Renesas 70T3339S166BF8

Overview

70T3339S166BF8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features dual chip enables for depth expansion, and delivers 3.6ns clock-to-data access at 166MHz in commercial and industrial temperature ranges (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards and FPGA co-processor memory interfaces.

For engineers reviewing the 70T3339S166BF8 datasheet, 70T3339S166BF8 pinout, 70T3339S166BF8 application, or 70T3339S166BF8 equivalent, key selection criteria include simultaneous dual-port access latency, voltage-flexible I/O compatibility, JTAG-compliant boundary scan support, and BGA package thermal/mechanical constraints for high-density PCB layouts.

Technical Context

The 70T3339S166BF8 implements true dual-port SRAM cells enabling concurrent read/write access to the same memory location from independent left and right ports. Its fully synchronous operation uses registered address, data, and control inputs with ≤1.5ns setup and ≤0.5ns hold times at 200MHz, minimizing timing margin requirements in high-speed systems.

Each port supports independent voltage selection via OPTL/OPTR pins-configuring VDDQL/VDDQR for either 2.5V or 3.3V I/O levels-and includes dedicated pipeline/flow-through mode control (PL/FTL/PL/FTR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and collision/interrupt flags (COLL/INTR, COLR/INTR) for deterministic inter-port coordination.

Key Specifications

Pinout & Package

70T3339S166BF8 is housed in a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body size. Pin assignments are defined for left (L) and right (R) ports, including dual clock inputs (CLKL/CLKR), independent chip enables (CE0L/CE1L, CE0R/CE1R), byte enables (UBL/LBL, UBR/LBR), and JTAG signals (TCK, TMS, TDI, TDO, TRST).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166AXC and AS7C331024B-166BIN, the 70T3339S166BF8 uniquely supports independent 2.5V/3.3V I/O per port, IEEE 1149.1 JTAG, and configurable pipelined/flow-through output-making it optimal for heterogeneous, safety-critical, or test-intensive embedded systems requiring deterministic dual-port timing.

Availability

70T3339S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data recording, and FPGA-accelerated computing applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3339S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T3339S166BF8 belongs to IDT's high-speed synchronous dual-port SRAM family, engineered for deterministic, low-latency inter-processor and FPGA-to-ASIC data exchange in real-time embedded systems.

FAQ

What is the maximum operating frequency and corresponding access time for the 70T3339S166BF8?

The 70T3339S166BF8 is rated for 166MHz operation with a pipelined clock-to-data access time (tCD2) of 3.6ns. This specification applies across the full industrial temperature range (–40°C to +85°C) and assumes proper VDD = 2.5V ±100mV and matched VDDQ supply per port configuration. Flow-through mode yields longer tCD1 (12ns), traded for zero-cycle latency in specific control paths.

How does the 70T3339S166BF8 support mixed-voltage system integration?

The 70T3339S166BF8 supports mixed-voltage integration via independent OPTL and OPTR pins: setting OPTL = VDD configures the left port for 3.3V I/O (requiring VDDQL = 3.3V), while OPTR = VSS configures the right port for 2.5V I/O (requiring VDDQR = 2.5V). This allows direct interfacing with both 3.3V microcontrollers and 2.5V FPGAs without level shifters-verified in the device's DC operating conditions tables.

Does the 70T3339S166BF8 include hardware features to prevent data corruption during simultaneous access?

Yes-the 70T3339S166BF8 includes dedicated COLL (collision alert) and INTL/INTR (interrupt flag) outputs that assert when both ports attempt to access the same memory location. These signals are synchronous to their respective clocks and provide deterministic, hardware-level notification-enabling firmware to implement immediate arbitration or error logging without relying on software polling or timing assumptions.

What package type and pin count does the 70T3339S166BF8 use, and are thermal pads supported?

The 70T3339S166BF8 uses a 256-pin Ball Grid Array (BGA) package with 1.0mm ball pitch and 17mm × 17mm body dimensions. The package drawing confirms no integrated thermal pad; thermal management relies on standard PCB copper pour under the array and perimeter vias to internal ground planes. Pin assignments include 32 dedicated VSS balls and 24 VDD/VDDQ balls distributed to minimize IR drop and noise coupling.

Can the 70T3339S166BF8 operate in sleep mode while maintaining JTAG accessibility?

Yes-the 70T3339S166BF8 retains full JTAG functionality (TCK, TMS, TDI, TDO, TRST) during sleep mode. When ZZL and/or ZZR are driven high, all dynamic inputs (address, data, control) are disabled except JTAG signals, and internal circuitry enters ultra-low-power state (≤15mA). Boundary-scan operations remain active, enabling in-system test and debug even during low-power system states-explicitly confirmed in the datasheet's "Sleep Mode" notes.