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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3519S133BFGI

Name: 70T3519S133BFGI
Brand: Renesas
SKU: 70T3519S133BFGI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3519S133BFGI

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3519S133BFGI.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

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Product details

Overview

70T3519S133BFGI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true concurrent left/right port access, 4.2 ns max clock-to-data (pipelined mode), 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port-designed for real-time packet buffering in telecom line cards and FPGA co-processor memory interfaces.

For engineers reviewing the 70T3519S133BFGI datasheet, 70T3519S133BFGI pinout, 70T3519S133BFGI application, or 70T3519S133BFGI equivalent, key selection criteria include pipelined vs. flow-through output timing, independent port voltage configuration via OPT pins, industrial temperature support at 133 MHz, and BGA package compatibility with high-density PCB layouts.

Technical Context

This device implements fully synchronous dual-port architecture with separate address, data, and control registers on both left and right ports-enabling simultaneous read/write operations to the same memory location without arbitration logic. It supports JTAG IEEE 1149.1 boundary scan and features dedicated interrupt and collision detection flags for inter-processor coordination.

The memory uses self-timed write cycles and dual-cycle deselect (DCD) in pipelined mode to achieve 5 ns cycle time at 200 MHz (commercial grade). Each port has independent pipeline/flow-through selection (PL/FTL/R), counter enable (CNTENL/R), repeat address latch (REPEATL/R), and byte-enable granularity (BE0–BE3 for 9-bit bytes).

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 bits (9Mbit total); enables 36-bit wide data paths for high-throughput burst transfers
Max Clock Frequency	133 MHz (industrial temp); guarantees deterministic 7.5 ns min clock cycle in pipelined mode
Access Time (tCD2)	4.2 ns max (pipelined); delivers sub-5 ns data valid after clock edge for tight timing closure
Supply Voltages	VDD = 2.5V ±100 mV (core); VDDQ = 2.5V or 3.3V ±150/±100 mV per port (configurable via OPTL/R)
Operating Temperature	−40°C to +85°C; validated for industrial-grade reliability in base station and industrial controller environments
Package	208-pin fine-pitch BGA (BFG208); 15 mm × 15 mm body, 0.8 mm ball pitch, RoHS-compliant green variant
Power Management	Sleep mode (ZZL/ZZR) reduces current to ≤15 mA; full standby (ISB3) draws only 5 mA typ at f = 0

Pinout & Package

70T3519S133BFGI is housed in a 208-pin fpBGA (BFG208) package with 0.8 mm ball pitch and 15 mm × 15 mm footprint. Power and ground balls are distributed across the array for low-inductance decoupling; VDD/VDDQ/VSS balls are explicitly assigned per datasheet pin map.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Edge-triggered master clock for all register transfers on left/right port; must meet tCH2/tCL2 timing for pipelined operation
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17L/A17R are no-connect for this variant (70T3519), enabling 256K depth addressing
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit parallel data path per port; supports byte-wise writes via BE0–BE3 (9-bit granularity)
CE0L/CE1L / CE0R/CE1R	Chip enable pair	Dual CE architecture allows seamless depth expansion without external logic; CE0=low + CE1=high enables port
PL/FTL / PL/FTR	Pipeline/Flow-through select	DC-level input (VIH/VIL) configures output latency: VIH = 1-cycle pipelined, VIL = zero-latency flow-through
OPTL / OPTR	I/O voltage option control	Configures per-port I/O voltage: VDD (2.5V) → 3.3V interface; VSS (0V) → 2.5V interface; sets required VDDQL/VDDQR
ZZL / ZZR	Sleep mode enable	Asynchronous active-high signal disabling dynamic inputs (except JTAG); reduces power to ISB3 level within 2 cycles
INTR / COLR / INTL / COLL	Status flag outputs	Open-drain interrupt/collision alerts; require external pull-up; indicate port contention or user-triggered events

