Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 70T3399S166BC

Part No.:
70T3399S166BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3399S166BC.pdf
Description:
IC SRAM 2MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,980

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

70T3399S166BC from Integrated Device Technology is a high-speed 2.5V synchronous dual-port static RAM with 256K × 18-bit organization (4.6 Mbit), 166MHz operation, pipelined/flow-through output modes, and independent 2.5V/3.3V I/O voltage selection per port. It enables simultaneous read/write access to shared memory in real-time digital signal processing systems.

For engineers reviewing the 70T3399S166BC datasheet, 70T3399S166BC pinout, 70T3399S166BC application, or 70T3399S166BC equivalent, key selection criteria include its 3.6ns clock-to-data (pipelined), dual chip enables for depth expansion, JTAG-compliant boundary scan, industrial temperature support (−40°C to +85°C), and 256-pin BGA package with verified pin mapping.

Technical Context

This device implements true dual-port SRAM architecture with fully synchronous operation on both left and right ports, using edge-triggered registers for address, data, and control inputs to achieve tight timing margins (1.5ns setup, 0.5ns hold). Its self-timed write cycle enables minimal 6ns pipelined cycle time at 166MHz.

Each port supports independent voltage configuration via OPTL/OPTR pins-selecting either 2.5V or 3.3V I/O levels-and includes dedicated byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic for burst addressing. Collision detection and interrupt flags provide hardware-level arbitration between ports.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18-bit (4.6 Mbit); A17/A18 are no-connects, confirming 256K depth
Max Clock Frequency166MHz (commercial & industrial grades); validated by tCYC2 ≤ 6ns
Access Time3.6ns clock-to-data (pipelined mode); enables sub-6ns system-level read cycles
I/O Voltage SupportSelectable 2.5V or 3.3V per port via OPTL/OPTR; VDDQ must match selected level
Operating Temperature−40°C to +85°C (industrial grade); specified for full 166MHz performance
Power Supply2.5V ±100mV core (VDD); separate VDDQ rails for each port's I/O domain
JTAG ComplianceIEEE 1149.1 boundary scan support with TCK, TMS, TDI, TDO, TRST

Pinout & Package

70T3399S166BC is housed in a 256-pin Ball Grid Array (BGA) package measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require 2.5V connection; VDDQ pins must be set to 2.5V or 3.3V depending on OPT pin state per port.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputEdge-triggered register control for all inputs; defines timing reference for pipelined/flow-through output modes
A0L–A16L / A0R–A16RAddress inputs17-bit address bus per port; A17/A18 are NC, confirming 256K (218) capacity
I/O0L–I/O17L / I/O0R–I/O17RBidirectional data bus18-bit parallel interface per port; supports independent byte writes via UBL/LBL and UBR/LBR
CE0L/CE1L / CE0R/CE1RDual chip enablesEnable depth expansion without external logic; CE0=VIL & CE1=VIH activates port
R/WL / R/WRRead/write direction controlSynchronous active-high write enable; OE must be low for read outputs
OEL / OEROutput enableAsynchronous control of output drivers; high-Z when asserted, enabling bus sharing
PL/FTL / PL/FTRPipeline/flow-through mode selectTie to VDD (2.5V) for pipelined (3.6ns tCD2); tie to VSS for flow-through (12ns tCD1)
OPTL / OPTRI/O voltage option selectSet to VDD for 3.3V I/O (VDDQ = 3.3V); set to VSS for 2.5V I/O (VDDQ = 2.5V)
ZZL / ZZRSleep mode controlAssert high to disable dynamic inputs (except JTAG); reduces current to ≤15mA
INTL / INTRInterrupt flag outputActive-high pulse indicates port access conflict or user-triggered event
COLL / COLRCollision detection outputAsserted when both ports attempt simultaneous write to same address
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables burst addressing with CNTEN/REPEAT
CNTENL/CNTENR / REPEATL/REPEATRCounter controlCNTEN enables auto-increment; REPEAT resets counter to last ADS-loaded address
TDI/TDO/TCK/TMS/TRSTJTAG test interfaceFully compliant IEEE 1149.1 boundary scan; operates independently of sleep mode

Key Features

FeatureDesign Value
True dual-port memory cellsEnables concurrent read/write access to identical memory locations without arbitration logic
Configurable I/O voltage per portOPTL/OPTR pins allow mixed-voltage system integration (e.g., 2.5V FPGA ↔ 3.3V microcontroller)
Dual-cycle deselect (DCD)Prevents metastability during rapid chip enable toggling in pipelined mode
Hardware collision detectionCOLL/COLR flags assert within 4.2ns of conflicting writes, enabling deterministic error recovery
Address counter with repeat functionReduces address bus overhead in sequential access patterns (e.g., video frame buffers)
JTAG boundary scanSupports IEEE 1149.1 testing without requiring functional operation or exiting sleep mode

Applications

Telecom Line Card BufferingDigital Signal Processor Co-Processor Memory

Use Scenario: High-throughput packet buffering between line interface units and switching fabric in 10Gbps Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory between ingress and egress processors, synchronized to independent 166MHz clocks.

Use Value: 3.6ns pipelined access enables real-time packet header modification and forwarding with <5ns latency penalty versus single-port alternatives.

Use Scenario: Real-time FFT and filtering acceleration in radar signal processing where DSP and host processor share coefficient/data tables.

IC Role / Device Role / Timing Role: Provides non-blocking memory access for simultaneous coefficient reads (DSP port) and result writes (host port) at 166MHz.

