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Renesas 70T3319S200BC8

Part No.:
70T3319S200BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3319S200BC8.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,479

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Product details

Overview

70T3319S200BC8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 200MHz (5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes - used in high-bandwidth packet buffering, FPGA co-processor memory, and real-time DSP data exchange.

For engineers reviewing the 70T3319S200BC8 datasheet, 70T3319S200BC8 pinout, 70T3319S200BC8 application, or 70T3319S200BC8 equivalent, key selection criteria include its 200MHz commercial-grade timing (3.4ns clock-to-data), dual chip enables for depth expansion, JTAG-compliant boundary scan, and independent voltage-selectable ports - critical for heterogeneous bus interfacing in telecom line cards and network processors.

Technical Context

The 70T3319S200BC8 implements fully synchronous dual-port operation with registered address, data, and control inputs on both left and right ports, achieving 1.5ns setup and 0.5ns hold times at 200MHz. Its self-timed write architecture minimizes cycle time dependency on external timing margins.

Each port supports independent I/O voltage selection (2.5V or 3.3V) via dedicated OPTL/OPTR pins, with corresponding VDDQL/VDDQR supplies. The device includes address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), repeat (REPEATL/REPEATR), and collision/interrupt flags - enabling burst-mode address sequencing and inter-port synchronization without external logic.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256K × 18 bits (4.5 Mbit total); matches 18-bit wide data paths in legacy telecom and military avionics buses.
Max Clock Frequency200MHz (5ns cycle time); enables 14Gbps aggregate bandwidth across both ports - sufficient for OC-48/STM-16 packet buffer applications.
Access Time3.4ns (clock-to-data out, pipelined mode); guarantees deterministic latency for real-time control loops in motor drives and radar processing.
I/O Voltage SupportSelectable 2.5V or 3.3V per port via OPT pins; allows direct interfacing to mixed-voltage FPGAs (e.g., Xilinx Virtex-II) without level shifters.
Operating Temperature0°C to +70°C (Commercial grade); validated for use in indoor telecom equipment and industrial PLC backplanes.
Package256-pin BGA (17mm × 17mm, 1.0mm ball pitch); compatible with standard SMT reflow profiles and automated optical inspection.
JTAG ComplianceIEEE 1149.1 compliant; enables in-system testability and boundary-scan diagnostics during board-level validation.

Pinout & Package

70T3319S200BC8 is housed in a 256-pin Ball Grid Array (BGA) package with 17mm × 17mm body size and 1.0mm ball pitch. All VDD pins require connection to 2.5V ±100mV; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR state.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputRegisters all address/data/control signals on rising edge; enables full synchronous operation with zero external timing constraints.
CE0L/CE1L, CE0R/CE1RDual chip enable inputs per portAllow depth expansion without external logic: CE0X = VIL and CE1X = VIH enables port; both high disables port.
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables burst-mode sequential access without external address generation.
PL/FTL / PL/FTRPipeline/Flow-through mode selectVDD = pipelined (3.4ns tCD2); VSS = flow-through (10ns tCD1); selects between low-latency or zero-cycle-delay output behavior.
INTL / INTR, COLL / COLRInterrupt and collision detection flagsOpen-drain outputs signal inter-port contention or user-triggered events - used for arbitration in shared-memory multi-processor systems.

Key Features

FeatureDesign Value
True dual-port memory cellsEnables concurrent read/write to identical addresses - eliminates arbitration logic in FPGA-to-ASIC bridging applications.
Separate byte controls (UBL/LBL, UBR/LBR)Permits partial-word writes (9-bit upper/lower bytes) - reduces bus traffic in protocol stack header manipulation.
Dual Cycle Deselect (DCD)Prevents metastability during rapid port disable/enable transitions - ensures reliable operation in dynamic bandwidth allocation schemes.
Self-timed writeRemoves external write pulse width constraints - simplifies timing closure in high-speed PCB layouts with trace-length mismatches.
Sleep mode (ZZL/ZZR)Reduces standby current to 5–15mA while preserving JTAG accessibility - supports low-power idle states in battery-backed communication modules.

Applications

Packet BufferingFPGA Co-Processor Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in a Layer 2 switch ASIC with separate ingress/egress pipelines.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking crossbar buffer, accepting frame data on one port while simultaneously servicing lookup results on the other.

Use Value: 200MHz operation delivers 14Gbps aggregate throughput, eliminating bottlenecks in 10GbE line-rate forwarding.

Use Scenario: Providing low-latency shared memory between a Xilinx Virtex-II FPGA and a TI C64x DSP in a software-defined radio baseband processor.

IC Role / Device Role / Timing Role: Serves as a synchronized data exchange hub with independent 2.5V/3.3V I/O rails matching each processor's interface voltage.

Use Value: Pipelined output mode achieves 3.4ns clock-to-data, enabling real-time FFT windowing with sub-cycle memory access.

Radar Signal ProcessingIndustrial Motion Control

Use Scenario: Capturing ADC samples from phased-array radar receivers and feeding them to parallel FFT engines.

