My Inquiry
My Account
Renesas 70T3399S200BC8
- Part No.:
- 70T3399S200BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3399S200BC8.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,472
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70T3399S200BC8 from Integrated Device Technology is a high-speed synchronous dual-port static RAM with 512K × 18-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports 200MHz operation (5ns cycle time), pipelined or flow-through output modes, and simultaneous read/write access on independent left/right ports - used in high-bandwidth packet buffering for telecom line cards and FPGA co-processor memory interfaces.
For engineers reviewing the 70T3399S200BC8 datasheet, 70T3399S200BC8 pinout, 70T3399S200BC8 application, or 70T3399S200BC8 equivalent, key selection criteria include true dual-port timing margins (1.5ns address setup @ 200MHz), JTAG-compliant boundary scan support, industrial-grade thermal range compatibility, and BGA package footprint constraints for dense PCB layouts.
Technical Context
The 70T3399S200BC8 implements fully synchronous dual-port architecture with independent clock domains (CLKL/CLKR), self-timed write control, and dual chip enables (CE0/CE1 per port) enabling seamless depth expansion without external logic. Its memory array uses true dual-port SRAM cells permitting concurrent access to identical addresses across ports without arbitration overhead.
It integrates configurable pipeline/flow-through output mode via PL/FT pins, address counter with ADS/CNTEN/REPEAT controls, and collision/interrupt flags (COLL/INTR) for real-time inter-port coordination. Power management includes TTL- or CMOS-level standby modes and dedicated sleep pins (ZZL/ZZR) that disable dynamic inputs while preserving JTAG functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512K × 18-bit (9Mb total); supports burst data transfers in telecom and networking ASIC/FPGA interfaces |
| Max Clock Frequency | 200MHz (5ns cycle time); enables 14Gbps aggregate bandwidth across both ports |
| Access Time | 3.4ns clock-to-data-out (pipelined mode); meets tight timing closure requirements in high-speed serial link buffers |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (I/O); allows mixed-voltage system integration |
| Operating Temperature | Commercial grade: 0°C to +70°C; validated for stable operation in server backplane and switch fabric environments |
| Package | 256-pin BGA (17mm × 17mm, 1.0mm ball pitch); compatible with standard reflow profiles and automated optical inspection |
| JTAG Support | IEEE 1149.1 compliant; enables in-system test, boundary scan, and debug without requiring external test fixtures |
Pinout & Package
70T3399S200BC8 is housed in a 256-pin Ball Grid Array (BGA) package with 17mm × 17mm body size and 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must be set to 2.5V or 3.3V depending on OPT pin configuration per port. NC pins include A17L, A18L, A17R, and A18R.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Drives internal registers on rising edge; determines all timing windows (setup/hold) for that port |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs | Enable depth expansion: CE0X=VIL & CE1X=VIH selects port; both VIH disables port (standby) |
| R/WL / R/WR | Read/write direction control | Synchronous active-low signal; combined with CE and OE determines read vs. write cycle behavior |
| OEL / OER | Asynchronous output enable | Tri-states I/O bus independently of clock; critical for bus sharing and hot-swap isolation |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | DC-level input (VIH = pipelined, VIL = flow-through); sets output latency and timing model per port |
| ADSL / ADSR | Address strobe enable | Latches current address into internal counter; enables auto-incrementing address sequences for burst transfers |
| INTL / INTR, COLL / COLR | Interrupt and collision flags | Open-drain outputs signaling inter-port conflict or completion; used for handshake protocols between processors |
| ZZL / ZZR | Sleep mode control | Asynchronous input disabling dynamic logic; reduces current to ≤15mA while preserving JTAG accessibility |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to same address across ports - eliminates arbitration logic in shared-memory multiprocessor systems |
| Selectable pipelined or flow-through output | Pipelined mode delivers 3.4ns tCD2 at 200MHz; flow-through mode provides deterministic 10ns tCD1 for low-latency applications |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid port switching by enforcing two-cycle deactivation sequence on chip enables |
| Separate byte controls (UBL/LBL, UBR/LBR) | Allows independent 9-bit upper/lower byte writes per port - essential for partial-word updates in protocol engines |
| Counter enable and repeat functions | Supports automatic address incrementing (CNTEN) and address reload (REPEAT) for DMA-like sequential access patterns |
| JTAG IEEE 1149.1 compliance | Enables production test, in-circuit debugging, and boundary scan verification without modifying board layout or firmware |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line-card ASICs where ingress and egress paths operate concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM serving as zero-wait-state buffer between serializer/deserializer and traffic manager, with independent clock domains. Use Value: Eliminates FIFO synchronization logic and reduces end-to-end latency by enabling simultaneous frame write (ingress) and read (egress) at 200MHz. |
Use Scenario: Providing shared instruction/data memory between host processor and FPGA-accelerated compute engine in embedded vision systems. IC Role / Device Role / Timing Role: High-bandwidth memory bridge allowing CPU to load configuration while FPGA executes real-time image processing kernels. Use Value: 14Gbps aggregate bandwidth sustains full utilization of PCIe Gen2 x4 links feeding FPGA DMA engines without bottlenecking. |
| Industrial PLC Data Exchange | Test Equipment Pattern Memory |
Use Scenario: Real-time exchange of sensor data and control commands between dual-core safety controllers in redundant PLC architectures. IC Role / Device Role / Timing Role: Deterministic inter-processor communication channel with collision detection (COLL flag) and interrupt signaling (INTL/INTR). Use Value: Collision flags provide hardware-level synchronization assurance, reducing software polling overhead and improving worst-case response time predictability. |
Use Scenario: Storing stimulus/response vectors in automated test equipment (ATE) for semiconductor device validation at multi-GHz rates. IC Role / Device Role / Timing Role: High-speed pattern memory accessed by digital pattern generator and comparator subsystems operating on separate clocks. Use Value: Pipelined output mode ensures consistent 3.4ns tCD2 across temperature, enabling sub-nanosecond timing margin control for >1GHz test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200AXC | 3.3V core; no 2.5V option; 208-pin TQFP package; max 200MHz but only with 3.3V I/O | Requires redesign of power delivery and PCB layout; lacks JTAG and sleep mode features | Choose only if legacy 3.3V-only system integration is mandatory and BGA placement is prohibited |
| AS7C35128PFS-20BIN | Single-port architecture; 512K × 16-bit; 2.5V core; 200MHz max; no pipelined mode or collision detection | Cannot support true concurrent access; requires external arbitration logic for multi-master use cases | Select when cost sensitivity outweighs need for dual-port concurrency and inter-port signaling features |
Compared with CY7C1362BV33-200AXC and AS7C35128PFS-20BIN, the 70T3399S200BC8 uniquely delivers 2.5V core + flexible I/O voltage per port, integrated JTAG, hardware collision detection, and pipelined/flow-through mode selection - making it the only option supporting high-reliability, mixed-voltage, dual-clock domain designs without external glue logic.
Availability
70T3399S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and test equipment applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 70T3399S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.
The 70T3339/19/99 family was designed specifically for high-speed, low-latency dual-port memory applications in networking ASICs, FPGA-based accelerators, and real-time control systems demanding deterministic access and hardware-coordinated inter-processor communication.
FAQ
What is the maximum operating frequency of the 70T3399S200BC8?
The 70T3399S200BC8 is rated for 200MHz operation (5ns cycle time) in commercial temperature range (0°C to +70°C). This performance is achievable only in the 256-pin BGA package; the 208-pin fpBGA variant does not support 200MHz. The device maintains 3.4ns clock-to-data-out timing in pipelined mode at this speed, verified under VDD = 2.5V ±100mV and specified load conditions.
Does the 70T3399S200BC8 support mixed-voltage operation between its two ports?
Yes, the 70T3399S200BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. One port can operate at 3.3V levels (OPTX = VDD, VDDQX = 3.3V) while the other operates at 2.5V (OPTX = VSS, VDDQX = 2.5V). This enables seamless interfacing with heterogeneous logic families - for example, connecting to a 3.3V microcontroller on the left port and a 2.5V FPGA on the right port - without level-shifting components.
How does the collision detection feature work in the 70T3399S200BC8?
The 70T3399S200BC8 asserts COLL or COLR output flags when both ports attempt to access the same memory location simultaneously - regardless of read/write combination. Detection occurs within 3.4ns (tCOLS) of the violating clock edge. These open-drain signals can drive external interrupt controllers or trigger software recovery routines. The flag remains asserted until cleared by completing a valid access cycle on the contending port, ensuring reliable inter-processor coordination in safety-critical systems.
Can the 70T3399S200BC8 be used in industrial temperature applications?
No - the 70T3399S200BC8 suffix "S200BC8" denotes Commercial grade (0°C to +70°C) and 200MHz speed grade. Industrial temperature support (-40°C to +85°C) is only available for the S133 and S166 variants (e.g., 70T3399S133BC8). Attempting to operate the 70T3399S200BC8 outside its rated temperature range may result in timing violations, increased leakage current, or functional failure, particularly in pipelined mode where setup/hold margins are most sensitive.
What is the purpose of the REPEAT and CNTEN pins on the 70T3399S200BC8?
REPEAT and CNTEN enable hardware-addressed burst operations: CNTEN activates the internal address counter on each clock edge, auto-incrementing the address after every access; REPEAT resets the counter to the last address loaded via ADS (Address Strobe). Together, they allow the 70T3399S200BC8 to execute sequential memory accesses - such as loading instruction streams or streaming sensor data - without continuous address bus updates from the controller, reducing bus overhead and improving throughput efficiency.
70T3399S200BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3399S200BC8 FAQ
1.How can I place an order for 70T3399S200BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3399S200BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3399S200BC8 reliable?
The price and inventory of 70T3399S200BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3399S200BC8 is usually 5 days.
3.What payment methods are accepted for 70T3399S200BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3399S200BC8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3399S200BC8?
70T3399S200BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3399S200BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3399S200BC8?
For technical support, including 70T3399S200BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3399S200BC8 requirements.
6.How does Aetrix verify that 70T3399S200BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3399S200BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3399S200BC8 meets industry standards.
7.What is the process for return or replacement of 70T3399S200BC8?
All 70T3399S200BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3399S200BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3399S200BC8 part is unused and in its original packaging.
Return procedure for 70T3399S200BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3399S200BC8 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
