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Renesas 70T3519S133DR

Part No.:
70T3519S133DR
Manufacturer:
Renesas
Category:
Memory
Package:
208-BFQFP
Datasheet:
Aetrix70T3519S133DR.pdf
Description:
IC SRAM 9MBIT PARALLEL 208PQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,715

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Product details

Overview

70T3519S133DR from IDT (Integrated Device Technology) is a high-speed synchronous dual-port static RAM with 256K × 36-bit organization, 2.5V core supply, and independently configurable 2.5V/3.3V I/O interfaces per port. It supports true simultaneous read/write access to the same memory location, delivers 4.2ns clock-to-data-out in flow-through mode at 133MHz, and operates across industrial temperature range (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards and FPGA co-processor data exchange.

For engineers reviewing the 70T3519S133DR datasheet, 70T3519S133DR pinout, 70T3519S133DR application, or 70T3519S133DR equivalent, key selection criteria include dual-port latency tolerance, independent voltage rail support per port, pipelined vs. flow-through output timing, JTAG debug capability, and sleep-mode current consumption under industrial thermal conditions.

Technical Context

This device implements fully synchronous dual-port architecture with separate address, data, and control registers on left and right ports-enabling concurrent access without arbitration logic. Each port features independent clock (CLKL/CLKR), chip enables (CE0L/CE1L, CE0R/CE1R), byte enables (BE0–BE3), and pipeline/flow-through selection (PL/FTL, PL/FTR).

It integrates address counter logic with CNTEN and REPEAT inputs for burst address generation, collision detection flags (COLL/COLR), interrupt signaling (INTL/INTR), and low-power sleep mode via ZZL/ZZR pins. JTAG boundary scan (IEEE 1149.1) is supported only in BGA packages-not in the DR208 PQFP variant of 70T3519S133DR.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization256K × 36 bits (9Mbit total); enables 36-bit wide parallel data paths per port
Max Clock Frequency133MHz (industrial grade); defines maximum sustained throughput of 9.576 Gbps per port
Access Time (tCD)4.2ns (flow-through), 4.2ns (pipelined); determines minimum read latency for deterministic real-time systems
Core Supply Voltage2.5V ±100mV; requires dedicated low-noise 2.5V rail for internal logic and timing circuits
I/O Supply OptionsPer-port selectable 2.5V or 3.3V (via OPTL/OPTR); allows mixed-voltage system interfacing without level shifters
Operating Temperature–40°C to +85°C; validated for deployment in uncontrolled industrial enclosures and outdoor base stations
Package208-pin PQFP (DR208); 28mm × 28mm body, 0.5mm pitch; compatible with standard surface-mount reflow profiles

Pinout & Package

70T3519S133DR uses a 208-pin Plastic Quad Flat Pack (PQFP) package (DR208), with 0.5mm lead pitch and 28mm × 28mm footprint. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS). JTAG is not supported in this package variant.

Pin/Terminal Circuit Role Design Meaning
A0L–A17L / A0R–A17RAddress Inputs (Left/Right)18-bit address bus per port; A16/A17 are no-connect for 128K/64K configurations
I/O0L–I/O35L / I/O0R–I/O35RBidirectional Data Bus (36-bit)Full 36-bit parallel interface per port; supports byte-wise write masking via BE0–BE3
CE0L/CE1L, CE0R/CE1RDual Chip EnablesEnables depth expansion without external logic; CE0=low + CE1=high activates port
R/WL / R/WRRead/Write ControlSynchronous active-high write enable; controls direction of data transfer on each port
OEL / OEROutput EnableAsynchronous tri-state control; overrides clocked outputs for bus sharing or power gating
PL/FTL / PL/FTROutput Mode SelectConfigures pipelined (1-cycle delay) or flow-through (combinatorial) output timing per port
ZZL / ZZRSleep Mode InputAsserting high disables dynamic inputs (except JTAG), reducing standby current to ≤15mA

Key Features

Feature Design Value
True Dual-Port Memory CellsEnables simultaneous read/write to identical addresses-critical for lock-free inter-processor communication
Dual Cycle Deselect (DCD)Prevents metastability during rapid chip-enable toggling in pipelined output mode
Independent I/O Voltage ControlOPTL/OPTR pins allow left port at 3.3V and right port at 2.5V-eliminates level-shifter ICs in mixed-signal SoC interfaces
Address Counter with RepeatCNTENL/R + REPEATL/R enable auto-incrementing burst reads/writes without host CPU intervention
Collision & Interrupt FlagsCOLL/COLR and INTL/INTR provide hardware-asserted status for contention detection and event notification
Industrial Temp Support at 133MHzGuaranteed timing performance over –40°C to +85°C-validated for telecom infrastructure and motor control systems

Applications

Telecom Packet Buffering FPGA-CPU Co-Processing

Use Scenario: Line card buffers incoming/outgoing Ethernet frames between PHY and switch fabric ASIC.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress traffic managers.

Use Value: Simultaneous access eliminates arbitration delays; 4.2ns tCD ensures sub-10ns round-trip latency for 64-byte packets.

