Renesas 70T3319S166BFG8

Overview

70T3319S166BFG8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port via OPT pins, and delivers 3.6ns clock-to-data-out in pipelined mode for real-time data buffering in telecom line cards and network packet processors.

For engineers reviewing the 70T3319S166BFG8 datasheet, 70T3319S166BFG8 pinout, 70T3319S166BFG8 application, or 70T3319S166BFG8 equivalent, key selection criteria include its 256K × 18 organization, BGA-256 package with verified pin mapping, industrial-grade temperature support (–40°C to +85°C), JTAG IEEE 1149.1 compliance, and dual-cycle deselect capability for pipelined output timing control.

Technical Context

The 70T3319S166BFG8 implements fully synchronous operation on both ports with register-controlled address, data, and control inputs-enabling 1.5ns setup and 0.5ns hold times at 200MHz. Its self-timed write architecture minimizes cycle time while supporting depth expansion via dual chip enables (CE0/CE1) without external logic.

It features independent port-level voltage selection: core VDD = 2.5V ±100mV, while each port's I/Os and controls operate at either 3.3V (±150mV) or 2.5V (±100mV) based on OPTL/OPTR configuration. Collision detection and interrupt flags provide real-time arbitration between concurrent port accesses.

Key Specifications

Pinout & Package

70T3319S166BFG8 is housed in a 256-pin Ball Grid Array (BGA) package measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166BZI and AS7C3256B-166JIN, the 70T3319S166BFG8 uniquely supports mixed-voltage I/O per port, integrated collision detection, and IEEE 1149.1 JTAG-making it optimal for complex, multi-rail telecom and industrial systems requiring robust arbitration and debug capability.

Availability

70T3319S166BFG8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70T3319S166BFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T33xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom line cards, network processors, and real-time control systems-emphasizing simultaneous port operation, flexible voltage scaling, and system-level debug readiness.

FAQ

What is the maximum operating frequency supported by the 70T3319S166BFG8?

The 70T3319S166BFG8 is rated for 166MHz operation (6ns cycle time) across both commercial and industrial temperature ranges. This speed grade is validated with 3.6ns clock-to-data-out in pipelined mode and meets AC timing specifications including 1.7ns address setup and 0.5ns hold times under full industrial conditions (–40°C to +85°C). The 200MHz variant (70T3319S200BFG8) exists but is not offered in this specific speed-bin and package combination.

Does the 70T3319S166BFG8 support independent voltage selection for each port?

Yes, the 70T3319S166BFG8 supports independent I/O voltage selection per port using OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O operation with VDDQL = 3.3V; setting it to VSS (0V) configures the left port for 2.5V I/O with VDDQL = 2.5V. The same applies independently to the right port via OPTR and VDDQR. Core VDD remains fixed at 2.5V ±100mV for both configurations.

How does collision detection work on the 70T3319S166BFG8?

The 70T3319S166BFG8 asserts COLL (left port) or COLR (right port) when both ports attempt to access the same memory address simultaneously. These open-drain outputs require external pull-up resistors and signal collision within 3.6ns (tCOLS) of the violating access. The flag remains asserted until the conflicting access completes, allowing host logic to implement retry or priority resolution. Collision detection is independent of read/write direction and active in both pipelined and flow-through modes.

What package type and pin count does the 70T3319S166BFG8 use?

The 70T3319S166BFG8 uses a 256-pin Ball Grid Array (BGA) package designated BFG8, with mechanical dimensions of 17mm × 17mm × 1.4mm and 1.0mm ball pitch. Pin assignments are fully documented in the IDT datasheet DSC-5652/11, including NC pins (e.g., A18L, A18R) and dedicated functions such as JTAG (TCK, TMS, TDI, TDO, TRST) and sleep mode (ZZL, ZZR). This package is distinct from the 208-pin fpBGA used in other variants like the 70T3319S166BF208.

Can the 70T3319S166BFG8 operate in sleep mode while maintaining JTAG accessibility?

Yes, the 70T3319S166BFG8 maintains full JTAG IEEE 1149.1 functionality during sleep mode. When ZZL and/or ZZR are asserted high, all dynamic inputs (address, data, control) are disabled to reduce current to ≤15mA, but JTAG pins (TCK, TMS, TDI, TDO, TRST) remain active and responsive. The datasheet explicitly recommends avoiding boundary scan operations during sleep mode, but electrical connectivity and protocol compliance are preserved-enabling debug access without exiting low-power state.