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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3339S133BC

Name: 70T3339S133BC
Brand: Renesas
SKU: 70T3339S133BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3339S133BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3339S133BC.pdf

Description:: IC SRAM 9MBIT PARALLEL 256CABGA

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Product details

Overview

70T3339S133BC from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and delivers 4.2ns access time at 133MHz in industrial temperature range (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards requiring simultaneous read/write access across independent data paths.

For engineers reviewing the 70T3339S133BC datasheet, 70T3339S133BC pinout, 70T3339S133BC application, or 70T3339S133BC equivalent, key selection criteria include its true dual-port architecture enabling concurrent access to same memory location, JTAG-compliant IEEE 1149.1 test support, collision detection flag, interrupt flag, and dual-cycle deselect capability for pipelined output mode - all critical for deterministic latency in FPGA-to-ASIC interconnect buffers.

Technical Context

The 70T3339S133BC implements fully synchronous operation on both left and right ports, with clocked address, data, and control registers minimizing setup/hold requirements (1.5ns setup, 0.5ns hold @ 200MHz). Its self-timed write logic enables fast cycle times, while separate byte controls (UBL/LBL, UBR/LBR) support multiplexed bus matching and partial-word writes.

It integrates address strobe enable (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic (REPEATL/REPEATR) for burst address generation, plus dedicated sleep mode pins (ZZL/ZZR) that disable dynamic inputs while preserving JTAG functionality. The device supports independent voltage selection per port via OPTL/OPTR, allowing mixed 2.5V/3.3V signaling environments.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 18 bits (9,216,000 bits); supports full parallel access on both ports simultaneously
Access Time (tCD2)	4.2ns max (pipelined mode); enables sub-5ns deterministic data-out timing for real-time processing pipelines
Cycle Time (tCYC2)	7.5ns min (pipelined mode); supports 133MHz sustained operation with zero wait states
Supply Voltages	VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV (I/O per port, selected via OPT pins)
Operating Temperature	–40°C to +85°C (industrial grade); validated for continuous operation in base station and industrial controller environments
Power Consumption	260mA max dynamic current (both ports active, 133MHz); 5mA max sleep mode current (ZZ asserted)
JTAG Compliance	IEEE 1149.1 boundary scan support with TCK ≤10MHz; enables in-system testability without external probes

Pinout & Package

70T3339S133BC is packaged in a 256-pin Ball Grid Array (BGA) with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin configuration (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port clock input	Synchronous edge-triggered timing reference for all register transfers on respective port
A0L–A18L / A0R–A18R	Address inputs	19-bit address bus per port; A17L/A18L are no-connect for this variant (70T3339)
I/O0L–I/O17L / I/O0R–I/O17R	Bidirectional data I/O	18-bit wide data path per port; supports simultaneous read/write to same location
CE0L/CE1L / CE0R/CE1R	Dual chip enables	Enable/disable port independently; dual CE allows depth expansion without external logic
R/WL / R/WR	Read/write control	Active-high write enable; determines direction of data transfer on each port
OEL / OER	Output enable	Asynchronous tri-state control; overrides clocked outputs for bus sharing
UBL/LBL / UBR/LBR	Byte enable	Selects upper (I/O9–I/O17) or lower (I/O0–I/O8) 9-bit byte for partial-word access
PL/FTL / PL/FTR	Pipeline/flow-through mode select	Configures output latency: pipelined (1-cycle delay) or flow-through (no delay)
ADSL / ADSR	Address strobe	Latches external address into internal counter; enables burst address incrementing
CNTENL / CNTENR	Counter enable	Activates auto-increment address counter on rising clock edge
REPEATL / REPEATR	Counter repeat	Resets counter to last ADS-loaded address; supports circular buffer behavior
INTL / INTR	Interrupt flag	Open-drain output asserting when port completes operation or detects event
COLL / COLR	Collision detection	Asserts when both ports attempt write to same address in same cycle
ZZL / ZZR	Sleep mode	Asynchronous power-down control; disables dynamic logic while preserving JTAG access
OPTL / OPTR	I/O voltage option	Selects VDDQ level: VDD (2.5V) → 3.3V I/O, VSS (0V) → 2.5V I/O
TCK/TMS/TDI/TDO/TRST	JTAG test interface	IEEE 1149.1 compliant boundary scan chain for production test and debug