Use Value: Independent 2.5V/3.3V I/O support allows direct interfacing to 2.5V DSPs and 3.3V ARM hosts without level shifters.

Industrial Motion Controller FIFOMedical Imaging Data Pipeline Buffer

Use Scenario: Synchronizing encoder feedback and servo command streams in multi-axis CNC controllers operating across −40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Acts as deterministic latency buffer between FPGA-based motion sequencer and real-time CPU, leveraging collision detection for safe parameter updates.

Use Value: Industrial-grade 166MHz operation ensures consistent 6ns cycle time across full temperature range, eliminating thermal derating.

Use Scenario: Temporary storage of raw sensor data from CT/MRI detector arrays before compression and transfer to host PC.

IC Role / Device Role / Timing Role: Dual-port SRAM absorbs bursty pixel data (right port) while streaming processed frames (left port) to PCIe interface at sustained bandwidth.

Use Value: 4.6 Mbit capacity and 14Gbps aggregate bandwidth (2×166MHz×18b) prevent pipeline stalls during high-resolution scan acquisition.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
70T3399S133BCSlower 133MHz max frequency; 4.2ns tCD2; same 256K×18 organization and BGA packageLower power consumption (ISB1 = 140mA vs 200mA at 166MHz); suitable for thermally constrained designsSelect when system clock budget permits relaxed timing and lower standby current is prioritized over peak throughput
70T3399S166BFSame speed grade but in 208-pin fpBGA (15mm×15mm); different pinout and thermal profileSmaller footprint and higher I/O density; not pin-compatible with BC variant due to differing ball map and NC assignmentsChoose for space-constrained PCB layouts where 208-pin fpBGA routing advantages outweigh redesign effort

Compared with 70T3399S133BC and 70T3399S166BF, the 70T3399S166BC delivers optimal balance of 166MHz performance, industrial temperature reliability, and 256-pin BGA mechanical compatibility for high-density backplane applications.

Availability

70T3399S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3399S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T33xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in real-time systems where deterministic timing and hardware arbitration are critical-such as packet switching, DSP co-processing, and motion control.

FAQ

What is the maximum guaranteed operating frequency of the 70T3399S166BC?

The 70T3399S166BC is rated for guaranteed operation up to 166MHz across both commercial (0°C to +70°C) and industrial (−40°C to +85°C) temperature ranges. This is validated by its 6ns maximum clock cycle time (tCYC2) in pipelined mode, with 3.6ns clock-to-data delay (tCD2) under worst-case conditions. The 200MHz speed grade (70T3399S200BC) is not offered in the 256-pin BGA package.

Does the 70T3399S166BC support independent voltage operation on its two ports?

Yes, the 70T3399S166BC supports fully independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while setting OPTR to VSS (0V) configures the right port for 2.5V I/O (requiring VDDQR = 2.5V). This enables seamless interfacing between mixed-voltage subsystems without external level shifters.

How does collision detection work in the 70T3399S166BC, and what is its timing behavior?

The 70T3399S166BC asserts COLL or COLR within 4.2ns of detecting simultaneous write operations to the same memory location from both ports. The collision flag remains asserted until cleared by a subsequent non-conflicting access or reset. This hardware-level detection eliminates software polling overhead and enables deterministic recovery sequences in real-time systems where data coherency is critical.

What is the purpose of the ADS, CNTEN, and REPEAT signals in the 70T3399S166BC?

ADSL/ADSR latches the current address into an internal counter; CNTENL/CNTENR enables automatic increment on each clock cycle; REPEATL/REPEATR resets the counter to the last ADS-loaded address. Together, they implement hardware-assisted burst addressing-reducing address bus traffic in sequential access patterns such as video line buffers or FFT coefficient tables-without consuming CPU cycles or FPGA logic resources.

Can the 70T3399S166BC enter low-power sleep mode, and how is it controlled?

Yes, the 70T3399S166BC supports hardware sleep mode via ZZL and ZZR pins. Asserting either pin high disables dynamic inputs (except JTAG), reducing supply current to ≤15mA. Sleep mode recovery requires three clock cycles (tZZRC), and the device retains all memory contents. This feature is essential for power-gated subsystems in battery-backed or thermally managed applications where periodic memory access is required.

70T3399S166BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
128K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3399S166BC FAQ

1.How can I place an order for 70T3399S166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3399S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3399S166BC reliable?

The price and inventory of 70T3399S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3399S166BC is usually 5 days.

3.What payment methods are accepted for 70T3399S166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3399S166BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3399S166BC?

70T3399S166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3399S166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3399S166BC?

For technical support, including 70T3399S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3399S166BC requirements.

6.How does Aetrix verify that 70T3399S166BC is sourced from the original manufacturer or authorized distributors?

All 70T3399S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3399S166BC meets industry standards.

7.What is the process for return or replacement of 70T3399S166BC?

All 70T3399S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3399S166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3399S166BC part is unused and in its original packaging.

Return procedure for 70T3399S166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T3399S166BC Tags

  • 70T3399S166BC
  • 70T3399S166BC PDF
  • 70T3399S166BC Datasheet
  • 70T3399S166BC Specifications
  • 70T3399S166BC Images
  • Renesas
  • Renesas 70T3399S166BC
  • Buy 70T3399S166BC
  • 70T3399S166BC Price
  • 70T3399S166BC Distributor
  • 70T3399S166BC Supplier
  • 70T3399S166BC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER