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Renesas 70T3519S133BFI8

Name: 70T3519S133BFI8
Brand: Renesas
SKU: 70T3519S133BFI8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3519S133BFI8

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3519S133BFI8.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

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Product details

Overview

70T3519S133BFI8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric and network packet buffering applications.

For engineers reviewing the 70T3519S133BFI8 datasheet, 70T3519S133BFI8 pinout, 70T3519S133BFI8 application, or 70T3519S133BFI8 equivalent, this device delivers deterministic low-latency memory access with JTAG-compliant boundary scan, industrial temperature support (–40°C to +85°C), and dual chip enables for seamless depth expansion in high-throughput inter-processor communication systems.

Technical Context

This device implements fully synchronous operation on both left and right ports with independent clock inputs (CLKL/CLKR), address strobe (ADSL/ADSR), and counter-based address generation (CNTENL/CNTENR, REPEATL/REPEATR). Its dual-port memory array uses true dual-port cells with register-controlled inputs to minimize setup/hold timing margins.

The 70T3519S133BFI8 supports configurable I/O voltage per port via OPTL/OPTR pins-enabling mixed-voltage system integration-and includes dedicated sleep mode pins (ZZL/ZZR) that disable dynamic inputs while preserving JTAG accessibility. Collision detection and interrupt flags (COLL/COLR, INTL/INTR) provide real-time arbitration feedback for concurrent access scenarios.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9.2 Mbit); provides full-word parallel access for high-bandwidth data path alignment.
Max Clock Frequency	133 MHz (7.5 ns cycle time); enables sustained 9.5 Gbps aggregate bandwidth across both ports.
Access Time	4.2 ns (max) in flow-through mode; ensures sub-5 ns latency for time-critical control plane lookups.
Supply Voltages	VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150/±100 mV per port; supports mixed-voltage board design.
Operating Temperature	–40°C to +85°C (industrial grade); qualified for deployment in base station and industrial controller environments.
Package	256-pin BGA (BC256/BCG256); 17 mm × 17 mm body with 1.0 mm ball pitch for high-density PCB routing.
Power Consumption	ISB3 = 5–20 mA (full standby); Izz = 5–20 mA (sleep mode); enables ultra-low-power idle states in always-on systems.

Pinout & Package

70T3519S133BFI8 is housed in a 256-pin Ball Grid Array (BGA) package (BC256/BCG256), measuring 17 mm × 17 mm × 1.4 mm with 1.0 mm ball pitch. All VDD pins require connection to 2.5 V; VDDQ pins must be set to 2.5 V or 3.3 V depending on OPT pin configuration per port.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock input	Synchronous edge-triggered timing reference for all register-controlled inputs and outputs on respective port.
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17 is NC for smaller variants but functional for 256K configuration.
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data bus	36-bit parallel interface per port; byte enables (BE0–BE3) allow granular 9-bit write masking.
CE0L/CE1L / CE0R/CE1R	Dual chip enables	Independent enable logic per port; allows depth expansion without external decode logic.
PL/FTL / PL/FTR	Pipeline/Flow-through mode select	DC-level control to configure output latency: pipelined (1-cycle delay) or flow-through (0-cycle delay).
INTL/INTR, COLL/COLR	Interrupt and collision flags	Open-drain outputs signaling concurrent access conflict or user-triggered event; requires external pull-up.

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous read/write to identical addresses-critical for lock-free inter-processor communication buffers.
Selectable pipelined or flow-through output	Reduces effective latency by up to 3.6 ns (pipelined tCD2 = 4.2 ns vs. flow-through tCD1 = 15 ns), optimizing burst throughput.
Dual chip enables per port	Eliminates need for external logic when stacking multiple devices for wider or deeper memory configurations.
JTAG IEEE 1149.1 compliance	Enables boundary-scan testing and in-system debug without requiring additional test pads or probes.
Independent I/O voltage selection per port	Allows one port to interface with 3.3 V FPGA logic while the other connects to 2.5 V ASIC, simplifying mixed-voltage system integration.

Applications

Telecom Switching Fabric	Network Packet Buffering
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress pipelines, enabling zero-wait-state frame handoff. Use Value: 4.2 ns access time and 133 MHz operation ensure sub-microsecond queuing delay for 64-byte packets at line rate.	Use Scenario: Temporarily storing fragmented IP packets during reassembly in firewall or DPI appliances. IC Role / Device Role / Timing Role: Left port accepts incoming fragments from NIC; right port feeds reassembled payload to CPU subsystem. Use Value: Simultaneous access eliminates arbitration overhead, reducing average packet processing latency by ≥12% versus single-port alternatives.
Industrial PLC Data Exchange	Radar Signal Processing Buffer
Use Scenario: Real-time exchange of sensor data and control commands between redundant CPU modules in safety-critical controllers. IC Role / Device Role / Timing Role: Acts as mirrored shared memory with collision detection flagging simultaneous writes for fault recovery. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation in uncontrolled cabinet environments.	Use Scenario: Holding intermediate FFT results between ADC sampling and DSP computation stages in phased-array radar systems. IC Role / Device Role / Timing Role: Right port streams raw samples from ADC; left port supplies processed bins to beamformer engine. Use Value: Pipelined output mode delivers deterministic 4.2 ns tCD2 latency, enabling precise timing alignment for coherent signal synthesis.

Telecom Switching Fabric

Network Packet Buffering

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2/L3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress pipelines, enabling zero-wait-state frame handoff.

Use Value: 4.2 ns access time and 133 MHz operation ensure sub-microsecond queuing delay for 64-byte packets at line rate.

Use Scenario: Temporarily storing fragmented IP packets during reassembly in firewall or DPI appliances.

IC Role / Device Role / Timing Role: Left port accepts incoming fragments from NIC; right port feeds reassembled payload to CPU subsystem.

Use Value: Simultaneous access eliminates arbitration overhead, reducing average packet processing latency by ≥12% versus single-port alternatives.

Industrial PLC Data Exchange

Radar Signal Processing Buffer

Use Scenario: Real-time exchange of sensor data and control commands between redundant CPU modules in safety-critical controllers.

IC Role / Device Role / Timing Role: Acts as mirrored shared memory with collision detection flagging simultaneous writes for fault recovery.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation in uncontrolled cabinet environments.

Use Scenario: Holding intermediate FFT results between ADC sampling and DSP computation stages in phased-array radar systems.

IC Role / Device Role / Timing Role: Right port streams raw samples from ADC; left port supplies processed bins to beamformer engine.

Use Value: Pipelined output mode delivers deterministic 4.2 ns tCD2 latency, enabling precise timing alignment for coherent signal synthesis.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133AXC	256K × 36, 3.3 V core/I/O, 133 MHz, TQFP-208; no JTAG, no sleep mode, higher IDD (450 mA typical)	Lacks industrial temp option and power management features; suited for cost-sensitive commercial designs only	Choose when board space permits larger TQFP and JTAG/testability is not required
IDT70V3519S133BG	Same architecture, 256K × 36, 133 MHz, but 208-pin fpBGA (BF208); no 256-pin BGA option; limited to commercial temp	Smaller footprint but lacks industrial qualification and JTAG support per datasheet revision	Prefer only if PCB layout constraints mandate 208-pin fpBGA and industrial operation is unnecessary

Compared with CY7C1362BV33-133AXC and IDT70V3519S133BG, the 70T3519S133BFI8 uniquely combines industrial temperature range, JTAG testability, and per-port sleep mode-making it the sole choice for mission-critical embedded systems requiring field-reliable diagnostics and thermal resilience.

Availability

70T3519S133BFI8 is available at Aetrix Electronics and suitable for telecom switching fabric, industrial PLC data exchange, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3519S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 70T3519S133BFI8 belongs to IDT's high-speed synchronous dual-port SRAM family, engineered specifically for deterministic, low-latency inter-processor communication in telecom, aerospace, and industrial control systems.

FAQ

What is the maximum operating frequency of the 70T3519S133BFI8?

The 70T3519S133BFI8 is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This frequency is guaranteed under specified VDD = 2.5 V ±100 mV and appropriate VDDQ conditions, with pipelined output mode achieving 4.2 ns clock-to-data valid timing.

Does the 70T3519S133BFI8 support JTAG boundary scan?

Yes, the 70T3519S133BFI8 supports IEEE 1149.1-compliant JTAG boundary scan functionality, including TDI, TDO, TCK, TMS, and TRST pins. JTAG remains active even in sleep mode (ZZ asserted), enabling in-system test and debug without disrupting system power states.

How does the 70T3519S133BFI8 handle simultaneous access to the same memory location?

The 70T3519S133BFI8 uses true dual-port memory cells that permit simultaneous read/write access to identical addresses. When contention occurs, the device asserts COLL (collision alert) and INTR (interrupt) flags on the affected port, allowing software or hardware arbitration logic to resolve conflicts without data corruption.

What are the I/O voltage options for each port of the 70T3519S133BFI8?

Each port of the 70T3519S133BFI8 supports independent I/O voltage selection: OPTL and OPTR pins configure left/right port I/O levels to either 2.5 V or 3.3 V. Corresponding VDDQL and VDDQR supplies must match the selected level-2.5 V if OPT = VSS, 3.3 V if OPT = VDD-per datasheet Table 05a/b.

Is the 70T3519S133BFI8 available in packages other than 256-pin BGA?

No-the 70T3519S133BFI8 is exclusively offered in the 256-pin BGA (BC256/BCG256) package. While related variants like IDT70T3519S133BG use 208-pin fpBGA, the "BFI8" suffix denotes the industrial-grade 256-pin BGA variant with full JTAG and temperature qualification.

70T3519S133BFI8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3519S133BFI8 FAQ

1.How can I place an order for 70T3519S133BFI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S133BFI8 reliable?

The price and inventory of 70T3519S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133BFI8 is usually 5 days.

3.What payment methods are accepted for 70T3519S133BFI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133BFI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S133BFI8?

70T3519S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S133BFI8?

For technical support, including 70T3519S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133BFI8 requirements.

6.How does Aetrix verify that 70T3519S133BFI8 is sourced from the original manufacturer or authorized distributors?

All 70T3519S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133BFI8 meets industry standards.

7.What is the process for return or replacement of 70T3519S133BFI8?

All 70T3519S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133BFI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S133BFI8 part is unused and in its original packaging.

Return procedure for 70T3519S133BFI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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