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Renesas 70T3519S133BC

Part No.:
70T3519S133BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3519S133BC.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,151

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Product details

Overview

70T3519S133BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports independent 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric and network packet buffering.

For engineers reviewing the 70T3519S133BC datasheet, 70T3519S133BC pinout, 70T3519S133BC application, or 70T3519S133BC equivalent, this device delivers deterministic low-latency memory access with dual chip enables for depth expansion, JTAG-compliant boundary scan, industrial temperature support (–40°C to +85°C), and sleep-mode power management via ZZL/ZZR pins.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz) and fast clock-to-data-out (4.2ns max in flow-through mode). Its dual-port memory array uses true dual-port cells, not pseudo-dual-port or FIFO-based emulation.

The architecture includes independent address counters with ADS strobe, CNTEN enable, and REPEAT latch per port; separate byte-enable logic (BE0–BE3) for 9-bit granularity writes; and collision/interrupt flag generation for inter-port coordination. Power management includes CE-driven standby and ZZ-pin–activated deep-sleep mode with 5mA typical current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256K × 36 bits (9.2 Mbit); supports 256K-word addressing with 36-bit parallel I/O per port.
Max Clock Frequency 133MHz (7.5ns cycle time); validated for industrial temp range –40°C to +85°C.
Access Time 4.2ns max (flow-through mode); enables sub-8ns system-level memory latency in burst-read applications.
Supply Voltages VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port, selected independently via OPTL/OPTR.
Operating Temperature Industrial grade: –40°C to +85°C; qualified for telecom infrastructure and industrial control systems.
Package 256-pin BGA (BC256); 17mm × 17mm body, 1.0mm ball pitch, RoHS-compliant green variant available.
Power Consumption 260mA max dynamic current (both ports active); 5mA typical full-standby (ISB3) and sleep-mode (Izz) current.

Pinout & Package

70T3519S133BC is housed in a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin selection (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Edge-triggered master timing reference for all registered inputs/outputs on respective port.
A0L–A17L / A0R–A17R Address inputs 18-bit address bus per port; A17 is functional for 256K×36 configuration (not NC).
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional data I/O 36-bit parallel data path per port; supports byte-wise write masking via BE0–BE3.
CE0L/CE1L / CE0R/CE1R Dual chip enables Enable/disable port access; dual CE allows seamless depth expansion without external logic.
R/WL / R/WR Read/write direction control Synchronous active-high signal determining data flow direction on next clock edge.
OEL / OER Output enable Asynchronous control of output drivers; tri-states I/Os when deasserted (high).
PL/FTL / PL/FTR Pipeline/Flow-through mode select DC input selecting output timing: pipelined (1-cycle latency) or flow-through (0-cycle latency).
ZZL / ZZR Sleep mode control Asynchronous active-high input disabling dynamic circuitry per port while preserving JTAG access.

Key Features

Feature Design Value
True dual-port memory cell architecture Enables concurrent, independent read/write access to identical memory addresses-critical for real-time inter-processor communication and ping-pong buffering.
Dual-cycle deselect (DCD) in pipelined mode Guarantees reliable bus release after two clock cycles when chip enables are deasserted-prevents metastability during port arbitration.
Independent I/O voltage selection per port OPTL/OPTR pins allow one port to interface with 3.3V logic and the other with 2.5V logic-eliminates level-shifter components in mixed-voltage systems.
Hardware address counter with repeat function ADSL/ADSR + CNTENL/CNTENR + REPEATL/REPEATR enable auto-incrementing burst reads/writes without CPU intervention-reduces controller overhead in packet processing.
JTAG boundary scan compliance (IEEE 1149.1) Full TAP controller with TDI/TDO/TCK/TMS/TRST supports in-system test and debug without requiring external test fixtures.

Applications

Telecom Switching Fabric Network Packet Buffering

Use Scenario: High-throughput line cards in carrier-grade routers performing header inspection and forwarding decisions.

IC Role / Device Role / Timing Role: Dual-port SRAM serves as shared buffer between ingress and egress traffic managers, enabling zero-latency crossbar arbitration.

Use Value: 133MHz operation with 4.2ns access time ensures sub-10ns memory turnaround for 10Gbps+ packet processing pipelines.

Use Scenario: Deep packet inspection engines requiring temporary storage of fragmented IPv6 packets before reassembly.

IC Role / Device Role / Timing Role: Left port accepts incoming packet fragments from DMA; right port feeds reassembly engine-coordinated via interrupt/collision flags.

