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Renesas 70T3319S200BC

Part No.:
70T3319S200BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3319S200BC.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,165

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Product details

Overview

70T3319S200BC from Integrated Device Technology is a high-speed synchronous dual-port SRAM with 256K × 18-bit organization (4.5 Mbit), 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports 200MHz operation (5ns cycle time), pipelined or flow-through output modes, and simultaneous read/write access on independent left/right ports - used in telecom line cards for real-time packet buffering and header processing.

For engineers reviewing the 70T3319S200BC datasheet, 70T3319S200BC pinout, 70T3319S200BC application, or 70T3319S200BC equivalent, key selection criteria include dual-port timing latency (3.4ns clock-to-data in pipelined mode), JTAG-compliant boundary scan support, industrial-grade voltage tolerance (±100mV on VDD), and BGA package compatibility with high-density FPGA-based control planes.

Technical Context

This device implements true dual-port memory cells with fully synchronous operation on both ports, using input registers for address, data, and control signals to achieve tight 1.5ns setup / 0.5ns hold timing margins at 200MHz. Each port features independent clock (CLKL/CLKR), chip enables (CE0/CE1), byte enables (UBL/LBL), and pipeline/flow-through mode selection (PL/FTL/R).

It integrates collision detection and interrupt flags (COLL/INTR), address counter logic with ADS/CNTEN/REPEAT controls, and dual-cycle deselect (DCD) for pipelined output mode. Power management includes TTL- or CMOS-level standby modes and dedicated sleep pins (ZZL/ZZR) that disable dynamic inputs while preserving JTAG accessibility.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18-bit (4.5 Mbit); A18 is NC - fixed depth for deterministic address decoding
Max Clock Frequency200MHz (5ns cycle time); only available in BC256 BGA package, not fpBGA
Access Time3.4ns clock-to-data out (pipelined mode); enables sub-5ns system-level data handoff in burst transfers
Supply VoltagesVDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port - supports mixed-voltage interconnects
Operating TemperatureCommercial grade only (0°C to +70°C); 200MHz speed bin not qualified for industrial range
JTAG SupportIEEE 1149.1 compliant; TCK up to 10MHz - enables in-system test and debug without external logic
Power Consumption525mA max dynamic current (both ports active); 15mA typical full standby (ISB3) - critical for thermal budgeting

Pinout & Package

70T3319S200BC is packaged in a 256-pin Ball Grid Array (BC256) with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require 2.5V; VDDQ pins must match OPT pin state (2.5V if OPT = VSS, 3.3V if OPT = VDD). NC pins include A18L and A18R.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputIndependent timing domains enable asynchronous data exchange between processor and FPGA subsystems
CE0L/CE1L, CE0R/CE1RDual chip enable per portAllows depth expansion without external logic - e.g., stacking two devices for 512K×18 with shared address bus
PL/FTL / PL/FTRPipeline/Flow-through mode selectVIH = pipelined (3.4ns tCD2), VIL = flow-through (10ns tCD1) - trade latency vs. determinism in real-time pipelines
ADSL / ADSRAddress strobe enableLatches external address on rising CLK edge; enables non-sequential burst addressing without counter dependency
INTL / INTR, COLL / COLRInterrupt and collision flagsOpen-drain outputs signal concurrent access to same location - essential for arbitration in multi-master systems
ZZL / ZZRSleep mode controlAsserting disables dynamic inputs (except JTAG), reducing current to 5–15mA - used during idle periods in power-constrained modules

Key Features

FeatureDesign Value
True dual-port architectureSimultaneous independent read/write to identical memory locations - eliminates arbitration logic in crossbar switch buffers
Selectable I/O voltage per portOPTL/OPTR pins configure each port for 2.5V or 3.3V signaling - enables direct interfacing with mixed-voltage SoCs
Dual-cycle deselect (DCD)Chip enables are double-buffered in pipelined mode - prevents metastability during rapid port switching in burst-mode controllers
Address counter with repeatCNTEN/ADSR/REPEAT logic generates sequential addresses or repeats last loaded address - simplifies DMA engine design for circular buffers
JTAG boundary scanFull IEEE 1149.1 implementation with TDI/TDO/TCK/TMS/TRST - supports production test and field diagnostics without probe access

Applications

Telecom Packet BufferingFPGA-Based Protocol Processing

Use Scenario: Storing incoming Ethernet frames in a line card before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a ping-pong buffer between MAC interface (left port) and traffic manager (right port), synchronized to independent clocks.

Use Value: 3.4ns pipelined tCD2 enables <5ns data handoff, meeting 10Gbps line-rate timing budgets without FIFO staging.

Use Scenario: Accelerating TCP/IP checksum calculation by feeding packet payloads into an FPGA arithmetic pipeline.

IC Role / Device Role / Timing Role: Left port accepts burst writes from PCIe DMA; right port streams aligned 18-bit words to FPGA logic fabric under separate clock domain.

Use Value: Independent CE0/CE1 enables depth expansion to 512K×18, supporting multi-gigabyte session tables without external glue logic.

