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Renesas 70T3339S166BC

Part No.:
70T3339S166BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3339S166BC.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,002

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Product details

Overview

70T3339S166BC from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and delivers 3.6ns clock-to-data access at 166MHz in commercial/industrial temperature range (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70T3339S166BC datasheet, 70T3339S166BC pinout, 70T3339S166BC application, or 70T3339S166BC equivalent, key selection criteria include simultaneous dual-port access latency, voltage-flexible I/O compatibility, JTAG-compliant boundary scan support, and industrial-grade thermal reliability in high-throughput memory subsystems.

Technical Context

The 70T3339S166BC implements true dual-port SRAM cells enabling concurrent read/write operations on independent left and right ports without arbitration. Its fully synchronous architecture uses registered address, data, and control inputs-achieving 1.5ns setup and 0.5ns hold times at 200MHz operation.

It integrates dual-cycle deselect (DCD) for pipelined output mode, address strobe logic (ADSL/ADSR), counter enable/repeat functions, and collision/interrupt flags. Each port has independent OPT pins to configure I/O voltage (2.5V or 3.3V), and dedicated sleep mode pins (ZZL/ZZR) that reduce current to 5mA while preserving JTAG accessibility.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512K × 18 bits (9Mb total); supports burst-mode unidirectional/bidirectional data flow in networking buffers.
Max Clock Frequency166MHz; enables 5ns cycle time and 14Gbps aggregate bandwidth across both ports.
Access Time3.6ns (max) clock-to-data out in pipelined mode; ensures deterministic timing for real-time packet forwarding.
Supply VoltagesVDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (I/O); enables mixed-voltage system integration.
Operating Temperature–40°C to +85°C; qualified for industrial embedded applications including base station control planes.
Power Consumption320mA typical dynamic current (both ports active); 5mA sleep mode current; supports low-power idle states.
JTAG ComplianceIEEE 1149.1 compliant; enables in-system testability and debug without external probes.

Pinout & Package

70T3339S166BC is packaged in a 256-pin Ball Grid Array (BGA) with 17mm × 17mm body and 1.0mm ball pitch. Pin assignments are validated per IDT DSC-5652/11 (November 2019) pin configuration diagram for BC256 package.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputRegisters all address/data/control inputs on rising edge; enables full synchronization across both ports.
A0L–A18L / A0R–A18RAddress inputs19-bit addressing per port; A17/A18 are no-connect for smaller variants but functional for 512K density.
I/O0L–I/O17L / I/O0R–I/O17RBidirectional data bus18-bit parallel interface per port; supports byte-level writes via UBL/LBL controls.
CE0L/CE1L / CE0R/CE1RDual chip enablesEnable/disable port independently; allow depth expansion without external logic or address decoding.
R/WL / R/WRRead/write direction controlSynchronous active-high signal; determines data flow direction per access cycle.
OEL / OEROutput enableAsynchronous control; places I/O pins in high-impedance state independent of clock.
UBL / LBL / UBR / LBRByte enableSelect upper (I/O9–I/O17) or lower (I/O0–I/O8) 9-bit byte for write masking.
PL/FTL / PL/FTRPipeline/flow-through mode selectDC-configurable input; sets output register behavior-pipelined (1-cycle delay) or flow-through (combinatorial).
ADSL / ADSRAddress strobeLatches external address into internal counter; enables burst-addressing without sequential CPU intervention.
CNTENL / CNTENRCounter enableActivates auto-increment address counter on clock edge; supports sequential memory access patterns.
REPEATL / REPEATRCounter repeatResets counter to last ADS-loaded address; useful for repeated access to fixed buffer regions.
INTL / INTRInterrupt flagOpen-drain output signaling completion or event; requires external pull-up for system interrupt assertion.
COLL / COLRCollision detectionAsserts when both ports attempt simultaneous access to same memory location; enables software/hardware conflict resolution.
ZZL / ZZRSleep mode inputAsynchronous entry to ultra-low-power state; disables dynamic inputs except JTAG, reducing IDD to 5mA.
OPTL / OPTRI/O voltage optionDC-selects VDDQ interface level: VDD (2.5V) → 3.3V I/O; VSS (0V) → 2.5V I/O-enables mixed-voltage interconnect.
TCK/TMS/TDI/TDO/TRSTJTAG boundary scanFully compliant IEEE 1149.1 interface; supports device-level test, programming, and diagnostics.

Key Features

FeatureDesign Value
True dual-port memory cellsEnables simultaneous, independent read/write access to identical memory locations-critical for producer-consumer FIFOs in protocol engines.
Self-timed write architectureEliminates external write pulse generation; reduces timing margin requirements and simplifies controller design.
Dual-cycle deselect (DCD)Prevents metastability during rapid port switching in pipelined mode; guarantees clean output disable timing.
Independent per-port I/O voltage selectionAllows left port to interface with 3.3V FPGA logic while right port connects to 2.5V ASIC-no level shifters required.
Address counter with ADS/CNTEN/REPEATReduces CPU overhead in streaming applications by automating sequential address generation and loop-back behavior.
Collision and interrupt flagsProvides hardware-asserted signals for contention management and event-driven processing-replaces polling loops in firmware.

