Renesas 70T3509MS133BPI

Overview

70T3509MS133BPI from IDT (now Renesas) is a high-speed synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location across independent left and right ports. It delivers 1024K × 36-bit (4.5 Mbit) capacity, 133 MHz operation, 4.2 ns clock-to-data-out in pipelined mode, and supports mixed 2.5V core / selectable 2.5V or 3.3V I/O interfaces - used in high-throughput packet buffering, FPGA co-processor memory, and real-time digital signal processing systems.

For engineers reviewing the 70T3509MS133BPI datasheet, 70T3509MS133BPI pinout, 70T3509MS133BPI application, or 70T3509MS133BPI equivalent, key selection criteria include pipelined vs. flow-through output timing, per-port voltage configuration via OPT pins, dual-cycle deselect behavior, JTAG boundary scan support, and sleep-mode current reduction down to 20 mA.

Technical Context

This device implements fully synchronous dual-port SRAM architecture with independent clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write cycles enabling 7.5 ns minimum cycle time at 133 MHz. Each port features dedicated byte enables (BE0–BE3), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic for burst address generation.

It integrates JTAG TAP controller (TCK/TMS/TDI/TDO/TRST) compliant with IEEE 1149.1, interrupt flag outputs (INTL/INTR), and independent sleep control (ZZL/ZZR) that disables dynamic inputs while preserving JTAG accessibility. Power management includes four standby current modes (ISB1–ISB4) and full-sleep mode (Izz) with 20–80 mA draw.

Key Specifications

Pinout & Package

70T3509MS133BPI is housed in a 256-pin Ball Grid Array (BP256) package with 1.0 mm pitch, 17 mm × 17 mm footprint, and 1.76 mm nominal thickness. The package supports common BGA footprints across seven density generations (512K to 36M-bit), enabling scalable design reuse.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZXI and AS7C331025B-133BIN, the 70T3509MS133BPI uniquely combines per-port voltage flexibility, integrated JTAG, hardware address counter with repeat, and sub-80 mA sleep current - making it optimal for new industrial and telecom designs demanding scalability, testability, and power efficiency.

Availability

70T3509MS133BPI is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA acceleration, broadcast video synchronization, and industrial motion control applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 70T3509MS133BPI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance analog, mixed-signal, and memory solutions for communications, computing, and industrial markets.

The 70T3509MS133BPI belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency, multi-clock domain interoperability, and power-aware operation in real-time embedded systems.

FAQ

What is the maximum operating frequency and corresponding access time for the 70T3509MS133BPI?

The 70T3509MS133BPI supports up to 133 MHz operation with a minimum clock cycle time of 7.5 ns in pipelined mode. Its clock-to-data-out time is guaranteed at 4.2 ns (tCD2) under industrial conditions. In flow-through mode, the access time extends to 15 ns (tCD1) with a 25 ns minimum cycle time. These values are validated across −40°C to +85°C ambient temperature and specified for both commercial and industrial grades of the 70T3509MS133BPI.

How does the per-port voltage selection work on the 70T3509MS133BPI?

The 70T3509MS133BPI uses OPTL and OPTR pins to independently configure each port's I/O voltage level: setting OPTL to VDD (2.5 V) selects 3.3 V I/O operation for the left port (requiring VDDQL = 3.3 V), while setting it to VSS (0 V) selects 2.5 V I/O (requiring VDDQL = 2.5 V). The same applies to OPTR/VDDQR for the right port. This enables mixed-voltage interfacing - for example, connecting the left port to a 3.3 V PHY and the right port to a 2.5 V FPGA bank - without external level shifters.

Does the 70T3509MS133BPI support hardware address generation, and how is it configured?

Yes, the 70T3509MS133BPI includes an integrated address counter with ADSL/ADSR, CNTENL/CNTENR, and REPEATL/REPEATR controls. When CNTENX is low on a rising CLK edge, the internal address advances automatically. ADSX latches an external address as the base; asserting REPEATX resets the counter to that latched value. This enables autonomous burst addressing for FIFO, circular buffer, or line-scan applications - eliminating the need for external counter logic or CPU intervention during high-speed data streaming.

What power-saving modes does the 70T3509MS133BPI offer, and how are they activated?

The 70T3509MS133BPI provides three power-saving states: standby (ISB1–ISB4, 20–1090 mA), full standby (ISB3, 20–80 mA), and sleep mode (Izz, 20–80 mA). Standby is entered by disabling chip enables (CE0X = VIH, CE1X = VIL); full standby requires CMOS-level inputs and zero-frequency operation; sleep mode is activated by asserting ZZL or ZZR high. Sleep mode shuts off all dynamic inputs except JTAG, preserving testability while minimizing current draw - critical for battery-backed or thermally constrained systems using the 70T3509MS133BPI.

Is JTAG boundary scan supported on the 70T3509MS133BPI, and what are its operational limits?

Yes, the 70T3509MS133BPI integrates a full IEEE 1149.1-compliant JTAG TAP controller with TCK, TMS, TDI, TDO, and TRST pins. It operates at up to 10 MHz and remains functional even when ZZL/ZZR are asserted (though Renesas recommends avoiding JTAG use during sleep mode). The boundary scan chain supports interconnect testing of PCB traces connected to the 256-ball BGA, enabling validation of solder joints and routing integrity without physical probe access - a key advantage for high-density telecom and industrial modules using the 70T3509MS133BPI.