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous, independent read/write access to identical addresses-eliminates arbitration overhead in lockstep systems
Selectable pipelined or flow-through output mode	Per-port PL/FTx control allows mixing of low-latency (flow-through) and high-throughput (pipelined) timing in same design
Independent port voltage configuration	OPTL/R pins allow left port at 3.3V and right port at 2.5V-interfacing legacy and modern logic families without level shifters
Address counter with repeat and strobe	ADSL/R + CNTENL/R + REPEATL/R enable auto-incrementing burst reads/writes and address loopback for circular buffers
JTAG IEEE 1149.1 compliance	Full boundary-scan support (TCK/TMS/TDI/TDO/TRST) for production test and in-system debug-verified on BFG208 package
Dual chip enable depth expansion	CE0/CE1 pairing permits stacking multiple devices for wider memory without address decoding logic or glue ICs

Applications

Telecom Packet Buffering	FPGA Co-Processor Memory
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line interface units where ingress and egress paths operate concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between MAC and PHY layers-left port handles receive FIFO, right port handles transmit FIFO. Use Value: 4.2 ns pipelined tCD2 ensures minimal latency between frame arrival and forwarding decision; 133 MHz industrial rating sustains throughput under thermal stress.	Use Scenario: Providing low-latency, high-bandwidth memory for Xilinx or Intel FPGA-based digital signal processors performing real-time filtering or FFT. IC Role / Device Role / Timing Role: Off-chip memory extension with deterministic access-FPGA controls left port, DSP or DMA engine controls right port. Use Value: Independent 2.5V/3.3V I/O per port matches FPGA bank voltages and processor I/O standards without level translation.
Industrial Motion Controller	Avionics Data Acquisition
Use Scenario: Real-time interpolation buffer in CNC controllers where position commands and feedback samples must be synchronized at microsecond resolution. IC Role / Device Role / Timing Role: Shared memory between motion CPU and servo interface ASIC-CPU writes setpoints, ASIC reads and generates PWM updates. Use Value: −40°C to +85°C operation ensures reliability in uncooled enclosures; collision detection flags prevent command overwrite during rapid updates.	Use Scenario: Buffered sensor fusion in flight control computers aggregating inertial, pressure, and GPS data streams before Kalman filtering. IC Role / Device Role / Timing Role: Time-critical data staging memory-left port accepts ADC samples, right port feeds filter engine with aligned timestamped vectors. Use Value: JTAG boundary scan enables in-flight diagnostics; sleep mode (ZZL/R) reduces power during idle phases without losing state.

Telecom Packet Buffering

FPGA Co-Processor Memory

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line interface units where ingress and egress paths operate concurrently.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between MAC and PHY layers-left port handles receive FIFO, right port handles transmit FIFO.

Use Value: 4.2 ns pipelined tCD2 ensures minimal latency between frame arrival and forwarding decision; 133 MHz industrial rating sustains throughput under thermal stress.

Use Scenario: Providing low-latency, high-bandwidth memory for Xilinx or Intel FPGA-based digital signal processors performing real-time filtering or FFT.

IC Role / Device Role / Timing Role: Off-chip memory extension with deterministic access-FPGA controls left port, DSP or DMA engine controls right port.

Use Value: Independent 2.5V/3.3V I/O per port matches FPGA bank voltages and processor I/O standards without level translation.

Industrial Motion Controller

Avionics Data Acquisition

Use Scenario: Real-time interpolation buffer in CNC controllers where position commands and feedback samples must be synchronized at microsecond resolution.

IC Role / Device Role / Timing Role: Shared memory between motion CPU and servo interface ASIC-CPU writes setpoints, ASIC reads and generates PWM updates.

Use Value: −40°C to +85°C operation ensures reliability in uncooled enclosures; collision detection flags prevent command overwrite during rapid updates.

Use Scenario: Buffered sensor fusion in flight control computers aggregating inertial, pressure, and GPS data streams before Kalman filtering.

IC Role / Device Role / Timing Role: Time-critical data staging memory-left port accepts ADC samples, right port feeds filter engine with aligned timestamped vectors.

