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Renesas 70T3339S133BFI8

Part No.:
70T3339S133BFI8
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3339S133BFI8.pdf
Description:
IC SRAM 9MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,125

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Product details

Overview

70T3339S133BFI8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and operates at 133MHz across industrial temperature range (–40°C to +85°C) in a 256-pin BGA package. Used in real-time packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the 70T3339S133BFI8 datasheet, 70T3339S133BFI8 pinout, 70T3339S133BFI8 application, or 70T3339S133BFI8 equivalent, key selection criteria include guaranteed 4.2ns max access time at 133MHz, independent port voltage selection via OPTL/OPTR, JTAG IEEE 1149.1 compliance, and collision/interrupt flag support for concurrent access arbitration.

Technical Context

This device implements true dual-port SRAM architecture with fully synchronous operation on both ports-each with dedicated clock (CLKL/CLKR), address (A0L–A18L / A0R–A18R), and data I/O (I/O0L–I/O17L / I/O0R–I/O17R). It uses input registers for address, control, and data to minimize setup/hold requirements, enabling 5ns cycle time in pipelined mode.

Each port supports independent I/O voltage configuration (2.5V or 3.3V) via OPTL/OPTR pins, with corresponding VDDQL/VDDQR supplies. The device includes address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), repeat (REPEATL/REPEATR), and sleep mode (ZZL/ZZR) controls, plus interrupt (INTL/INTR) and collision detection (COLL/COLR) flags for system-level coordination.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 18 bits (9,216,000 bits); supports simultaneous read/write on left and right ports
Max Clock Frequency133MHz - enables 14Gbps aggregate bandwidth with pipelined output mode
Access Time (tCD2)4.2ns max (pipelined) - determines minimum latency between clock edge and valid data output
Core Supply Voltage2.5V ±100mV - powers internal logic and memory array; requires stable low-noise regulation
I/O Interface VoltageSelectable 2.5V or 3.3V per port via OPTL/OPTR - allows mixed-voltage system integration without level shifters
Operating Temperature–40°C to +85°C - qualified for industrial environments including base station and motor control applications
Package256-pin BGA (17mm × 17mm, 1.0mm ball pitch) - supports high-density PCB layouts with thermal pad grounding

Pinout & Package

70T3339S133BFI8 is housed in a 256-pin Ball Grid Array (BGA) package with 17mm × 17mm body and 1.0mm ball pitch. All VDD pins must be connected to 2.5V; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port; all VSS pins require solid ground connection.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputsEdge-triggered timing reference for all register-based operations on respective port
A0L–A18L / A0R–A18RAddress inputs19-bit address bus per port; A17L/A18L are no-connect for this variant (70T3339)
I/O0L–I/O17L / I/O0R–I/O17RBidirectional data I/O18-bit parallel data path per port; byte enables (UBL/LBL, UBR/LBR) allow partial-word writes
CE0L/CE1L / CE0R/CE1RDual chip enablesEnable/disable port independently; dual CE architecture supports depth expansion without external logic
R/WL / R/WRRead/write direction controlActive-high for write, active-low for read - defines data flow direction per access cycle
OEL / OEROutput enableAsynchronous control of output drivers; tri-states I/Os when deasserted
PL/FTL / PL/FTRPipeline/flow-through mode selectConfigures output register behavior: pipelined (1-cycle delay) or flow-through (combinatorial)
ADSL / ADSRAddress strobeLatches current address into internal counter; enables burst addressing without sequential incrementing
CNTENL / CNTENRCounter enableActivates internal address counter on rising clock edge - used for sequential burst reads/writes
REPEATL / REPEATRCounter repeatResets counter to last ADS-loaded address - supports repeated access to fixed location
UBL / UBRUpper byte enableControls I/O9–I/O17; allows 9-bit upper word writes independent of lower byte
LBL / LBRLower byte enableControls I/O0–I/O8; enables 9-bit lower word writes without affecting upper byte
INTL / INTRInterrupt flagOpen-drain output asserted when port completes operation or detects event - signals host processor
COLL / COLRCollision detectionAsserted when both ports attempt simultaneous write to same address - prevents data corruption
ZZL / ZZRSleep mode inputDisables dynamic circuitry (except JTAG) to reduce standby current to 5mA max; retains memory contents
OPTL / OPTRI/O voltage optionSelects 3.3V (OPT = VDD) or 2.5V (OPT = VSS) I/O levels per port - configures VIH/VIL thresholds
TCK/TMS/TDO/TDI/TRSTJTAG boundary scanFully compliant with IEEE 1149.1; enables in-system test and debug without additional probes

Key Features

FeatureDesign Value
True dual-port memory cellsEnables simultaneous, independent read/write access to identical addresses on left and right ports - essential for real-time inter-processor communication
Self-timed write architectureEliminates external write pulse generation; internal timing ensures reliable write completion within one clock cycle
Dual Cycle Deselect (DCD)Prevents metastability during rapid port disable/enable transitions - critical for pipelined burst transfers
Separate byte controls (UBL/LBL, UBR/LBR)Supports 9-bit partial-word writes per port - reduces bus contention and improves efficiency in multiplexed systems
Interrupt and collision detection flagsHardware-signaled events eliminate polling overhead and prevent race conditions during concurrent access
JTAG IEEE 1149.1 complianceEnables boundary scan testing and in-circuit debugging without requiring dedicated test pads or external hardware

Applications

Telecom Packet BufferingFPGA Co-Processor Memory

Use Scenario: High-throughput line cards in 4G/LTE base stations buffer uplink/downlink packets between MAC and PHY layers.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between two independent processing engines - one handling packet ingress, the other egress scheduling.

