Renesas 70T3399S133BFI

Overview

70T3399S133BFI from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 128K × 18-bit organization (2,304Kb), 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and industrial-grade operation up to 133MHz. It supports true simultaneous read/write access on independent left/right ports and delivers 4.2ns max clock-to-data-out in flow-through mode for real-time data buffering in telecom line cards and packet switching engines.

For engineers reviewing the 70T3399S133BFI datasheet, 70T3399S133BFI pinout, 70T3399S133BFI application, or 70T3399S133BFI equivalent, key selection criteria include pipelined vs. flow-through output timing, dual-chip-enable depth expansion capability, JTAG-compliant boundary scan support, and industrial-temperature (-40°C to +85°C) operation at 133MHz with 256-pin BGA packaging.

Technical Context

The 70T3399S133BFI implements fully synchronous dual-port architecture with independent address, data, and control registers on both ports-enabling 1.5ns setup and 0.5ns hold times on all inputs at 200MHz. Its self-timed write logic minimizes cycle time while maintaining deterministic latency.

Each port features configurable I/O voltage via dedicated OPTL/OPTR pins, supporting mixed-voltage system interfacing (e.g., 3.3V CPU side / 2.5V FPGA side). Collision detection and interrupt flags provide hardware-level arbitration between ports without external logic.

Key Specifications

Pinout & Package

70T3399S133BFI is housed in a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm body and 1.0mm ball pitch. All VDD pins require 2.5V connection; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZXI and AS7C3128B-133BIN, the 70T3399S133BFI uniquely combines industrial-temperature 133MHz operation, per-port I/O voltage selection, JTAG testability, and hardware collision detection - making it optimal for new designs requiring robust, mixed-voltage, high-reliability dual-port buffering.

Availability

70T3399S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, FPGA-based instrumentation, and industrial DSP systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3399S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T3339/19/99 family was designed specifically for high-bandwidth, low-latency dual-port buffering in telecom line cards, packet switches, and FPGA co-processing systems where deterministic timing and hardware arbitration are critical.

FAQ

What is the maximum guaranteed operating frequency of the 70T3399S133BFI under industrial conditions?

The 70T3399S133BFI is rated for guaranteed operation at 133MHz across the full industrial temperature range (-40°C to +85°C), with 4.2ns maximum access time in both pipelined and flow-through modes. This specification is validated per IDT DSC-5652/11 and applies exclusively to the S133 speed grade with BC256 packaging.

Does the 70T3399S133BFI support mixed-voltage operation between its left and right ports?

Yes, the 70T3399S133BFI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while OPTR = VSS configures the right port for 2.5V I/O (requiring VDDQR = 2.5V). This enables direct interfacing with heterogeneous SoCs or FPGAs.

How does the collision detection feature work in the 70T3399S133BFI?

The 70T3399S133BFI asserts the COLL and COLR output flags within 4.2ns when both ports attempt simultaneous access to the same memory location. These open-drain signals can directly drive interrupt controllers or external logic, eliminating software polling and enabling immediate hardware resolution - a key advantage over single-flag or no-detection alternatives.

What package type is used for the 70T3399S133BFI, and are there thermal considerations?

The 70T3399S133BFI uses a 256-ball BGA (BC256) package measuring 17mm × 17mm × 1.4mm with 1.0mm pitch. Its thermal resistance (θJA) is 28°C/W typical; for continuous 133MHz operation in industrial environments, a 2-layer PCB with ≥4 thermal vias under the package and 1oz copper pour is recommended to maintain junction temperature below 125°C.

Can the 70T3399S133BFI be used in systems requiring IEEE 1149.1 boundary scan compliance?

Yes, the 70T3399S133BFI integrates full IEEE 1149.1 JTAG boundary scan functionality with TDI, TDO, TCK, TMS, and TRST pins. This allows comprehensive interconnect testing and I/O visibility in high-density BGA layouts - critical for manufacturing test coverage and field diagnostics without physical probe access.