Use Value: True dual-port capability eliminates software synchronization overhead, reducing average packet latency by >30% versus single-port alternatives.

Industrial PLC Data Exchange Medical Imaging Frame Store

Use Scenario: Real-time motion control systems where servo drives and safety controllers share sensor fusion data.

IC Role / Device Role / Timing Role: Acts as deterministic shared memory between two isolated microcontrollers-one handling motion trajectory, the other managing safety monitoring.

Use Value: Collision detection logic (COLL/COLR) provides hardware-enforced mutual exclusion, preventing race conditions without software locks.

Use Scenario: Digital radiography systems capturing 16-bit grayscale X-ray frames at 30fps for real-time display and DICOM export.

IC Role / Device Role / Timing Role: Buffers full-resolution frames (4096×4096×16b) between image sensor interface and JPEG compression engine.

Use Value: Pipelined output mode delivers sustained 133MHz throughput across 36-bit bus-supporting >1.9 Gbps frame streaming without bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZI 133MHz, 256K×36, 3.3V core/I/O; no 2.5V option; lacks JTAG and sleep mode. Requires external level shifters for 2.5V SoCs; no hardware collision detection or interrupt flags. Choose when legacy 3.3V-only design exists and JTAG/testability is not required.
AS7C3256B-133JCIN 133MHz, 256K×36, 3.3V only; no dual-voltage I/O; no pipelined mode or address counter. Limited to basic dual-port use cases; no burst-addressing acceleration or low-power sleep states. Choose for cost-sensitive applications where advanced features like REPEAT or ZZ mode are unnecessary.

Compared with CY7C1362BV33-133BZI and AS7C3256B-133JCIN, the 70T3519S133BC uniquely combines industrial temperature rating, per-port I/O voltage flexibility, hardware address counters, and JTAG testability-making it the only option supporting mixed-voltage, low-power, and test-ready designs in a single package.

Availability

70T3519S133BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3519S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management solutions for high-performance computing and communications.

The 70T35xx family was designed specifically for deterministic, low-latency memory sharing between heterogeneous processors and ASICs in telecom, networking, and real-time control systems.

FAQ

What is the maximum operating frequency of the 70T3519S133BC at industrial temperature?

The 70T3519S133BC is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C), with guaranteed 7.5ns clock cycle time and 4.2ns max access time in flow-through mode. This specification is validated per datasheet Table 11 and applies to both ports simultaneously under worst-case voltage and temperature conditions.

Does the 70T3519S133BC support independent voltage selection for each port's I/O interface?

Yes-the 70T3519S133BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This enables direct interfacing with mixed-voltage SoCs without external level shifters.

How does the address counter function work on the 70T3519S133BC?

The 70T3519S133BC implements independent address counters on each port using ADSx (address strobe), CNTENx (counter enable), and REPEATx signals. When CNTENx is asserted, the internal address increments on each CLK edge regardless of CE state. ADSx loads an external address into the counter; REPEATx resets the counter to that last loaded address-enabling efficient burst transfers without CPU address updates.

What power-saving modes does the 70T3519S133BC support?

The 70T3519S133BC offers three power-saving mechanisms: (1) CE-driven standby (ISB1–ISB4), (2) full CMOS-level standby (ISB3, 5mA typ), and (3) deep-sleep mode activated by asserting ZZL and/or ZZR (Izz = 5mA typ). Sleep mode disables all dynamic inputs except JTAG, preserving test access while cutting active current by >95%.

Is JTAG boundary scan supported on the 70T3519S133BC?

Yes-the 70T3519S133BC implements full IEEE 1149.1 JTAG boundary scan with dedicated TDI, TDO, TCK, TMS, and TRST pins. This functionality is available in the BC256 BGA package and enables in-system testing, interconnect verification, and programming of adjacent devices without physical probe access.

70T3519S133BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3519S133BC FAQ

1.How can I place an order for 70T3519S133BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S133BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S133BC reliable?

The price and inventory of 70T3519S133BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133BC is usually 5 days.

3.What payment methods are accepted for 70T3519S133BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S133BC?

70T3519S133BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S133BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S133BC?

For technical support, including 70T3519S133BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133BC requirements.

6.How does Aetrix verify that 70T3519S133BC is sourced from the original manufacturer or authorized distributors?

All 70T3519S133BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133BC meets industry standards.

7.What is the process for return or replacement of 70T3519S133BC?

All 70T3519S133BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S133BC part is unused and in its original packaging.

Return procedure for 70T3519S133BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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