Use Value: 133MHz pipelined operation delivers 14Gbps bandwidth; collision detection prevents corrupted packet headers during concurrent access.

Use Scenario: FPGA-based motor control systems use tightly coupled processors for real-time trajectory planning and PWM generation.

IC Role / Device Role / Timing Role: 70T3339S133BFI8 serves as deterministic, low-jitter shared memory between FPGA soft-core and external ARM controller.

Use Value: 4.2ns tCD2 ensures predictable timing margins; independent I/O voltage selection matches FPGA bank voltages without level shifters.

Industrial PLC Data ExchangeAvionics Sensor Fusion Hub

Use Scenario: Programmable logic controllers exchange sensor data and actuator commands between safety-critical and non-safety partitions.

IC Role / Device Role / Timing Role: Dual-port RAM provides isolated, atomic memory access between redundant CPU pairs - each port assigned to separate safety domain.

Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in harsh enclosures; ZZ sleep mode reduces power during idle cycles.

Use Scenario: Flight control computers merge inertial, GPS, and barometric sensor streams in real time for attitude estimation.

IC Role / Device Role / Timing Role: Acts as synchronized frame buffer between sensor acquisition ASIC and Kalman filter processor - left port for raw data ingestion, right for filtered output.

Use Value: Address strobe (ADSL/ADSR) and counter repeat enable deterministic burst transfers; JTAG support simplifies DO-254 verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133BZI3.3V core and I/O; no 2.5V core option; 16-bit width (vs. 18-bit); 208-pin TQFP packageDesigned for legacy 3.3V-only systems; lacks independent I/O voltage selection and JTAGChoose only if board uses 3.3V core and requires TQFP footprint; not drop-in compatible due to width and pinout mismatch
AS7C331024B-133BINSingle-port architecture; 1M × 16 organization; 2.5V core; 133MHz max; 100-pin TQFPNo concurrent access capability; requires external arbitration logic for multi-processor useSelect only for cost-sensitive, single-controller designs where dual-port functionality is unnecessary

Compared with CY7C1362BV33-133BZI and AS7C331024B-133BIN, the 70T3339S133BFI8 uniquely delivers true dual-port 18-bit operation with 2.5V core and flexible per-port I/O voltage - enabling direct FPGA/ASIC interfacing without level translation or arbitration overhead.

Availability

70T3339S133BFI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and FPGA-accelerated computing applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.

Supply support for 70T3339S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs for communications, computing, and industrial markets.

The 70T3339S133BFI8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency memory sharing between heterogeneous processors, FPGAs, and ASICs in real-time embedded systems.

FAQ

What is the maximum operating frequency of the 70T3339S133BFI8?

The 70T3339S133BFI8 is rated for 133MHz operation across the industrial temperature range (–40°C to +85°C). This corresponds to a 7.5ns clock cycle time in pipelined mode (tCYC2), delivering 14Gbps aggregate bandwidth. The S133 speed grade is validated for both commercial and industrial grades, unlike the S200 variant which is commercial-only and unavailable in the 256-pin BGA package.

Does the 70T3339S133BFI8 support independent I/O voltage selection on each port?

Yes, the 70T3339S133BFI8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting it to VSS (0V) selects 2.5V I/O with VDDQL = 2.5V. The same applies to the right port using OPTR and VDDQR. This eliminates external level shifters in mixed-voltage systems.

How does collision detection work on the 70T3339S133BFI8?

The 70T3339S133BFI8 asserts COLL or COLR when both ports attempt to write to the same memory location simultaneously. Detection occurs internally on every write cycle; the flag remains asserted until cleared by a subsequent read or write to that address. Propagation delay is guaranteed ≤4.2ns (tCOLS), enabling immediate system-level arbitration without software polling.

What is the purpose of the ADSL and ADSR pins on the 70T3339S133BFI8?

ADSL and ADSR are address strobe inputs that latch the current address into an internal counter, enabling burst-mode addressing. When CNTEN is active, the counter auto-increments on each clock edge - allowing sequential accesses without re-driving the full address bus. REPEATL/REPEATR can reset the counter to the last ADS-loaded address, supporting repeated access to fixed buffers.

Can the 70T3339S133BFI8 enter low-power sleep mode, and how is it controlled?

Yes, the 70T3339S133BFI8 supports sleep mode via ZZL and ZZR pins. Asserting either pin high disables dynamic circuitry (reducing current to ≤15mA), while retaining memory contents and JTAG functionality. Sleep mode recovery requires three clock cycles (tZZRC), and entry takes two cycles (tZZSC). Static inputs like PL/FT and OPT remain functional during sleep.

70T3339S133BFI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T3339S133BFI8 FAQ

1.How can I place an order for 70T3339S133BFI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3339S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3339S133BFI8 reliable?

The price and inventory of 70T3339S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S133BFI8 is usually 5 days.

3.What payment methods are accepted for 70T3339S133BFI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S133BFI8 transactions.

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4.How is shipping managed for 70T3339S133BFI8?

70T3339S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3339S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3339S133BFI8?

For technical support, including 70T3339S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S133BFI8 requirements.

6.How does Aetrix verify that 70T3339S133BFI8 is sourced from the original manufacturer or authorized distributors?

All 70T3339S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S133BFI8 meets industry standards.

7.What is the process for return or replacement of 70T3339S133BFI8?

All 70T3339S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S133BFI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3339S133BFI8 part is unused and in its original packaging.

Return procedure for 70T3339S133BFI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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