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Renesas 70T3339S133BCI
- Part No.:
- 70T3339S133BCI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3339S133BCI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
70T3339S133BCI from Integrated Device Technology is a high-speed 512K × 18-bit synchronous dual-port static RAM with true simultaneous access on independent left/right ports, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, 4.2ns max access time at 133MHz, and industrial temperature support (–40°C to +85°C). It enables real-time data exchange in telecom line cards and network packet buffering.
For engineers reviewing the 70T3339S133BCI datasheet, 70T3339S133BCI pinout, 70T3339S133BCI application, or 70T3339S133BCI equivalent, key selection factors include pipelined/flow-through output mode selection, dual chip enable for depth expansion, JTAG-compliant boundary scan, interrupt/collision detection flags, and independent OPT-pin-controlled I/O voltage configuration per port.
Technical Context
The 70T3339S133BCI implements fully synchronous dual-port architecture with separate address, data, and control registers on each port, enabling 1.5ns setup and 0.5ns hold timing on all inputs at 200MHz operation. Its self-timed write logic minimizes cycle time while supporting both pipelined (5ns cycle) and flow-through (15ns cycle) output modes via PL/FTL/R pins.
Each port features independent byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/R), repeat control (REPEATL/R), and sleep mode (ZZL/ZZR) - all registered except OE, ZZ, and OPT. Collision detection and interrupt flags are generated synchronously to respective port clocks with guaranteed 4.2ns flag set/reset times.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 18 bits (9,216,000 total bits), enabling 18-bit parallel data paths per port |
| Max Access Time | 4.2ns (industrial grade, 133MHz operation), defining minimum clock-to-data-out latency in flow-through mode |
| Cycle Time | 7.5ns (pipelined mode), supporting 133MHz sustained throughput with 14Gbps aggregate bandwidth |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port, selected independently via OPTL/OPTR |
| Operating Temperature | –40°C to +85°C (industrial grade), validated for continuous operation in base station and industrial control environments |
| Power Consumption | 260mA max dynamic current (both ports active, 133MHz), 140mA max standby (ISB1), 5mA sleep mode (Izz) |
| JTAG Compliance | IEEE 1149.1 boundary scan support with TCK ≤10MHz, enabling in-system test and debug without external probes |
Pinout & Package
70T3339S133BCI is housed in a 256-pin Ball Grid Array (BGA) package measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require 2.5V connection; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS); all VSS pins connect to ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Registers all control, address, and data inputs on rising edge; defines timing domain for left/right port operations |
| A0L–A18L / A0R–A18R | Address inputs | 19-bit addressing per port (A17/A18 NC for smaller variants); supports full 512K depth addressing |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data bus | 18-bit parallel I/O per port; byte enables (UBL/LBL, UBR/LBR) allow granular 9-bit writes/reads |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable/disable port independently; dual CE allows seamless depth expansion without external logic |
| R/WL / R/WR | Read/write direction control | Synchronous active-high signal determining data flow direction on next clock edge |
| OEL / OER | Asynchronous output enable | Tri-states outputs immediately (no clock dependency); critical for bus sharing and hot-swap isolation |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input (VIH/VIL) selecting output register behavior: pipelined adds 1-cycle latency but improves throughput |
| INTL / INTR | Interrupt flag output | Active-low open-drain flag signaling internal event (e.g., collision, counter overflow) to host controller |
| COLL / COLR | Collision detection output | Asserts when both ports attempt simultaneous write to same memory location; enables arbitration logic |
| ZZL / ZZR | Sleep mode input | Asynchronous entry into ultra-low-power state (5mA Izz); preserves data and register states during idle periods |
| OPTL / OPTR | I/O voltage option select | DC input setting VDDQX level: VDD (2.5V) → 3.3V I/O, VSS (0V) → 2.5V I/O; enables mixed-voltage system interfacing |
| TCK/TMS/TDO/TDI/TRST | JTAG test interface | IEEE 1149.1 compliant boundary scan chain; operates independently of sleep mode and core clocks |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses on left and right ports without arbitration delay or data corruption |
| Selectable pipelined or flow-through output | Reduces effective cycle time to 7.5ns (pipelined) or maintains zero-latency output (flow-through) based on system timing budget |
| Dual chip enables per port | Supports seamless memory depth expansion across multiple devices using only CE signals-no address decoding logic required |
| Interrupt and collision detection flags | Hardware-asserted asynchronous signals eliminate software polling overhead and enable deterministic real-time response |
| Independent I/O voltage selection per port | Allows one port to interface with 3.3V FPGA logic while the other connects to 2.5V ASIC, simplifying mixed-voltage board design |
| Self-timed write architecture | Automatically adjusts internal timing to guarantee reliable write completion across voltage/temperature corners without external timing control |
Applications
| Telecom Line Card Buffering | Real-Time Signal Processing |
|---|---|
Use Scenario: High-throughput packet buffering between line-side PHY and switch fabric in OC-192/STM-64 interfaces. IC Role / Device Role / Timing Role: Dual-port SRAM acts as ping-pong buffer: left port accepts incoming packets while right port feeds outgoing scheduler, synchronized by independent clocks. Use Value: 4.2ns access time and 133MHz pipelined operation sustain 14Gbps line-rate throughput with zero packet loss under burst traffic. | Use Scenario: Co-processing between DSP and FPGA in radar beamforming systems requiring low-latency shared memory access. IC Role / Device Role / Timing Role: Memory hub providing deterministic read/write access to coefficient tables and intermediate results; collision flags prevent data race during concurrent updates. Use Value: Independent OPT pins allow DSP (3.3V) and FPGA (2.5V) to interface directly without level shifters, reducing BOM cost and signal integrity risk. |
