Renesas 70T3519S133BC8

Overview

70T3519S133BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric.

For engineers reviewing the 70T3519S133BC8 datasheet, 70T3519S133BC8 pinout, 70T3519S133BC8 application, or 70T3519S133BC8 equivalent, key selection criteria include dual-port timing latency, per-port voltage configuration (OPTL/OPTR), sleep mode current (5–20mA), JTAG compliance (IEEE 1149.1), and industrial temperature support (−40°C to +85°C) at 133MHz.

Technical Context

This device implements fully synchronous operation on both ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns/0.5ns) at 200MHz. Its dual-chip-enable architecture allows depth expansion without external logic, while counter enable (CNTENL/CNTENR) and repeat (REPEATL/REPEATR) functions support sequential burst addressing.

The memory integrates interrupt and collision detection flags (INTR/COLR, INTL/COLL), pipelined output mode (PL/FTR/PL/FTL), and independent power-down control via CE0/CE1 per port. Core VDD is fixed at 2.5V ±100mV; I/O voltage (VDDQL/VDDQR) is configurable to either 3.3V ±150mV or 2.5V ±100mV using OPT pins.

Key Specifications

Pinout & Package

70T3519S133BC8 is packaged in a 256-pin Ball Grid Array (BGA) with 1.0mm ball pitch and 17mm × 17mm body size. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133AXC and IDT70V25S133PFI, the 70T3519S133BC8 uniquely supports per-port 2.5V/3.3V I/O configuration, integrated sleep mode (ZZL/ZZR), and IEEE 1149.1 JTAG-making it optimal for power-constrained, mixed-voltage telecom and defense platforms requiring production testability.

Availability

70T3519S133BC8 is available at Aetrix Electronics and suitable for telecom switching fabric, network processor buffering, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.

Supply support for 70T3519S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T35xx family targets high-bandwidth, low-latency dual-port memory applications in telecom infrastructure, network processors, and real-time control systems-emphasizing deterministic timing, flexible voltage interfaces, and robust testability.

FAQ

What is the maximum operating frequency of the 70T3519S133BC8 in industrial temperature range?

The 70T3519S133BC8 is rated for 133MHz operation across the full industrial temperature range of −40°C to +85°C. This is validated in both pipelined (7.5ns cycle time) and flow-through (25ns cycle time) modes. The 166MHz speed grade is not offered in the BC8 package variant, and 200MHz operation is commercial-grade only.

How does the OPT pin configuration affect I/O voltage levels on the 70T3519S133BC8?

On the 70T3519S133BC8, OPTL and OPTR independently configure each port's I/O voltage: setting OPTX to VDD (2.5V) selects 3.3V I/O levels (requiring VDDQX = 3.3V), while setting OPTX to VSS (0V) selects 2.5V I/O levels (requiring VDDQX = 2.5V). This allows mixed-voltage interfacing-for example, left port at 3.3V to an FPGA, right port at 2.5V to a DSP-without external level shifters.

Does the 70T3519S133BC8 support JTAG boundary scan, and what are the requirements?

Yes, the 70T3519S133BC8 supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. JTAG functionality is available only in the 256-pin BGA (BC8) and 208-pin fpBGA (BF208) packages-not in the PQFP (DR208) variant. Boundary scan operates independently of sleep mode (ZZ pins) but should not be executed during active sleep.

What is the purpose of the REPEAT and CNTEN signals on the 70T3519S133BC8?

On the 70T3519S133BC8, CNTENL/R enables automatic address increment on each clock cycle for burst transfers, while REPEATL/R resets the internal address counter to the last valid ADS-loaded address. This pair enables efficient sequential memory access-e.g., loading a block of coefficients into a DSP-without continuous host CPU address updates, reducing bus overhead and improving throughput.

How does sleep mode (ZZL/ZZR) impact power consumption and signal behavior on the 70T3519S133BC8?

Asserting ZZL or ZZR to VIH places the corresponding port into sleep mode, reducing dynamic current to 5–20mA (ISB3) while retaining JTAG accessibility. During sleep, all dynamic inputs (clock, address, data) are disabled except JTAG pins; static inputs (PL/FTx, OPTx, ZZx) remain active. Outputs enter high-impedance state, and internal registers retain data-enabling fast wake-up (<3 cycles) without data loss.