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous read and write to identical memory locations - essential for lock-free inter-processor communication
Dual-cycle deselect (DCD)	Guarantees clean output disable in pipelined mode without bus contention during mode transitions
Separate byte controls (UBL/LBL, UBR/LBR)	Permits 9-bit partial writes without masking logic, reducing FPGA resource usage in protocol engines
Self-timed write architecture	Eliminates external write pulse generation; simplifies timing closure in high-speed designs
Collision and interrupt flags	Hardware-level synchronization signals reduce software polling overhead in real-time OS environments
Independent I/O voltage selection per port	Allows interfacing with 2.5V FPGAs and 3.3V ASICs on same board without level shifters

Applications

Telecom Packet Buffering	FPGA-to-ASIC Interconnect
Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade line cards where ingress and egress paths operate independently. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a zero-latency, non-blocking FIFO between MAC and switch fabric interfaces. Use Value: 4.2ns pipelined access ensures frame metadata can be read and updated within single clock cycle of 133MHz PHY interface.	Use Scenario: High-bandwidth data exchange between Xilinx Kintex FPGA and custom ASIC in radar signal processing subsystem. IC Role / Device Role / Timing Role: Serves as shared memory with deterministic read-after-write visibility across clock domains. Use Value: Collision detection flag prevents data corruption when both devices write same address; tCO = 6ns guarantees safe cross-port timing margin.
Industrial Motion Controller	Medical Imaging Data Pipeline
Use Scenario: Real-time coordination of multi-axis servo drives requiring synchronized position updates and status feedback. IC Role / Device Role / Timing Role: Memory buffer between motion algorithm core (FPGA) and I/O processor (ARM), accessed concurrently for command queue and sensor log. Use Value: Industrial temp rating (–40°C to +85°C) and 5mA sleep current support fanless enclosure design with thermal throttling.	Use Scenario: Temporary storage of raw CT scan projection data before GPU-based reconstruction. IC Role / Device Role / Timing Role: Dual-port interface bridges high-speed ADC front-end (right port) and PCIe DMA engine (left port) with no software arbitration. Use Value: JTAG boundary scan enables in-circuit validation of all 256 BGA connections post-reflow - critical for Class II medical device traceability.

Telecom Packet Buffering

FPGA-to-ASIC Interconnect

Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade line cards where ingress and egress paths operate independently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a zero-latency, non-blocking FIFO between MAC and switch fabric interfaces.

Use Value: 4.2ns pipelined access ensures frame metadata can be read and updated within single clock cycle of 133MHz PHY interface.

Use Scenario: High-bandwidth data exchange between Xilinx Kintex FPGA and custom ASIC in radar signal processing subsystem.

IC Role / Device Role / Timing Role: Serves as shared memory with deterministic read-after-write visibility across clock domains.

Use Value: Collision detection flag prevents data corruption when both devices write same address; tCO = 6ns guarantees safe cross-port timing margin.

Industrial Motion Controller

Medical Imaging Data Pipeline

Use Scenario: Real-time coordination of multi-axis servo drives requiring synchronized position updates and status feedback.

IC Role / Device Role / Timing Role: Memory buffer between motion algorithm core (FPGA) and I/O processor (ARM), accessed concurrently for command queue and sensor log.

Use Value: Industrial temp rating (–40°C to +85°C) and 5mA sleep current support fanless enclosure design with thermal throttling.

Use Scenario: Temporary storage of raw CT scan projection data before GPU-based reconstruction.

