Renesas 70T3339S133BFGI

Overview

70T3339S133BFGI from Integrated Device Technology is a high-speed 2.5V synchronous dual-port static RAM with 512K × 18-bit organization, 133MHz operation, industrial temperature range (−40°C to +85°C), and 256-pin BGA package. It supports independent 3.3V or 2.5V I/O interfaces per port, pipelined/flow-through output modes, and true simultaneous read/write access to shared memory locations - used in real-time packet buffering and FPGA co-processor interconnects.

For engineers reviewing the 70T3339S133BFGI datasheet, 70T3339S133BFGI pinout, 70T3339S133BFGI application, or 70T3339S133BFGI equivalent, this page delivers verified timing specs (4.2ns max access), JTAG-compliant boundary scan support, dual chip enable for depth expansion, collision/interrupt flags, and self-timed write architecture - all critical for deterministic latency in telecom and test equipment designs.

Technical Context

The 70T3339S133BFGI implements a fully synchronous dual-port SRAM architecture with separate address, data, and control registers on both left and right ports, enabling minimal 1.5ns setup/0.5ns hold times at 133MHz. Its core operates at 2.5V ±100mV while each port's I/O voltage (2.5V or 3.3V) is independently selectable via OPTL/OPTR pins and corresponding VDDQL/VDDQR supplies.

It features dual-cycle deselect (DCD) in pipelined mode, counter-enabled burst addressing with ADS/REPEAT/CNTEN logic, and hardware collision detection with dedicated COLL/INT flags. Sleep mode (ZZL/ZZR) reduces current to 5–15mA while preserving JTAG accessibility - essential for low-power standby in always-on systems.

Key Specifications

Pinout & Package

70T3339S133BFGI uses a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require 2.5V supply; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port; VSS pins connect to ground. Pin A18L and A18R are no-connect for this variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1375BV33-133AXC and AS7C35128PFSIG, the 70T3339S133BFGI uniquely delivers per-port I/O voltage flexibility, hardware collision detection, and BGA packaging - making it the only option supporting zero-latency, mixed-voltage, real-time dual-access architectures without external logic.

Availability

70T3339S133BFGI is available at Aetrix Electronics and suitable for telecom infrastructure, automated test equipment, digital oscilloscopes, and FPGA-based embedded systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3339S133BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70T3339S133BFGI belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency, concurrent access reliability, and mixed-voltage interoperability in real-time embedded systems.

FAQ

What is the maximum operating frequency and access time for the 70T3339S133BFGI?

The 70T3339S133BFGI is rated for 133MHz operation with a maximum access time of 4.2ns. This specification applies across the full industrial temperature range (−40°C to +85°C) and is guaranteed under 2.5V core supply and appropriate VDDQL/VDDQR conditions. The device achieves this performance using pipelined output mode, delivering 3.4ns clock-to-data-out latency in typical operation.

Does the 70T3339S133BFGI support independent I/O voltage selection per port?

Yes, the 70T3339S133BFGI supports independent 2.5V or 3.3V I/O operation on left and right ports via dedicated OPTL and OPTR pins. When OPTL is tied to VDD (2.5V), the left port operates at 3.3V I/O levels and requires VDDQL = 3.3V; when tied to VSS (0V), it operates at 2.5V I/O levels with VDDQL = 2.5V. The same logic applies independently to the right port using OPTR and VDDQR.

How does the collision detection feature work on the 70T3339S133BFGI?

The 70T3339S133BFGI asserts its COLL and COLR output flags within 4.2ns when both ports attempt to access the same memory location simultaneously. These open-drain signals remain asserted until the conflicting access completes, enabling external logic or firmware to implement priority resolution or error logging. Collision detection operates independently of read/write state and requires no configuration - it is hardwired into the memory array control path.

What package type and pin count does the 70T3339S133BFGI use?

The 70T3339S133BFGI uses a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and a 17mm × 17mm body size. This fpBGA variant (BFGI suffix) is distinct from the 208-pin fpBGA option and supports the full 133MHz industrial-grade specification. Pin A18L and A18R are no-connect for this density variant, as confirmed in the official pin configuration diagram.

Is JTAG boundary scan supported on the 70T3339S133BFGI?

Yes, the 70T3339S133BFGI fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. Boundary scan operates independently of sleep mode (ZZL/ZZR) and remains functional even when core and I/O supplies are active - enabling in-system test, interconnect verification, and debug access without physical probe contact.