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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3399S200BC

Name: 70T3399S200BC
Brand: Renesas
SKU: 70T3399S200BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3399S200BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3399S200BC.pdf

Description:: IC SRAM 2MBIT PARALLEL 256CABGA

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Product details

Overview

70T3399S200BC from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization (9,216,000 bits), 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and pipelined/flow-through output modes. It supports true simultaneous read/write access to the same memory location on independent left/right ports and delivers 5ns cycle time at 200MHz for 14Gbps aggregate bandwidth - used in telecom line cards, packet buffering, and FPGA co-processor interconnects.

For engineers reviewing the 70T3399S200BC datasheet, 70T3399S200BC pinout, 70T3399S200BC application, or 70T3399S200BC equivalent, key selection criteria include dual-port timing margin (1.5ns address setup @ 200MHz), JTAG-compliant IEEE 1149.1 test support, industrial-grade (-40°C to +85°C) availability at 133MHz, and BGA package compatibility with depth expansion via dual chip enables.

Technical Context

This device implements fully synchronous dual-port architecture with independent clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write logic enabling minimal cycle time. Each port features separate byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic (REPEATL/REPEATR) for burst addressing.

It supports dual-cycle deselect (DCD) in pipelined mode, collision detection (COLL/COLR) and interrupt flags (INTL/INTR) for arbitration, and sleep mode (ZZL/ZZR) reducing current to 5–15mA. Power management includes three standby modes (ISB1–ISB4) and full shutdown via CE0/CE1 control - all compliant with IEEE 1149.1 boundary scan.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 18-bit (9.2 Mbit); A18/A17 are no-connect for this variant
Max Operating Frequency	200MHz (commercial only); requires 5ns cycle time (tCYC2) in pipelined mode
Access Time	3.4ns clock-to-data-out (tCD2) in pipelined mode; 10ns in flow-through (tCD1)
Supply Voltages	VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port, selected by OPTL/OPTR
Timing Margins	1.5ns address setup (tSA), 0.5ns hold (tHA); 1.5ns control setup (tSC/tSB/tSW), 0.5ns hold
Operating Temperature	Commercial: 0°C to +70°C; Industrial grade available at 133MHz (−40°C to +85°C)
JTAG Compliance	IEEE 1149.1 boundary scan support with TCK (10MHz), TMS, TDI, TDO, TRST

Pinout & Package

70T3399S200BC is packaged in a 256-pin Ball Grid Array (BGA) with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require 2.5V; VDDQ pins must match OPT pin logic level (3.3V if OPT = VDD, 2.5V if OPT = VSS). VSS pins connect to ground. Pin A18L/A17L and A18R/A17R are no-connect.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port clock input	Synchronous edge-triggered timing reference for left/right port operations
CE0L/CE1L / CE0R/CE1R	Chip enable pair	Dual enables allow depth expansion without external logic; CE0=VIL & CE1=VIH activates port
R/WL / R/WR	Read/write direction control	Asynchronous control; determines data flow direction per access cycle
OEL / OER	Output enable	Asynchronous tri-state control; overrides clock-synchronous outputs
UBL/LBL / UBR/LBR	Byte enable	Selects upper (I/O9–I/O17) or lower (I/O0–I/O8) 9-bit byte per port
ADSL / ADSR	Address strobe	Latches external address into internal counter; enables burst address generation
INTL / INTR	Interrupt flag output	Active-high open-drain signal indicating port contention or user-triggered event
COLL / COLR	Collision detection	Asserts when both ports attempt simultaneous write to same address

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write to identical addresses - eliminates arbitration logic in FPGA-to-ASIC bridging
Selectable pipelined/flow-through output	Pipelined mode cuts tCYC to 5ns (200MHz); flow-through adds latency but simplifies timing closure in legacy systems
Dual chip enables (CE0/CE1)	Supports seamless depth expansion across multiple devices without additional decode logic or glue ICs
Integrated address counter & repeat	Reduces bus overhead in sequential access patterns (e.g., DMA transfers) by auto-incrementing or reusing last ADS-loaded address
JTAG boundary scan (IEEE 1149.1)	Enables in-system testability and debug without physical probe access - critical for high-density telecom PCBs
Independent I/O voltage selection	OPTL/OPTR pins let left/right ports operate at 2.5V or 3.3V simultaneously - bridges mixed-voltage SoC interfaces

Applications

Telecom Packet Buffering	FPGA Co-Processor Interconnect
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line-card ASICs where ingress and egress paths require independent, low-latency memory access. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state buffer between serializer/deserializer (SerDes) and traffic manager - left port handles ingress, right port handles egress. Use Value: 5ns cycle time enables 200MHz line-rate processing; collision detection prevents frame corruption during simultaneous header rewrite and payload fetch.	Use Scenario: High-bandwidth data exchange between Xilinx/Virtex FPGA and external DSP or AI accelerator where deterministic latency and burst transfer efficiency are critical. IC Role / Device Role / Timing Role: Serves as shared scratchpad memory with pipelined outputs synchronized to FPGA clock domains - eliminating FIFO handshaking overhead. Use Value: 14Gbps aggregate bandwidth exceeds PCIe Gen3 x4 throughput; independent VDDQ selection matches FPGA I/O bank voltages (2.5V or 3.3V).
Industrial Motion Controller	Avionics Data Concentrator
Use Scenario: Real-time interpolation and trajectory buffering in CNC controllers where servo loop updates and HMI refresh must occur concurrently without memory contention. IC Role / Device Role / Timing Role: Left port buffers encoder feedback (read-only), right port accepts motion commands (write-only) - collision flags trigger safe-stop protocols. Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliability in uncooled enclosures; sleep mode (ZZL/ZZR) reduces power during idle cycles.	Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O data streams in flight control computers requiring fault-isolated memory access paths. IC Role / Device Role / Timing Role: Provides physically separated read/write channels for safety-critical vs. non-critical subsystems - enforced by independent CE0/CE1 enables and JTAG test isolation. Use Value: IEEE 1149.1 compliance enables DO-254 verification; dual-cycle deselect prevents metastability during rapid mode switching between avionics buses.

Telecom Packet Buffering

FPGA Co-Processor Interconnect

Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line-card ASICs where ingress and egress paths require independent, low-latency memory access.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state buffer between serializer/deserializer (SerDes) and traffic manager - left port handles ingress, right port handles egress.

Use Value: 5ns cycle time enables 200MHz line-rate processing; collision detection prevents frame corruption during simultaneous header rewrite and payload fetch.

Use Scenario: High-bandwidth data exchange between Xilinx/Virtex FPGA and external DSP or AI accelerator where deterministic latency and burst transfer efficiency are critical.

IC Role / Device Role / Timing Role: Serves as shared scratchpad memory with pipelined outputs synchronized to FPGA clock domains - eliminating FIFO handshaking overhead.

Use Value: 14Gbps aggregate bandwidth exceeds PCIe Gen3 x4 throughput; independent VDDQ selection matches FPGA I/O bank voltages (2.5V or 3.3V).

Industrial Motion Controller

Avionics Data Concentrator

Use Scenario: Real-time interpolation and trajectory buffering in CNC controllers where servo loop updates and HMI refresh must occur concurrently without memory contention.

IC Role / Device Role / Timing Role: Left port buffers encoder feedback (read-only), right port accepts motion commands (write-only) - collision flags trigger safe-stop protocols.

Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliability in uncooled enclosures; sleep mode (ZZL/ZZR) reduces power during idle cycles.

Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O data streams in flight control computers requiring fault-isolated memory access paths.

IC Role / Device Role / Timing Role: Provides physically separated read/write channels for safety-critical vs. non-critical subsystems - enforced by independent CE0/CE1 enables and JTAG test isolation.