| Industrial Motion Controller | Network Protocol Accelerator |
Use Scenario: Synchronized motion profile storage and execution in multi-axis CNC controllers with strict jitter requirements. IC Role / Device Role / Timing Role: Left port loaded with trajectory data by host MCU; right port streamed by servo ASIC at precise intervals using address counter and REPEAT logic. Use Value: Counter enable (CNTEN) and repeat (REPEAT) features eliminate external address generation logic, shrinking PCB area and firmware complexity. | Use Scenario: Deep packet inspection engine where pattern-matching engines concurrently read rule sets while update engines write new signatures. IC Role / Device Role / Timing Role: Dual-port SRAM serves as shared rule database: one port handles high-speed lookup, the other supports background signature updates without stalling lookups. Use Value: Hardware collision detection (COLL/COLR) provides immediate notification of conflicting writes, enabling atomic update protocols without software locks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 3.3V core (not 2.5V), no OPT-pin I/O voltage selection, 16-bit width (vs. 18-bit), 208-pin TQFP package | Lacks independent per-port I/O voltage control and 18-bit data path; requires level-shifting in mixed-voltage systems | Select when legacy 3.3V-only designs demand pin-compatible upgrade with minimal layout change |
| AS7C331024B-133BIN | Asynchronous interface (no clock), 133MHz max speed limited by access time, 256-pin BGA but no JTAG or collision detection | No pipelined mode, no hardware collision/interrupt flags, no boundary scan-requires software-managed arbitration | Select for cost-sensitive, non-real-time applications where synchronous timing and hardware arbitration are unnecessary |
Compared with CY7C1362BV33-133AXC and AS7C331024B-133BIN, the 70T3339S133BCI delivers superior real-time determinism via pipelined output mode, hardware collision detection, and per-port I/O voltage flexibility-critical for telecom and industrial control where timing predictability and mixed-voltage interoperability are mandatory.
Availability
70T3339S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and network protocol acceleration requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.
Supply support for 70T3339S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.
The 70T3339S133BCI belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency data exchange between heterogeneous processors, FPGAs, and ASICs in real-time networking and control systems.
FAQ
What is the maximum operating frequency supported by the 70T3339S133BCI?
The 70T3339S133BCI is rated for 133MHz operation in both commercial and industrial temperature ranges, with a guaranteed 7.5ns clock cycle time in pipelined mode and 25ns in flow-through mode. Its AC specifications are validated up to 133MHz across –40°C to +85°C, and it is not rated for 200MHz operation in the BCI (256-pin BGA) package variant.
How does the OPT pin configuration affect I/O voltage levels on the 70T3339S133BCI?
On the 70T3339S133BCI, OPTL and OPTR independently configure each port's I/O voltage: when OPTX = VDD (2.5V), the corresponding port operates at 3.3V I/O levels and requires VDDQX = 3.3V; when OPTX = VSS (0V), it operates at 2.5V I/O levels with VDDQX = 2.5V. This enables mixed-voltage interfacing without external level shifters.
Does the 70T3339S133BCI support hardware-based collision detection between ports?
Yes, the 70T3339S133BCI provides dedicated COLL and COLR output pins that assert asynchronously when both left and right ports attempt to write to the same memory location simultaneously. The collision flag is guaranteed to set within 4.2ns and reset within 4.2ns, enabling deterministic arbitration in real-time systems.
What package type and dimensions does the 70T3339S133BCI use?
The 70T3339S133BCI uses a 256-pin Ball Grid Array (BGA) package designated BC256, with physical dimensions of 17mm × 17mm × 1.4mm and 1.0mm ball pitch. It is distinct from the 208-pin fpBGA variant (BF208), which does not support 200MHz operation.
Can the 70T3339S133BCI operate in low-power sleep mode, and how is it controlled?
Yes, the 70T3339S133BCI supports sleep mode via ZZL and ZZR inputs: asserting either pin high places the corresponding port into ultra-low-power state with typical current draw of 5mA (Izz). Sleep mode preserves memory contents and register states, and recovery requires exactly three clock cycles after deassertion, as specified in the timing table.
70T3339S133BCI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3339S133BCI FAQ
1.How can I place an order for 70T3339S133BCI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3339S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3339S133BCI reliable?
The price and inventory of 70T3339S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S133BCI is usually 5 days.
3.What payment methods are accepted for 70T3339S133BCI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S133BCI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3339S133BCI?
70T3339S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3339S133BCI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3339S133BCI?
For technical support, including 70T3339S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S133BCI requirements.
6.How does Aetrix verify that 70T3339S133BCI is sourced from the original manufacturer or authorized distributors?
All 70T3339S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S133BCI meets industry standards.
7.What is the process for return or replacement of 70T3339S133BCI?
All 70T3339S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S133BCI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3339S133BCI part is unused and in its original packaging.
Return procedure for 70T3339S133BCI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3339S133BCI Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C04C-SSHM-T
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