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Renesas 70T3519S133BFI
- Part No.:
- 70T3519S133BFI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3519S133BFI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,569
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Product details
Overview
70T3519S133BFI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes. Designed for real-time inter-processor communication in telecom line cards and packet buffering systems.
For engineers reviewing the 70T3519S133BFI datasheet, 70T3519S133BFI pinout, 70T3519S133BFI application, or 70T3519S133BFI equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), dual-chip-enable depth expansion capability, JTAG-compliant IEEE 1149.1 testability, and low-latency 4.2ns clock-to-data (pipelined mode) performance.
Technical Context
This device implements fully synchronous operation on both left and right ports with independent clock inputs (CLKL/CLKR), address strobes (ADSL/ADSR), and counter enable/repeat logic for burst address generation. Its dual-port memory array uses dedicated input/output registers per port to achieve minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz).
The architecture integrates interrupt and collision detection flags (INTR/COLR, INTL/COLL), sleep mode control (ZZL/ZZR), and independent OPT pins to configure each port's I/O voltage (2.5V or 3.3V). JTAG boundary scan is supported only in BGA packages, not PQFP variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.216 Mbit total); enables large FIFO/buffer implementations without external depth expansion |
| Max Clock Frequency | 133MHz (7.5ns cycle time, pipelined mode); supports deterministic timing in high-throughput data path designs |
| Access Time | 4.2ns clock-to-data (tCD2, pipelined, industrial temp); ensures sub-8ns latency for real-time response-critical systems |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (I/O); enables mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for deployment in base station, industrial control, and avionics environments |
| Package | 256-pin BGA (BC256/BCG256); 17mm × 17mm × 1.4mm body, 1.0mm ball pitch; compatible with standard SMT reflow profiles |
| Power Management | Four standby modes (ISB1–ISB4) and ZZ sleep mode (5mA typical); reduces dynamic power in idle subsystems |
Pinout & Package
70T3519S133BFI is housed in a 256-pin Ball Grid Array (BGA) package (BC256/BCG256), with 17mm × 17mm footprint and 1.0mm ball pitch. Power delivery includes dedicated VDD (core), VDDQL/VDDQR (port-specific I/O), and VSS pins distributed across the array for low-noise decoupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock inputs | Independent clocks allow asynchronous domain bridging between processors or ASICs |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Enables seamless depth expansion using multiple devices without external logic |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | Configures output latency: pipelined (1-cycle delay) for throughput, flow-through (0-cycle) for minimal latency |
| OPTL / OPTR | I/O voltage option control | Sets port I/O level: VDD = 2.5V → 3.3V interface; VSS = 0V → 2.5V interface |
| ZZL / ZZR | Port-specific sleep mode enable | Asserting ZZ disables dynamic inputs (except JTAG), reducing current to 5mA per port |
| INTR / COLR, INTL / COLL | Interrupt and collision flags | Asynchronous open-drain outputs signal memory contention or completion events to host controllers |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write access to identical addresses-critical for lock-free inter-processor communication |
| Selectable pipelined or flow-through output | Reduces system-level latency variability: pipelined for predictable throughput, flow-through for deterministic real-time response |
| Independent per-port I/O voltage configuration | Allows one port to interface with 3.3V FPGA logic while the other connects to 2.5V DSP, eliminating level-shifters |
| Dual chip enables with depth expansion support | Eliminates need for external decode logic when stacking multiple devices to increase memory depth |
| JTAG IEEE 1149.1 compliance | Enables boundary-scan testing and in-system debug without requiring additional test access hardware |
| Industrial temperature qualification | Validated for continuous operation at –40°C to +85°C at 133MHz-meets EN 50121 and MIL-STD-810G requirements |
Applications
| Telecom Line Card Buffering | Real-Time Industrial PLC Memory |
|---|---|
Use Scenario: High-speed packet buffering between ingress and egress ASICs in 10Gbps Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency shared memory buffer with independent read/write ports synchronized to separate clock domains. Use Value: 4.2ns pipelined tCD and 7.5ns cycle time enable full-line-rate packet storage without backpressure, supporting >14 Gbps aggregate bandwidth. |
Use Scenario: Deterministic data exchange between safety-critical motion controller and fieldbus master in industrial automation systems. IC Role / Device Role / Timing Role: Serves as a synchronized shared memory region where PLC CPU writes status updates and fieldbus processor reads/writes I/O images. Use Value: Collision detection flags (COLL/COLR) and interrupt outputs (INTL/INTR) provide hardware-level synchronization, eliminating software polling overhead and guaranteeing <7ns event response. |
| Radar Signal Processing FIFO | Aerospace Avionics Data Hub |
Use Scenario: Storing digitized radar return samples between ADC capture and FFT processing stages in phased-array radar systems. IC Role / Device Role / Timing Role: Functions as a deep, low-jitter FIFO buffer with independent clock domains-one port clocked by ADC sampling clock, the other by DSP core clock. Use Value: 133MHz operation with 1.5ns address setup time ensures reliable capture of 125+ MSPS sample streams without metastability risk. |