Use Value: IEEE 1149.1 compliance enables DO-254 verification; dual-cycle deselect prevents metastability during rapid mode switching between avionics buses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-200BZI	3.3V core; 256K × 18-bit; 200MHz; 208-pin TQFP; no JTAG	Lacks IEEE 1149.1 scan; limited to single-voltage I/O (3.3V); smaller density	Choose for cost-sensitive industrial designs where JTAG is unnecessary and board space permits TQFP
AS7C331024B-200BIN	2.5V core; 512K × 18-bit; 200MHz; 256-pin BGA; no pipelined mode or collision detection	Flow-through only; no COLL/INTR flags; no address counter/repeat logic; no sleep mode	Choose when simplified control logic suffices and advanced arbitration features are unused

Compared with CY7C1362BV33-200BZI and AS7C331024B-200BIN, the 70T3399S200BC provides unique value in systems requiring mixed-voltage I/O interfacing, hardware-based collision arbitration, and IEEE-compliant test infrastructure - all within the same 256-pin BGA footprint.

Availability

70T3399S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA-based embedded computing, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3399S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications, computing, and industrial markets.

The 70T3339/19/99 family was designed specifically for ultra-low-latency, high-bandwidth dual-port memory applications in packet-switched networks, real-time control systems, and heterogeneous processor interconnects.

FAQ

What is the maximum operating frequency supported by the 70T3399S200BC?

The 70T3399S200BC supports up to 200MHz operation in commercial temperature range (0°C to +70°C) with 5ns clock cycle time in pipelined mode. This speed grade is not available in the 208-pin fpBGA package - only the 256-pin BGA variant (70T3399S200BC) achieves 200MHz. At 133MHz, industrial temperature operation (−40°C to +85°C) is guaranteed.

Does the 70T3399S200BC support mixed-voltage I/O operation between its two ports?

Yes, the 70T3399S200BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. Both ports can operate at 3.3V, both at 2.5V, or one at each voltage - enabling direct interfacing with mixed-voltage SoCs or FPGAs.

How does collision detection work on the 70T3399S200BC?

The 70T3399S200BC asserts COLL (left port) or COLR (right port) when both ports attempt to write to the same memory address simultaneously. The flag remains active until cleared by a subsequent read or write to that location. Collision detection is hardware-implemented with 3.4ns set time (tCOLS) and operates independently of clock domain alignment - critical for deterministic arbitration in real-time systems using the 70T3399S200BC.

Can the 70T3399S200BC be used in depth-expanded memory configurations?

Yes, the 70T3399S200BC supports depth expansion using dual chip enables (CE0L/CE1L and CE0R/CE1R). When CE0 = VIL and CE1 = VIH, the port is enabled; asserting CE0 = VIH disables the port regardless of CE1 state. This allows stacking multiple 70T3399S200BC devices with shared address/data buses and independent chip select decoding - eliminating need for external logic gates in expanded memory systems.

What power-saving features does the 70T3399S200BC offer?

The 70T3399S200BC offers four power management states: dynamic operation (IDD ≈ 525mA at 200MHz), TTL-level standby (ISB1 ≈ 270mA), CMOS-level full standby (ISB3 ≈ 15mA), and sleep mode (Izz ≈ 5–15mA) activated by ZZL/ZZR. Sleep mode shuts down all dynamic inputs except JTAG, making it ideal for low-power idle states in battery-backed telecom or avionics systems using the 70T3399S200BC.

70T3399S200BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 2Mbit

Memory Organization:: 128K x 18

Memory Interface:: Parallel

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.4 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3399S200BC FAQ

1.How can I place an order for 70T3399S200BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3399S200BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3399S200BC reliable?

The price and inventory of 70T3399S200BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3399S200BC is usually 5 days.

3.What payment methods are accepted for 70T3399S200BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3399S200BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3399S200BC?

70T3399S200BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3399S200BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3399S200BC?

For technical support, including 70T3399S200BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3399S200BC requirements.

6.How does Aetrix verify that 70T3399S200BC is sourced from the original manufacturer or authorized distributors?

All 70T3399S200BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3399S200BC meets industry standards.

7.What is the process for return or replacement of 70T3399S200BC?

All 70T3399S200BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3399S200BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3399S200BC part is unused and in its original packaging.

Return procedure for 70T3399S200BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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