Renesas 70T3339S200BCG
- Part No.:
- 70T3339S200BCG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3339S200BCG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3339S200BCG from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports 200MHz operation (5ns cycle time), pipelined or flow-through output modes, and simultaneous read/write access on independent left/right ports - used in high-bandwidth packet buffering, FPGA co-processor memory, and telecom line-card data exchange.
For engineers reviewing the 70T3339S200BCG datasheet, 70T3339S200BCG pinout, 70T3339S200BCG application, or 70T3339S200BCG equivalent, key selection criteria include dual-port timing latency (3.4ns clock-to-data in pipelined mode), JTAG-compliant IEEE 1149.1 test support, industrial-grade (-40°C to +85°C) availability at 133MHz, and BGA package compatibility with depth expansion via dual chip enables.
Technical Context
The 70T3339S200BCG implements true dual-port SRAM cells enabling concurrent access to identical memory locations without arbitration logic. Its fully synchronous architecture uses registered address, data, and control inputs on both ports, achieving 1.5ns setup and 0.5ns hold times at 200MHz.
Each port features independent OPT pins to configure I/O voltage (2.5V or 3.3V), separate byte enables (UBL/LBL, UBR/LBR), and configurable pipeline/flow-through output mode via PL/FTL and PL/FTR inputs. Collision detection and interrupt flags provide real-time inter-port synchronization for deterministic data handoff.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 512K × 18 bits (9Mb total); supports depth expansion using dual CE0/CE1 enables without external logic |
| Max Clock Frequency | 200MHz (commercial grade only); enables 14Gbps aggregate bandwidth across both ports |
| Access Time | 3.4ns clock-to-data (pipelined mode); reduces latency in burst-read applications like network frame buffering |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows mixed-voltage system integration without level shifters |
| Operating Temperature | -40°C to +85°C (industrial grade at 133MHz); validated for telecom infrastructure and industrial control environments |
| Package | 256-pin BGA (17mm × 17mm, 1.0mm ball pitch); compatible with standard reflow profiles and automated assembly |
| JTAG Compliance | IEEE 1149.1 boundary-scan support; enables in-system testability and debug without physical probe access |
Pinout & Package
70T3339S200BCG is housed in a 256-pin Ball Grid Array (BGA) package measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require 2.5V ±100mV; VDDQ pins must match selected I/O voltage (2.5V or 3.3V) per port based on OPT pin state.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| A0L–A18L / A0R–A18R | Address inputs | 19-bit address bus per port; A17/A18 are no-connect for smaller variants but functional here |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data bus | 18-bit parallel data path per port; supports simultaneous read/write with byte-level granularity via UB/LB |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable inputs | Enables depth expansion: one port can be deselected while other remains active, eliminating need for external decode logic |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | Configures output register behavior: pipelined (1-cycle delay, lower latency under burst) or flow-through (combinatorial, minimal latency) |
| INTL / INTR | Interrupt flag outputs | Active-low open-drain signals indicating pending read/write completion or collision event on respective port |
| COLL / COLR | Collision detection outputs | Asserted when both ports attempt write to same address simultaneously; enables software/hardware resolution protocols |
| ZZL / ZZR | Sleep mode inputs | Asynchronous power-down control: disables dynamic circuitry except JTAG, reducing current to ≤15mA in sleep mode |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables simultaneous, independent read/write access to any memory location - eliminates arbitration overhead in real-time inter-processor communication |
| Self-Timed Write Cycle | Automatically adjusts internal timing to achieve minimum 5ns cycle time at 200MHz without external wait-state generation |
| Dual Cycle Deselect (DCD) | Prevents metastability during rapid port switching by enforcing two-clock-cycle deactivation of chip enables |
| Address Counter with Repeat | On-chip address counter increments automatically on each access; REPEAT input reloads last ADS-loaded address for burst streaming |
| Separate Byte Controls | Independent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte enables per port allow 8-, 9-, or 18-bit data transfers without masking logic |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between line interfaces and switching fabric. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer where ingress port writes while egress port reads concurrently. Use Value: 3.4ns pipelined tCD enables sub-5ns turnaround for 10G+ packet processing; JTAG support simplifies field-upgrade verification. | Use Scenario: Providing low-latency, deterministic memory for FPGA-based digital signal processors handling radar or video streams. IC Role / Device Role / Timing Role: Offloads memory management from FPGA logic; left port interfaces with processor bus, right port feeds DMA engine. Use Value: Independent 2.5V/3.3V I/O per port matches mixed-voltage FPGA I/O banks; collision flags prevent data corruption during concurrent access. |
| Industrial Motion Control | Network Processor Interface |
