Renesas 70T3339S133BF

Overview

70T3339S133BF from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and operates at 133MHz in industrial temperature range (–40°C to +85°C) in the 256-pin BGA package.

For engineers reviewing the 70T3339S133BF datasheet, 70T3339S133BF pinout, 70T3339S133BF application, or 70T3339S133BF equivalent, key selection criteria include simultaneous dual-port access latency, JTAG-compliant boundary scan support, byte-selectable write control, collision/interrupt flag signaling, and low-power sleep mode with ZZ pin control.

Technical Context

This device implements true dual-port SRAM architecture enabling concurrent read/write access to the same memory location from independent left and right ports. Each port includes fully synchronous registers for address, data, and control inputs-ensuring 1.5ns setup and 0.5ns hold times at 200MHz operation.

It supports independent voltage configuration per port via OPTL/OPTR pins: when set to VDD (2.5V), corresponding I/Os operate at 3.3V levels with VDDQ supplied at 3.3V; when set to VSS (0V), I/Os operate at 2.5V with VDDQ at 2.5V. The device also integrates address counter logic with ADS strobe, CNTEN enable, and REPEAT reset functionality.

Key Specifications

Pinout & Package

70T3339S133BF is packaged in a 256-pin Ball Grid Array (BGA) with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins must be connected to 2.5V; VDDQ pins require matching voltage (2.5V or 3.3V) based on OPT pin setting per port; all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZI and AS7C331024B-133BIN, the 70T3339S133BF uniquely delivers per-port voltage configurability, JTAG testability, and hardware collision arbitration-making it optimal for mixed-signal, safety-critical, or space-constrained embedded systems.

Availability

70T3339S133BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging subsystems, and avionics display modules requiring stable component supply across extended product lifecycles.

Supply support for 70T3339S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T3339S133BF belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for real-time inter-processor communication, packet buffering, and deterministic data sharing in systems demanding sub-5ns latency and industrial reliability.

FAQ

What is the maximum operating frequency of the 70T3339S133BF in industrial temperature range?

The 70T3339S133BF is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C). This corresponds to a 7.5ns clock cycle time in pipelined output mode and is validated under worst-case voltage (2.4V VDD) and temperature conditions. The 200MHz speed grade (S200) is commercial-only and unavailable in the BF-208 package variant.

How does the OPT pin configure I/O voltage levels on the 70T3339S133BF?

Each port (left/right) has its own OPT pin (OPTL/OPTR). When OPTX is tied to VDD (2.5V), that port's I/Os and control signals operate at 3.3V logic levels and require VDDQX = 3.3V. When OPTX is tied to VSS (0V), the port operates at 2.5V levels with VDDQX = 2.5V. This allows independent voltage configuration-e.g., left port at 3.3V for legacy peripherals, right port at 2.5V for modern FPGAs-without external level shifters.

Does the 70T3339S133BF support JTAG boundary scan, and what standard does it comply with?

Yes, the 70T3339S133BF supports IEEE 1149.1-compliant JTAG boundary scan. Pins TDI, TDO, TCK, TMS, and TRST implement the standard 5-pin test access port (TAP) controller. Boundary scan functionality remains active even during sleep mode (ZZ asserted), though IDT recommends avoiding JTAG operations during sleep for reliability.

What is the purpose of the COLL and COLR pins on the 70T3339S133BF?

The COLL (left port) and COLR (right port) pins are open-drain collision alert outputs. They assert low when both ports attempt simultaneous access (read or write) to the same memory address. Propagation delay is guaranteed ≤4.2ns (max), enabling real-time arbitration in safety-critical systems. These flags eliminate software polling and reduce latency in lock-free inter-processor communication protocols.

Can the 70T3339S133BF operate with different output modes on each port?

Yes-the 70T3339S133BF supports independent output mode selection per port via PL/FTL and PL/FTR pins. Setting PL/FTX = VIH configures pipelined output (1-cycle latency, higher throughput); setting PL/FTX = VIL selects flow-through mode (0-cycle latency, deterministic timing). This allows one port to prioritize bandwidth (e.g., data capture) while the other prioritizes latency (e.g., real-time control reads).