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Renesas 70T3339S200BC8
- Part No.:
- 70T3339S200BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3339S200BC8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
70T3339S200BC8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports true simultaneous read/write access on independent left/right ports, delivers 3.4ns clock-to-data-out in pipelined mode at 200MHz, and operates across commercial temperature range (0°C to +70°C) in a 256-pin BGA package. It is used in high-bandwidth inter-processor communication and FPGA co-processor buffering.
For engineers reviewing the 70T3339S200BC8 datasheet, 70T3339S200BC8 pinout, 70T3339S200BC8 application, or 70T3339S200BC8 equivalent, key selection criteria include dual-port latency tolerance, voltage-flexible I/O compatibility, JTAG boundary-scan support, and industrial-grade timing margin validation for pipelined burst transfers.
Technical Context
The 70T3339S200BC8 implements fully synchronous dual-port architecture with separate address, data, and control registers on each port-enabling 1.5ns setup and 0.5ns hold times on all inputs at 200MHz. Its self-timed write logic minimizes cycle time, while dual chip enables (CE0/CE1 per port) allow seamless depth expansion without external logic.
Each port supports independent configuration of pipelined or flow-through output mode via dedicated PL/FT pins, and includes interrupt/collision detection flags for real-time arbitration. The device integrates JTAG IEEE 1149.1 compliance for in-system testability and features sleep mode (ZZL/ZZR) with sub-15mA current draw.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512K × 18 bits (9,216,000 bits), enabling 18-bit parallel data exchange between two independent bus domains |
| Max Clock Frequency | 200MHz (5ns cycle time), delivering 14Gbps aggregate bandwidth across both ports |
| Access Time | 3.4ns clock-to-data-out (pipelined mode), meeting tight timing budgets in FPGA-to-ASIC bridging |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port, configurable via OPTL/OPTR pins |
| Operating Temperature | Commercial grade: 0°C to +70°C - validated for stable operation in non-industrial embedded systems |
| Package | 256-pin BGA (BC256), 17mm × 17mm body, 1.0mm ball pitch - compatible with standard surface-mount reflow profiles |
| JTAG Support | IEEE 1149.1 compliant TAP controller (TCK/TRST/TMS/TDI/TDO), enabling boundary-scan testing without functional interruption |
Pinout & Package
70T3339S200BC8 is housed in a 256-ball fine-pitch BGA (package code BC256), with 17mm × 17mm footprint and 1.0mm ball pitch. Power and ground balls are distributed across the array for low-impedance decoupling; VDD (2.5V core) and VDDQ (2.5V/3.3V I/O) supplies are segregated per port.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all register transfers on left/right port |
| A0L–A18L / A0R–A18R | Address inputs | 19-bit address bus per port; A18L/A18R are no-connect for this variant (70T3339) |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data I/O | 18-bit wide data path per port; supports byte-level writes via UBL/LBL and UBR/LBR |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable inputs | Two independent enables per port allow depth expansion without external decode logic |
| R/WL / R/WR | Read/write direction control | Active-high signal determining data flow direction on respective port |
| OEL / OER | Output enable | Asynchronous control enabling/disabling output drivers - critical for bus sharing |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input selecting pipelined (low-latency burst) or flow-through (zero-cycle delay) output behavior |
| OPTL / OPTR | I/O voltage option select | Configures VDDQX supply level: VDD = 2.5V → 3.3V I/O; VSS = 0V → 2.5V I/O |
| ZZL / ZZR | Sleep mode enable | Asserting high disables dynamic circuitry (except JTAG), reducing current to ≤15mA |
| INTL / INTR / COLL / COLR | Status flag outputs | Open-drain interrupt and collision detection signals for inter-port arbitration and error handling |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses on left and right ports - essential for lock-free inter-process communication |
| Selectable pipelined or flow-through output | Pipelined mode achieves 3.4ns tCD2 at 200MHz; flow-through mode eliminates pipeline latency for deterministic timing-critical reads |
| Dual-cycle deselect (DCD) in pipelined mode | Allows clean deactivation of outputs over two clock cycles - prevents bus contention during port switching |
| Independent per-port voltage configuration | OPTL/OPTR pins let left port run at 3.3V while right port runs at 2.5V - simplifies mixed-voltage system integration |
| Address counter with ADS/CNTEN/REPEAT | Hardware address incrementing and repeat capability reduces CPU overhead in sequential buffer access patterns |
Applications
| Network Packet Buffering | FPGA-to-ASIC Data Bridge |
|---|---|
Use Scenario: Storing incoming Ethernet frames in one port while DMA engine reads them out via the other port. IC Role / Device Role / Timing Role: Dual-port SRAM acts as asynchronous FIFO buffer with zero-wait-state throughput between PHY and MAC layers. Use Value: 200MHz operation sustains 14Gbps line-rate buffering for 10GbE systems without backpressure. | Use Scenario: FPGA configures algorithm parameters into SRAM, then ASIC reads and processes data from same memory space. IC Role / Device Role / Timing Role: Shared memory resource enabling deterministic handoff between programmable and fixed-function logic blocks. Use Value: Pipelined output mode ensures sub-4ns data availability to ASIC, matching its internal timing budget. |
| Real-Time Signal Processing | Multicore Processor Interconnect |