Use Scenario: Centralized data aggregation node in flight control computers, routing sensor telemetry and actuator commands between ARINC 429, MIL-STD-1553, and CAN subsystems. IC Role / Device Role / Timing Role: Acts as a voltage-translating, multi-protocol message hub-each port configured for different bus voltage levels (2.5V/3.3V) and timing domains. Use Value: Independent OPTL/OPTR pins and per-port VDDQ supplies eliminate external level shifters, reducing BOM count and board area in SWaP-constrained avionics modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133MHz, 256K × 36, 3.3V core/I/O; no per-port voltage selection; no JTAG support | Lacks independent I/O voltage control and IEEE 1149.1 testability; requires external level translation in mixed-voltage systems | Choose when cost sensitivity outweighs need for flexible I/O interfacing and production test coverage |
| IDT70V27L15PF8 | 15MHz max, 32K × 36, 3.3V only; asynchronous interface; no pipelined mode or counter logic | Designed for legacy control-plane buffering-not suitable for high-throughput data-path applications requiring <10ns access | Consider only for low-bandwidth, non-real-time subsystems where timing headroom is abundant |
Compared with CY7C1362BV33-133AXC and IDT70V27L15PF8, the 70T3519S133BFI delivers unique value through per-port I/O voltage configurability, JTAG test infrastructure, and pipelined/flow-through mode selection-enabling higher integration density, lower system-level component count, and robust production testability in demanding embedded applications.
Availability
70T3519S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for 70T3519S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.
The 70T35xx family was designed specifically for deterministic, low-latency inter-processor communication in real-time embedded systems-emphasizing simultaneous access, voltage flexibility, and production-test readiness.
FAQ
What is the maximum operating frequency of the 70T3519S133BFI at industrial temperature?
The 70T3519S133BFI is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C) in both pipelined and flow-through output modes. This is confirmed in the AC Electrical Characteristics table (Page 12, Table 11), where tCYC2 (pipelined cycle time) is specified at 7.5ns max under industrial conditions. The 200MHz speed grade (S200) is commercial-only and unavailable in this variant.
Does the 70T3519S133BFI support independent I/O voltage selection on each port?
Yes, the 70T3519S133BFI supports independent I/O voltage selection per port via the OPTL and OPTR pins. When OPTL = VDD (2.5V), the left port operates at 3.3V I/O levels with VDDQL = 3.3V; when OPTL = VSS (0V), it operates at 2.5V I/O levels with VDDQL = 2.5V. The same applies independently to the right port using OPTR and VDDQR. This is detailed in Pin Names (Page 6) and DC Operating Conditions (Pages 8–9).
How does the collision detection feature work in the 70T3519S133BFI?
The 70T3519S133BFI asserts COLL (left port) or COLR (right port) when simultaneous accesses to the same memory address occur-one port attempting a write while the other reads or writes. Detection is hardware-based and asynchronous, with flag set/reset times of ≤4.2ns (Page 12, tCOLS/tCOLR). These open-drain outputs require external pull-up resistors and can trigger interrupt service routines or stall logic in host processors.
Is JTAG boundary scan supported on the 70T3519S133BFI?
Yes, JTAG boundary scan compliant with IEEE 1149.1 is supported on the 70T3519S133BFI-but only in its 256-pin BGA package (BC256/BCG256). The DR208 PQFP and BF208 fpBGA variants explicitly exclude JTAG due to pin count limitations (Page 4, Note 9; Page 6, Note 5). Pins TDI, TDO, TCK, TMS, and TRST are present and functional in the BGA version used for 70T3519S133BFI.
What power-saving modes are available on the 70T3519S133BFI?
The 70T3519S133BFI offers three power-saving mechanisms: (1) Full standby (ISB3) with both ports disabled via CMOS-level chip enables (<15mA); (2) Partial standby (ISB2/ISB4) with one port active (<250mA); and (3) Sleep mode (Izz) activated by asserting ZZL/ZZR, reducing current to 5mA typical per port. All modes retain data and require no refresh, as confirmed in DC Electrical Characteristics (Page 10, Table 09).
70T3519S133BFI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3519S133BFI FAQ
1.How can I place an order for 70T3519S133BFI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3519S133BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3519S133BFI reliable?
The price and inventory of 70T3519S133BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133BFI is usually 5 days.
3.What payment methods are accepted for 70T3519S133BFI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133BFI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3519S133BFI?
70T3519S133BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3519S133BFI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3519S133BFI?
For technical support, including 70T3519S133BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133BFI requirements.
6.How does Aetrix verify that 70T3519S133BFI is sourced from the original manufacturer or authorized distributors?
All 70T3519S133BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133BFI meets industry standards.
7.What is the process for return or replacement of 70T3519S133BFI?
All 70T3519S133BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133BFI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3519S133BFI part is unused and in its original packaging.
Return procedure for 70T3519S133BFI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3519S133BFI Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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