IC Role / Device Role / Timing Role: Functions as a ping-pong buffer where one port streams raw IQ data while the other feeds processed bins to DMA controllers.

Use Value: Collision detection flags prevent data corruption when both processors attempt simultaneous access to shared coefficient tables.

Use Scenario: Storing position setpoints and encoder feedback in a servo drive controller coordinating multiple axes.

IC Role / Device Role / Timing Role: Provides deterministic, jitter-free memory access for real-time PID loop execution across dual-core ARM Cortex-R4 processors.

Use Value: 5ns cycle time ensures worst-case memory latency remains below 100ns - meeting SIL-3 functional safety timing budgets.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-200AXC256K × 18, 200MHz, 3.3V core/I/O; no JTAG, no sleep mode, no byte-selectable I/O voltage.Requires external level shifters for mixed-voltage systems; lacks boundary-scan testability.Choose when JTAG and flexible I/O voltage are unnecessary and cost is primary.
IDT70V27L15PF8128K × 18, 150MHz, 3.3V only; no pipelined mode, no address counter, no collision flags.Lower bandwidth and feature set; suitable only for simpler burst-buffering tasks.Choose only if memory density and speed requirements are reduced by ≥50% and advanced control features are unused.

Compared with CY7C1362BV33-200AXC and IDT70V27L15PF8, the 70T3319S200BC8 uniquely supports per-port I/O voltage selection, IEEE 1149.1 JTAG, and pipelined/flow-through dual-mode operation - making it the only option for high-reliability, mixed-voltage, testable dual-port memory subsystems.

Availability

70T3319S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and defense electronics requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 70T3319S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T33xx family was engineered specifically for high-bandwidth, low-latency dual-port memory applications in networking ASICs, FPGA-based accelerators, and real-time signal processing systems - emphasizing deterministic timing, voltage flexibility, and system-level testability.

FAQ

What is the maximum operating frequency of the 70T3319S200BC8?

The 70T3319S200BC8 is rated for 200MHz operation (5ns cycle time) in commercial temperature range (0°C to +70°C). This is confirmed by AC Electrical Characteristics Table 11 in the datasheet, which specifies tCYC2 = 5ns minimum for pipelined mode. The 200MHz speed grade is only available in the 256-pin BGA package - not in the 208-pin fpBGA variant.

Does the 70T3319S200BC8 support independent I/O voltage selection on each port?

Yes, the 70T3319S200BC8 supports independent 2.5V or 3.3V I/O operation per port using OPTL and OPTR pins. When OPTL = VDD (2.5V), the left port operates at 3.3V levels and requires VDDQL = 3.3V; when OPTL = VSS (0V), it operates at 2.5V levels with VDDQL = 2.5V. The same applies independently to the right port via OPTR and VDDQR.

What is the function of the ADSL and ADSR pins on the 70T3319S200BC8?

The ADSL and ADSR pins are Address Strobe Enable inputs that latch the current address into the internal address counter. When asserted (VIL), they load the address present on A0L–A17L (or A0R–A17R) into the counter, enabling burst-mode sequential access. This eliminates the need for external address increment logic in applications like packet header parsing or FFT bin addressing.

How does the sleep mode (ZZL/ZZR) affect power consumption of the 70T3319S200BC8?

When ZZL and/or ZZR are asserted (VIH), the 70T3319S200BC8 enters sleep mode, reducing dynamic current to 5–15mA while retaining JTAG functionality. Per Table 9, ISB3 and Izz are both 5–15mA (typ/max) under these conditions. Static inputs (PL/FTx, OPTx) remain active, but all dynamic inputs except JTAG are disabled - ideal for low-power idle states in battery-backed systems.

Can the 70T3319S200BC8 be used in industrial temperature applications?

No, the 70T3319S200BC8 is specified only for commercial temperature range (0°C to +70°C). Industrial-grade operation (–40°C to +85°C) is supported only in the S133 and S166 speed grades (e.g., 70T3319S133BC8 or 70T3319S166BC8), as stated in Table 4 and Note 7 on page 9 of the datasheet. The "S200" suffix explicitly denotes commercial-only qualification.

70T3319S200BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.4 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3319S200BC8 FAQ

1.How can I place an order for 70T3319S200BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3319S200BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3319S200BC8 reliable?

The price and inventory of 70T3319S200BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3319S200BC8 is usually 5 days.

3.What payment methods are accepted for 70T3319S200BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3319S200BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3319S200BC8?

70T3319S200BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3319S200BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3319S200BC8?

For technical support, including 70T3319S200BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3319S200BC8 requirements.

6.How does Aetrix verify that 70T3319S200BC8 is sourced from the original manufacturer or authorized distributors?

All 70T3319S200BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3319S200BC8 meets industry standards.

7.What is the process for return or replacement of 70T3319S200BC8?

All 70T3319S200BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3319S200BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3319S200BC8 part is unused and in its original packaging.

Return procedure for 70T3319S200BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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