Use Value: JTAG boundary scan enables in-flight diagnostics; sleep mode (ZZL/R) reduces power during idle phases without losing state.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133BZXI	3.3V-only core/I/O; no OPT-selectable voltage; 133 MHz max, but only commercial temp (0°C to +70°C)	Lacks industrial temperature support and per-port voltage flexibility-unsuitable for extended ambient deployments	Choose only if system operates strictly within commercial temp range and uses uniform 3.3V logic throughout
AS7C3256B-133JIN	Asynchronous dual-port; no clock domain separation; 133 MHz access time but no pipelined mode or JTAG	No synchronous timing control or boundary scan-requires external handshake logic and lacks production testability	Select when deterministic clock-to-data timing is not required and board space permits discrete control logic

Compared with CY7C1362BV33-133BZXI and AS7C3256B-133JIN, the 70T3519S133BFGI uniquely delivers industrial-temperature synchronous dual-port operation with per-port voltage configurability and IEEE 1149.1 JTAG-making it the only option for ruggedized, high-integrity embedded systems requiring both timing precision and test coverage.

Availability

70T3519S133BFGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70T3519S133BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a semiconductor company specializing in timing, memory interface, RF, and power management solutions for communications and computing markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in networking equipment, test instrumentation, and real-time control systems-emphasizing synchronous timing integrity and robust industrial operation.

FAQ

What is the maximum operating frequency of the 70T3519S133BFGI at industrial temperature?

The 70T3519S133BFGI is rated for 133 MHz operation across the full industrial temperature range of −40°C to +85°C. This is verified in the datasheet's AC Electrical Characteristics table (page 12), where tCYC2 (pipelined clock cycle time) is guaranteed at 7.5 ns min, corresponding to 133 MHz. The S133 suffix explicitly denotes this speed grade and temperature qualification.

Does the 70T3519S133BFGI support independent voltage configuration on left and right ports?

Yes, the 70T3519S133BFGI supports independent I/O voltage selection per port using OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This capability is documented in Pin Names table (page 6) and DC Operating Conditions (pages 8–9).

What package type and pin count does the 70T3519S133BFGI use?

The 70T3519S133BFGI uses a 208-pin fine-pitch Ball Grid Array (fpBGA) package designated BFG208. Its mechanical dimensions are 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. This is confirmed in the Pin Configuration section (page 5) and ordering information footnote "BFG208(7)" on page 5 of the datasheet.

How does the 70T3519S133BFGI handle memory access collisions between ports?

The 70T3519S133BFGI detects simultaneous accesses to the same address via dedicated collision logic, asserting COLL (left port) and COLR (right port) open-drain output flags within 4.2 ns (tCOLS). These flags remain asserted until cleared by software or hardware reset, enabling deterministic arbitration in real-time systems. Collision timing is specified in Table 11 (page 12) and functional block diagram (page 1).

Is JTAG boundary scan supported on the 70T3519S133BFGI in its BFG208 package?

Yes, JTAG IEEE 1149.1 boundary scan is fully supported on the 70T3519S133BFGI in the BFG208 package. Pins TDI, TDO, TCK, TMS, and TRST are allocated and functional, as shown in the Pin Configuration (page 5) and Pin Names table (page 6). Note that JTAG is *not* supported in the DR208 PQFP variant, but the BFG208 package retains full compliance.

70T3519S133BFGI Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3519S133BFGI FAQ

1.How can I place an order for 70T3519S133BFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S133BFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S133BFGI reliable?

The price and inventory of 70T3519S133BFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133BFGI is usually 5 days.

3.What payment methods are accepted for 70T3519S133BFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133BFGI transactions.

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4.How is shipping managed for 70T3519S133BFGI?

70T3519S133BFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S133BFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S133BFGI?

For technical support, including 70T3519S133BFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133BFGI requirements.

6.How does Aetrix verify that 70T3519S133BFGI is sourced from the original manufacturer or authorized distributors?

All 70T3519S133BFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133BFGI meets industry standards.

7.What is the process for return or replacement of 70T3519S133BFGI?

All 70T3519S133BFGI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133BFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S133BFGI part is unused and in its original packaging.

Return procedure for 70T3519S133BFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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