IC Role / Device Role / Timing Role: Dual-port interface bridges high-speed ADC front-end (right port) and PCIe DMA engine (left port) with no software arbitration.

Use Value: JTAG boundary scan enables in-circuit validation of all 256 BGA connections post-reflow - critical for Class II medical device traceability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV18	3.3V core; no 2.5V option; 5ns access time at 133MHz; 208-pin TQFP package	Lacks JTAG, sleep mode, and independent I/O voltage selection; requires external level shifters for mixed-voltage systems	Choose for cost-sensitive commercial designs where 3.3V-only interface suffices and BGA assembly is unavailable
AS7C331024B	Asynchronous dual-port; 15ns access; 3.3V only; 256-pin BGA but no pipelined mode or collision detection	No clock domain isolation; no hardware collision/interrupt flags; unsuitable for real-time deterministic buffering	Choose only for legacy asynchronous systems where timing margins exceed 15ns and JTAG is not required

Compared with CY7C1362BV18 and AS7C331024B, the 70T3339S133BC provides superior determinism via pipelined output mode, hardware collision detection, and per-port I/O voltage flexibility - making it uniquely suited for new designs demanding sub-5ns latency, mixed-voltage interoperability, and IEEE 1149.1 testability.

Availability

70T3339S133BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70T3339S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T3339S133BC belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency inter-processor and FPGA-ASIC bridging in real-time embedded systems.

FAQ

What is the maximum operating frequency supported by the 70T3339S133BC?

The 70T3339S133BC is rated for 133MHz operation in both commercial and industrial temperature ranges. Its minimum pipelined cycle time is 7.5ns, corresponding to 133MHz. While the datasheet notes 200MHz capability for faster speed grades (e.g., S200), the S133 suffix explicitly denotes the 133MHz industrial-grade version - verified by AC electrical characteristics tables and thermal derating curves.

Does the 70T3339S133BC support independent voltage selection on left and right ports?

Yes, the 70T3339S133BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This is confirmed in Pin Names table and DC Operating Conditions sections.

How does collision detection work on the 70T3339S133BC?

The 70T3339S133BC asserts COLL (left) or COLR (right) output flags when both ports attempt to write to the same memory address in the same clock cycle. Detection occurs synchronously with CLK edges, and flag reset timing is specified as tCOLR = 4.2ns max. This hardware mechanism eliminates need for software arbitration in real-time inter-processor communication.

What package type is used for the 70T3339S133BC?

The 70T3339S133BC uses a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body size, designated BC256 in IDT documentation. This is distinct from the 208-pin fpBGA (BF208) used for other variants - confirmed in Pin Configuration diagrams and package notes on pages 3 and 4 of the datasheet.

Can the 70T3339S133BC operate in flow-through output mode?

Yes, the 70T3339S133BC supports both pipelined and flow-through output modes. Flow-through mode is selected by driving PL/FTL and PL/FTR low (VSS), resulting in tCD1 = 15ns max access time. This mode eliminates pipeline latency for applications requiring immediate data availability after clock edge - verified in AC Electrical Characteristics Table 11 and Timing Waveform Figures 6 and 8.

70T3339S133BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 512K x 18

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3339S133BC FAQ

1.How can I place an order for 70T3339S133BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3339S133BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3339S133BC reliable?

The price and inventory of 70T3339S133BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S133BC is usually 5 days.

3.What payment methods are accepted for 70T3339S133BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S133BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3339S133BC?

70T3339S133BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3339S133BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3339S133BC?

For technical support, including 70T3339S133BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S133BC requirements.

6.How does Aetrix verify that 70T3339S133BC is sourced from the original manufacturer or authorized distributors?

All 70T3339S133BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S133BC meets industry standards.

7.What is the process for return or replacement of 70T3339S133BC?

All 70T3339S133BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S133BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3339S133BC part is unused and in its original packaging.

Return procedure for 70T3339S133BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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