx family targets high-bandwidth, low-latency inter-processor communication - specifically engineered for systems demanding simultaneous dual-port access, flexible voltage interfacing, and hardware-assisted synchronization.

FAQ

What is the maximum operating frequency of the 70T3319S166BFG?

The 70T3319S166BFG is rated for 166 MHz operation (6 ns cycle time) across both commercial and industrial temperature ranges. While the datasheet notes 200 MHz capability for the S200 variant, that speed grade is not supported in the 70T3319S166BFG - confirmed by its S166 suffix and validation in Table 9 and Table 11 for 166 MHz timing parameters.

Does the 70T3319S166BFG support independent I/O voltage levels on each port?

Yes, the 70T3319S166BFG supports independent 2.5 V or 3.3 V I/O operation per port using OPTL and OPTR pins. When OPTL = VDD (2.5 V), left-port I/Os run at 3.3 V and require VDDQL = 3.3 V; when OPTL = VSS (0 V), they run at 2.5 V with VDDQL = 2.5 V - enabling seamless interfacing with mixed-voltage SoCs or FPGAs without external level shifters.

What is the function of the ZZL and ZZR pins on the 70T3319S166BFG?

The ZZL and ZZR pins are independent sleep mode enables for the left and right ports. Asserting either pin to VIH shuts down dynamic inputs (except JTAG), reducing standby current to ≤15 mA. Static inputs (PL/FTx, OPTx, and the ZZ pins themselves) remain active, allowing wake-up via clock or control signal transitions without full reset.

How does collision detection work in the 70T3319S166BFG?

The 70T3319S166BFG asserts COLL (left port) or COLR (right port) when both ports attempt simultaneous access to the same memory location. These open-drain flags activate within 3.6 ns (tCOLS) and remain asserted until the conflicting access completes - providing hardware-level synchronization for critical shared-memory protocols without software polling overhead.

Is the 70T3319S166BFG pin-compatible with other devices in the 70T33xx family?

No - the 70T3319S166BFG is not pin-compatible with 70T3339 (512K×18) or 70T3399 (128K×18). Although all share the 256-pin BGA footprint, address pin count differs: A18 is NC for 70T3319, but functional for 70T3339; A17/A18 are both NC for 70T3399. PCB layout must match the exact density variant.

70T3319S166BFG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 4.5Mbit

Memory Organization:: 256K x 18

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3319S166BFG FAQ

1.How can I place an order for 70T3319S166BFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3319S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3319S166BFG reliable?

The price and inventory of 70T3319S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S166BFG is usually 5 days.

3.What payment methods are accepted for 70T3319S166BFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3319S166BFG transactions.

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4.How is shipping managed for 70T3319S166BFG?

70T3319S166BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3319S166BFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3319S166BFG?

For technical support, including 70T3319S166BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S166BFG requirements.

6.How does Aetrix verify that 70T3319S166BFG is sourced from the original manufacturer or authorized distributors?

All 70T3319S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S166BFG meets industry standards.

7.What is the process for return or replacement of 70T3319S166BFG?

All 70T3319S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S166BFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3319S166BFG part is unused and in its original packaging.

Return procedure for 70T3319S166BFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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