Use Scenario: Real-time motion controller offloads trajectory calculation from ARM CPU to FPGA.

IC Role / Device Role / Timing Role: 70T3519S133DR serves as bidirectional data conduit-CPU writes parameters, FPGA reads and returns results.

Use Value: Independent 2.5V/3.3V I/O rails match CPU (3.3V) and FPGA (2.5V) voltage domains without level shifters.

Industrial PLC Data Exchange Radar Signal Processing

Use Scenario: Programmable Logic Controller synchronizes I/O scan cycles between two real-time cores.

IC Role / Device Role / Timing Role: Left port connects to Core A, right port to Core B; both access shared tag database.

Use Value: Collision detection (COLL/COLR) flags notify firmware of concurrent writes-enabling deterministic recovery without software locks.

Use Scenario: Automotive radar ECU stores ADC samples and FFT coefficients in overlapping buffers.

IC Role / Device Role / Timing Role: Pipelined output mode (PL/FT = VIH) sustains 133MHz burst writes while enabling deterministic read timing.

Use Value: 5ns cycle time (tCYC2) supports >260MB/s sustained bandwidth-meeting ADAS sensor fusion throughput requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZXI3.3V-only core and I/O; no 2.5V option; 165-pin TQFP; lacks REPEAT/CNTEN counter logicRequires external level shifting when interfacing to 2.5V FPGAs; no hardware burst addressing supportSelect only if system uses uniform 3.3V signaling and burst control is handled by FPGA logic
IS61WV25632ALL-133BLIAsynchronous dual-port; 3.3V core/I/O; 256K × 32-bit; no JTAG or sleep mode; max 133MHz async cycleNo clock domain isolation; higher access latency (~12ns); unsuitable for tightly synchronized multi-core systemsConsider only for cost-sensitive, non-real-time applications where deterministic timing is not required

Compared with CY7C1362BV33-133BZXI and IS61WV25632ALL-133BLI, the 70T3519S133DR uniquely combines per-port voltage flexibility, hardware address counters, and industrial-grade 133MHz synchronous timing-making it optimal for mixed-voltage, latency-critical embedded systems.

Availability

70T3519S133DR is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and automotive radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3519S133DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T35xx family was engineered specifically for deterministic, low-latency data exchange between heterogeneous processors-emphasizing true dual-port concurrency, flexible voltage operation, and robust industrial reliability.

FAQ

What is the maximum guaranteed operating frequency of the 70T3519S133DR under industrial temperature conditions?

The 70T3519S133DR is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C). This is verified per AC Electrical Characteristics Table 11 in the datasheet, with tCYC2 = 7.5ns (pipelined) and tCYC1 = 25ns (flow-through) as minimum cycle times. The "S133" suffix explicitly denotes this speed grade and temperature qualification.

Does the 70T3519S133DR support JTAG boundary scan testing?

No, the 70T3519S133DR does not support JTAG. As noted in Pin Configuration Note #9 and Table 1, JTAG functionality (TCK, TMS, TDI, TDO, TRST) is omitted in the DR208 PQFP package. JTAG is only available in BGA variants (e.g., BC256, BF208) of the 70T3519 family.

How does the 70T3519S133DR handle simultaneous access to the same memory location from both ports?

The 70T3519S133DR uses true dual-port memory cells that permit simultaneous read/write operations to identical addresses. When contention occurs, the device asserts COLL (left) or COLR (right) flags within 4.2ns, and the last write wins. No bus arbitration logic is required-collision status is reported asynchronously for firmware handling.

Can the left and right ports of the 70T3519S133DR operate at different I/O voltages?

Yes. The 70T3519S133DR supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while OPTR = VSS (0V) configures the right port for 2.5V I/O (requiring VDDQR = 2.5V). This enables direct interfacing with mixed-voltage SoCs.

What power-saving features does the 70T3519S133DR offer for battery-powered or thermally constrained applications?

The 70T3519S133DR provides three low-power states: (1) Full standby (ISB3 ≤15mA) when both CE0/CE1 are deasserted at CMOS levels; (2) Partial standby (ISB2 ≤250mA) when one port is active; and (3) Sleep mode (Izz ≤15mA) activated by asserting ZZL/ZZR high-disabling all dynamic inputs except JTAG (not present in DR208).

70T3519S133DR Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-PQFP (28x28)

70T3519S133DR FAQ

1.How can I place an order for 70T3519S133DR through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S133DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S133DR reliable?

The price and inventory of 70T3519S133DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133DR is usually 5 days.

3.What payment methods are accepted for 70T3519S133DR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133DR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S133DR?

70T3519S133DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S133DR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S133DR?

For technical support, including 70T3519S133DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133DR requirements.

6.How does Aetrix verify that 70T3519S133DR is sourced from the original manufacturer or authorized distributors?

All 70T3519S133DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133DR meets industry standards.

7.What is the process for return or replacement of 70T3519S133DR?

All 70T3519S133DR units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133DR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S133DR part is unused and in its original packaging.

Return procedure for 70T3519S133DR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T3519S133DR Tags

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