Real-Time Signal ProcessingIndustrial Motion Control

Use Scenario: Holding sensor samples and control coefficients in a digital signal processor's feedback loop.

IC Role / Device Role / Timing Role: Left port captures ADC data at 100MHz; right port supplies filter coefficients to DSP core at 150MHz - no software arbitration required.

Use Value: Collision detection (COLL/INTR) flags trigger immediate exception handling when coefficient update overlaps sample capture.

Use Scenario: Coordinating position commands between PLC master and servo drive firmware in CNC machinery.

IC Role / Device Role / Timing Role: Acts as shared memory between safety-certified controller (left port) and real-time motion engine (right port), with ZZ sleep control during idle cycles.

Use Value: 5ns cycle time ensures deterministic 200kHz servo loop updates; ISB3 standby current (15mA typ.) extends uptime in battery-backed modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-200BZXI3.3V core; 256K × 18; 200MHz; 208-pin TQFP - no JTAG, no sleep mode, higher VDD tolerance (3.15–3.45V)Lacks pipelined mode and collision detection; suited for cost-sensitive, non-real-time buffering where board space permits TQFPChoose when JTAG testability and ultra-low-latency pipelining are not required, and PCB layout favors through-hole or larger footprint
IDT70V27L15PF8128K × 18; 15ns access; 3.3V-only I/O; 100MHz max; 128-pin PQFP - no address counter, no REPEAT, no DCDLower density and speed; lacks advanced control features; suitable for legacy designs migrating from older IDT familiesChoose only for drop-in replacement in existing 128K designs where 200MHz performance and pipelined latency are unnecessary

Compared with CY7C1362BV33-200BZXI and IDT70V27L15PF8, the 70T3319S200BC delivers 3.4ns pipelined access, per-port voltage selectability, and JTAG debug - making it uniquely suited for new high-speed, mixed-voltage, test-critical embedded systems where latency and flexibility outweigh cost or package size constraints.

Availability

70T3319S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA co-processing, real-time signal processing, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3319S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T33xx family targets high-bandwidth, low-latency data buffering in synchronous systems - specifically engineered for telecom line cards, network processors, and FPGA-based accelerators needing deterministic dual-port access and mixed-voltage interoperability.

FAQ

What is the maximum operating frequency of the 70T3319S200BC, and which package supports it?

The 70T3319S200BC is rated for 200MHz operation (5ns cycle time), and this speed grade is exclusively supported in the BC256 256-pin BGA package. The BF208 fpBGA variant is limited to 166MHz and 133MHz speed grades - attempting 200MHz in BF208 violates AC timing specifications and risks data corruption.

Does the 70T3319S200BC support independent voltage selection for each port's I/O interface?

Yes, the 70T3319S200BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V signaling (requiring VDDQL = 3.3V), while OPTL = VSS (0V) sets it to 2.5V (VDDQL = 2.5V). The same applies independently to the right port - enabling mixed-voltage system integration without level shifters.

How does the address counter function in the 70T3319S200BC, and what role does the REPEAT pin play?

The 70T3319S200BC includes an internal address counter enabled by CNTENL/CNTENR. When asserted, it auto-increments on each CLK edge regardless of CE/UB/LB states. The REPEATL/REPEATR pin resets the counter to the last valid address loaded via ADSL/ADSR - allowing precise restart of burst reads after interrupt servicing. This eliminates software overhead in circular buffer implementations.

What is the purpose of the ZZL and ZZR pins on the 70T3319S200BC, and how do they affect JTAG functionality?

The ZZL and ZZR pins place the respective port into ultra-low-power sleep mode, disabling all dynamic inputs (clock, address, data) while retaining static input functionality (PL/FT, OPT, and the ZZ pins themselves). Critically, JTAG signals (TCK, TMS, TDI, TDO, TRST) remain fully operational during sleep - enabling boundary scan testing even when memory ports are powered down.

Can the 70T3319S200BC be used in industrial temperature applications, and what speed grades are qualified?

No, the 70T3319S200BC is specified only for commercial temperature range (0°C to +70°C). While the broader 70T33xx family includes industrial-grade variants (e.g., 70T3319S133BCI), the S200 speed grade is not qualified for -40°C to +85°C operation. Using 70T3319S200BC outside its rated temperature range may cause timing violations or increased bit error rates.

70T3319S200BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3319S200BC FAQ

1.How can I place an order for 70T3319S200BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3319S200BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3319S200BC reliable?

The price and inventory of 70T3319S200BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S200BC is usually 5 days.

3.What payment methods are accepted for 70T3319S200BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3319S200BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3319S200BC?

70T3319S200BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3319S200BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3319S200BC?

For technical support, including 70T3319S200BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S200BC requirements.

6.How does Aetrix verify that 70T3319S200BC is sourced from the original manufacturer or authorized distributors?

All 70T3319S200BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S200BC meets industry standards.

7.What is the process for return or replacement of 70T3319S200BC?

All 70T3319S200BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S200BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3319S200BC part is unused and in its original packaging.

Return procedure for 70T3319S200BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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