Applications

Telecom Packet BufferingReal-Time Signal Processing

Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade switches where ingress and egress paths operate concurrently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking shared memory between MAC-layer processors and traffic managers.

Use Value: 3.6ns access time and pipelined output mode ensure sub-10ns latency for frame header lookups and forwarding decisions.

Use Scenario: Holding intermediate FFT coefficients in radar DSP subsystems requiring deterministic read-after-write timing.

IC Role / Device Role / Timing Role: Serves as ping-pong buffer between ADC capture engine (left port) and FFT accelerator (right port).

Use Value: Collision detection flag prevents data corruption when both engines access overlapping memory segments during pipeline stalls.

Industrial Motion ControlTest Equipment Data Acquisition

Use Scenario: Coordinating servo command updates and position feedback sampling in multi-axis CNC controllers.

IC Role / Device Role / Timing Role: Provides synchronized access to motion profile tables and encoder count snapshots across two real-time cores.

Use Value: Independent sleep mode pins (ZZL/ZZR) allow one port to remain active for safety-critical monitoring while the other enters low-power state.

Use Scenario: Capturing high-speed analog waveforms at 100+ MS/s and transferring results to host PC via PCIe DMA engine.

IC Role / Device Role / Timing Role: Acts as deep acquisition buffer-left port accepts ADC stream, right port feeds DMA controller.

Use Value: 166MHz clock rate and 14Gbps aggregate bandwidth sustain continuous 16-bit @ 100MSPS without backpressure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-166AXC3.3V core; no 2.5V VDD option; 166MHz max; 256-pin BGA; lacks JTAG and collision detection.Requires 3.3V-only system power; unsuitable for mixed-voltage designs or boundary-scan–required environments.Select only if 3.3V core supply is mandatory and JTAG/testability is not required.
AS7C331024B-166BINSingle-port architecture; 166MHz; 256-pin BGA; no dual-clock domain or per-port voltage selection.Cannot support true concurrent access; requires external arbitration logic for producer-consumer use cases.Choose only for cost-sensitive, non-real-time applications where dual-port functionality is unnecessary.

Compared with CY7C1362BV33-166AXC and AS7C331024B-166BIN, the 70T3339S166BC uniquely combines 2.5V core operation, per-port I/O voltage flexibility, IEEE 1149.1 JTAG, and hardware collision detection-making it the only viable option for industrial telecom and safety-critical dual-access memory systems.

Availability

70T3339S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and test equipment applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3339S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 70T3339S166BC belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for real-time, low-latency memory sharing between independent processors, FPGAs, or ASICs in telecom, defense, and industrial automation.

FAQ

What is the maximum operating frequency supported by the 70T3339S166BC?

The 70T3339S166BC supports up to 166MHz operation across both commercial and industrial temperature ranges. This corresponds to a 6ns clock cycle time in pipelined mode and guarantees 3.6ns clock-to-data access time. The 200MHz speed grade (70T3339S200BC) is not offered in the BC256 package variant.

Does the 70T3339S166BC support independent voltage levels on its left and right ports?

Yes, the 70T3339S166BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD configures the left port for 3.3V I/O operation (with VDDQL = 3.3V), while setting OPTR to VSS configures the right port for 2.5V I/O (with VDDQR = 2.5V). This enables seamless interfacing with heterogeneous logic families.

How does the collision detection feature work in the 70T3339S166BC?

The 70T3339S166BC asserts COLL or COLR outputs when both ports attempt to access the same memory location simultaneously. These open-drain flags require external pull-ups and provide immediate hardware notification-allowing firmware or external logic to resolve contention without polling or timing assumptions. Detection latency is guaranteed at ≤4.2ns.

Can the 70T3339S166BC operate in flow-through output mode, and what is its access time in that mode?

Yes, the 70T3339S166BC supports flow-through output mode when PL/FTL or PL/FTR is driven low. In this mode, data appears combinatorially after address registration, with a maximum access time of 12ns (tCD1) at 166MHz. This mode eliminates pipeline latency but requires stricter timing closure on the system board.

Is JTAG boundary scan supported on the 70T3339S166BC, and which standard does it comply with?

Yes, the 70T3339S166BC includes full IEEE 1149.1-compliant JTAG boundary scan circuitry with TCK, TMS, TDI, TDO, and TRST pins. This enables in-system testability, device identification, and debug access without requiring physical probe points-critical for high-density telecom and industrial PCBs.

70T3339S166BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3339S166BC FAQ

1.How can I place an order for 70T3339S166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3339S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3339S166BC reliable?

The price and inventory of 70T3339S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S166BC is usually 5 days.

3.What payment methods are accepted for 70T3339S166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S166BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3339S166BC?

70T3339S166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3339S166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3339S166BC?

For technical support, including 70T3339S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S166BC requirements.

6.How does Aetrix verify that 70T3339S166BC is sourced from the original manufacturer or authorized distributors?

All 70T3339S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S166BC meets industry standards.

7.What is the process for return or replacement of 70T3339S166BC?

All 70T3339S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3339S166BC part is unused and in its original packaging.

Return procedure for 70T3339S166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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