Use Scenario: Synchronizing position commands and sensor feedback between real-time motion controller and servo drives. IC Role / Device Role / Timing Role: Shared memory node enabling deterministic inter-processor messaging with guaranteed worst-case latency. Use Value: -40°C to +85°C rating ensures reliability in factory-floor enclosures; ZZ sleep mode cuts standby power during idle cycles. | Use Scenario: Interfacing network processors (e.g., NPU or ARM-based SoC) with external classification engines or encryption accelerators. IC Role / Device Role / Timing Role: High-bandwidth bridge memory supporting parallel command/data exchange between heterogeneous processors. Use Value: 14Gbps aggregate bandwidth exceeds typical NPU offload requirements; dual CE enables simplify multi-bank memory mapping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200AXC | 200MHz, 512K × 18, 3.3V core/I/O; no 2.5V core option or JTAG support | Lacks sleep mode and collision detection; requires external level translation for 2.5V systems | Choose when legacy 3.3V-only design mandates pin-compatible replacement without feature parity |
| AS7C331024B-200BIN | 200MHz, 512K × 18, 2.5V core/I/O; no dual-voltage I/O or pipelined mode | Fixed 2.5V interface limits mixed-voltage flexibility; flow-through only limits burst optimization | Prefer for cost-sensitive applications requiring basic dual-port functionality without advanced timing or test features |
Compared with CY7C1362BV33-200AXC and AS7C331024B-200BIN, the 70T3339S200BCG uniquely delivers per-port selectable I/O voltage, IEEE 1149.1 JTAG, and pipelined/flow-through mode switching - critical for next-generation programmable logic and adaptive networking systems requiring flexible, testable, low-latency memory.
Availability
70T3339S200BCG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and high-performance computing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 70T3339S200BCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70T3339S200BCG belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency data exchange between parallel processing elements in networking and real-time control systems.
FAQ
What is the maximum operating frequency of the 70T3339S200BCG and under what conditions?
The 70T3339S200BCG operates at up to 200MHz in commercial temperature range (0°C to +70°C) with 5ns clock cycle time. This rating applies only to the BCG256 package variant; the BF208 fpBGA package is limited to 133MHz. Operation requires stable 2.5V ±100mV core supply and proper termination of all VDDQ pins per port's selected I/O voltage (2.5V or 3.3V).
How does the 70T3339S200BCG handle simultaneous access to the same memory address from both ports?
The 70T3339S200BCG uses true dual-port SRAM cells that permit simultaneous read/write operations to identical addresses. When both ports write concurrently, the COLL/INTR flags assert to signal collision; the final stored value depends on relative timing and is not deterministic. For guaranteed coherency, designers must implement external arbitration or use the collision detection logic to sequence accesses.
Can the left and right ports of the 70T3339S200BCG operate at different I/O voltages?
Yes - the 70T3339S200BCG supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O with VDDQR = 2.5V. This enables seamless interfacing with mixed-voltage SoCs or FPGAs without external level shifters.
What is the purpose of the PL/FTL and PL/FTR pins on the 70T3339S200BCG?
The PL/FTL and PL/FTR pins configure the output register behavior on each port: asserting PL/FTX = VIH enables pipelined mode (1-cycle output delay, optimized for burst throughput), while PL/FTX = VIL enables flow-through mode (combinatorial output, minimal latency). This allows designers to tune timing trade-offs per port - e.g., pipelined for high-speed streaming, flow-through for low-latency control loops.
Does the 70T3339S200BCG support power-saving modes, and how are they activated?
Yes - the 70T3339S200BCG includes a hardware sleep mode activated by asserting ZZL and ZZR high. In sleep mode, dynamic circuitry powers down, reducing current to ≤15mA while preserving data and maintaining JTAG accessibility. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain functional, allowing wake-up via clock or control signal transitions without full reset.
70T3339S200BCG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3339S200BCG FAQ
1.How can I place an order for 70T3339S200BCG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3339S200BCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3339S200BCG reliable?
The price and inventory of 70T3339S200BCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3339S200BCG is usually 5 days.
3.What payment methods are accepted for 70T3339S200BCG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3339S200BCG transactions.
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4.How is shipping managed for 70T3339S200BCG?
70T3339S200BCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3339S200BCG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3339S200BCG?
For technical support, including 70T3339S200BCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3339S200BCG requirements.
6.How does Aetrix verify that 70T3339S200BCG is sourced from the original manufacturer or authorized distributors?
All 70T3339S200BCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3339S200BCG meets industry standards.
7.What is the process for return or replacement of 70T3339S200BCG?
All 70T3339S200BCG units undergo pre-shipment inspection (PSI). If there is an issue with 70T3339S200BCG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3339S200BCG part is unused and in its original packaging.
Return procedure for 70T3339S200BCG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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