Use Scenario: Two DSP cores simultaneously access overlapping coefficient tables and sample buffers for parallel filter execution. IC Role / Device Role / Timing Role: True dual-port architecture eliminates arbitration delays, supporting lock-free shared-memory algorithms. Use Value: Collision detection flags (COLL/COLR) provide hardware signaling for conflict resolution without software polling. | Use Scenario: Symmetric multiprocessing system where Core A writes status to SRAM and Core B reads it with minimal latency. IC Role / Device Role / Timing Role: Low-latency memory node serving as fast inter-core mailbox and cache-coherent snoop buffer. Use Value: 1.5ns input setup time allows direct connection to high-speed processor buses without additional timing margin logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200BZXI | 200MHz, 512K × 18, 3.3V core/I/O, 208-pin TQFP - lacks JTAG, no sleep mode, higher power | Requires 3.3V-only system design; no voltage-flexible I/O per port; unsuitable for low-power standby scenarios | Choose when legacy 3.3V-only board layout exists and JTAG testability is not required |
| AS7C35128P-20JCN | 200MHz, 512K × 18, 2.5V core/I/O, 208-pin BGA - no dual-voltage I/O, no pipelined mode, no collision flags | Fixed 2.5V I/O only; flow-through only; no hardware arbitration signals - limits mixed-voltage or real-time use cases | Choose for cost-sensitive, single-voltage designs where pipelining and collision detection are unnecessary |
Compared with CY7C1362BV33-200BZXI and AS7C35128P-20JCN, the 70T3339S200BC8 uniquely supports per-port 2.5V/3.3V I/O selection, pipelined output mode for sub-4ns latency, and integrated JTAG + collision detection - making it optimal for high-performance, mixed-voltage, testable embedded systems.
Availability
70T3339S200BC8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA-to-ASIC bridging, real-time signal processing, multicore interconnect, and high-speed instrumentation requiring stable component supply and long-term production continuity.
Supply support for 70T3339S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.
The 70T3339S200BC8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for low-latency, high-bandwidth inter-processor and FPGA-ASIC data exchange in telecom infrastructure and test equipment.
FAQ
What is the maximum operating frequency of the 70T3339S200BC8?
The 70T3339S200BC8 is rated for 200MHz operation, achieving a 5ns clock cycle time in pipelined mode. This specification applies only to the BC256 (256-pin BGA) package; the BF208 fpBGA variant does not support 200MHz. Timing is guaranteed across commercial temperature range (0°C to +70°C) with 2.5V core supply and proper VDDQ configuration.
Does the 70T3339S200BC8 support mixed-voltage operation between its two ports?
Yes, the 70T3339S200BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This enables seamless interfacing with heterogeneous logic families on each port.
How does the pipelined versus flow-through output mode affect timing in the 70T3339S200BC8?
In pipelined mode (PL/FTx = VIH), the 70T3339S200BC8 delivers 3.4ns clock-to-data-out (tCD2) at 200MHz but introduces one-cycle output latency. In flow-through mode (PL/FTx = VIL), output appears combinatorially with 10ns tCD1 max - eliminating pipeline delay at the cost of longer cycle time (15ns min). Mode selection is per-port and static during operation.
What is the purpose of the ZZL and ZZR pins on the 70T3339S200BC8?
The ZZL and ZZR pins are independent sleep mode enables for the left and right ports of the 70T3339S200BC8. When asserted high, each pin shuts down dynamic circuitry on its respective port, reducing current draw to ≤15mA while preserving data and allowing JTAG access. Static inputs (PL/FTx, OPTx) remain active, enabling wake-up without full reset - ideal for power-gated subsystems.
Can the 70T3339S200BC8 be used in industrial temperature applications?
No, the 70T3339S200BC8 is specified only for commercial temperature range (0°C to +70°C). Industrial-grade operation (–40°C to +85°C) is supported by slower-speed variants - specifically the 70T3339S133BC8 and 70T3339S166BC8 - which are validated across the full industrial range but do not operate at 200MHz. Using the S200 variant outside 0°C–70°C violates datasheet specifications.
70T3339S200BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3339S200BC8 FAQ
1.How can I place an order for 70T3339S200BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3339S200BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3339S200BC8 reliable?
The price and inventory of 70T3339S200BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S200BC8 is usually 5 days.
3.What payment methods are accepted for 70T3339S200BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S200BC8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3339S200BC8?
70T3339S200BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3339S200BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3339S200BC8?
For technical support, including 70T3339S200BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S200BC8 requirements.
6.How does Aetrix verify that 70T3339S200BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3339S200BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S200BC8 meets industry standards.
7.What is the process for return or replacement of 70T3339S200BC8?
All 70T3339S200BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S200BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3339S200BC8 part is unused and in its original packaging.
Return procedure for 70T3339S200BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3339S200BC8 Tags
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M24C02-WMN6TP
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