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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3519S133DRI

Name: 70T3519S133DRI
Brand: Renesas
SKU: 70T3519S133DRI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3519S133DRI

Manufacturer:: Renesas

Category:: Memory

Package:: 208-BFQFP

Datasheet:: 70T3519S133DRI.pdf

Description:: IC SRAM 9MBIT PARALLEL 208PQFP

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Product details

Overview

70T3519S133DRI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabrics.

For engineers reviewing the 70T3519S133DRI datasheet, 70T3519S133DRI pinout, 70T3519S133DRI application, or 70T3519S133DRI equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), JTAG-compliant IEEE 1149.1 testability, dual chip enables for depth expansion, and independent port voltage configuration via OPT pins.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz) and fast 4.2ns clock-to-data-out in 133MHz mode. Its dual-port memory array supports concurrent access without arbitration logic.

The architecture includes dedicated interrupt and collision detection flags, counter-enable/repeat functionality for sequential addressing, and dual-cycle deselect (DCD) for pipelined output mode. Sleep mode (ZZL/ZZR) reduces dynamic power while preserving JTAG accessibility.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9.2 Mbit); supports 256K-word depth with 36-bit parallel interface per port.
Max Clock Frequency	133 MHz (7.5 ns cycle time); validated for industrial temperature range (–40°C to +85°C).
Access Time	4.2 ns max clock-to-data-out (tCD2) in pipelined mode; enables tight timing closure in high-bandwidth systems.
I/O Voltage Support	Selectable 2.5V or 3.3V per port via OPTL/OPTR pins; VDDQ independently supplied for each port.
Power Supply	2.5V ±100 mV core (VDD); separate VDDQ rails allow mixed-voltage system interfacing.
Package	208-pin fine-pitch BGA (fpBGA, BF208/BFG208); 15 mm × 15 mm body, 0.8 mm ball pitch.
Temperature Range	Industrial grade (–40°C to +85°C); specified for 133MHz operation in fpBGA package.

Pinout & Package

70T3519S133DRI is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package (BF208/BFG208), with 15 mm × 15 mm footprint and 0.8 mm ball pitch. All VDD pins require 2.5V supply; VDDQ pins must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR state.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Edge-triggered master clock for left/right port registers; all control/data/address sampled on rising edge.
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17 is NC for smaller variants but functional for 256K configuration.
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit parallel data path per port; byte-enabled (BE0–BE3) for 9-bit granularity writes.
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs	Enable depth expansion without external logic; CE0=low + CE1=high activates port.
R/WL / R/WR	Read/write direction control	Active-high write enable; synchronous with CLK; determines data flow direction per access.
OEL / OER	Output enable	Asynchronous control of output drivers; tri-states I/Os when high, regardless of clock state.
PL/FTL / PL/FTR	Pipeline/flow-through mode select	DC-level input (VIH/VIL) selecting pipelined (1-cycle latency) or flow-through (0-cycle latency) output behavior.
OPTL / OPTR	I/O voltage option control	DC-level input setting VDDQX operating voltage: VDD = 2.5V → 3.3V I/O; VSS = 0V → 2.5V I/O.
ZZL / ZZR	Sleep mode enable	Asserting high disables dynamic inputs (except JTAG), reducing current to ≤15 mA in full standby.
INTL / INTR	Interrupt flag output	Open-drain active-low signal indicating internal event (e.g., counter overflow, ADS completion).
COLL / COLR	Collision detection flag	Active-low output signaling simultaneous access to identical address by both ports.

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent, independent read/write access to identical addresses-eliminates arbitration logic in shared-memory interconnects.
Selectable pipelined or flow-through output mode	Configurable latency: pipelined mode delivers deterministic 1-cycle delay for predictable timing; flow-through enables zero-cycle read-after-write.
Dual chip enables per port	Supports seamless depth expansion (e.g., 512K×36) using multiple devices without external decode logic or glue ICs.
Independent I/O voltage per port	OPTL/OPTR pins allow left port at 3.3V and right port at 2.5V-enabling direct interfacing with mixed-voltage ASICs or FPGAs.
JTAG boundary scan (IEEE 1149.1)	Full test access port (TCK/TMS/TDI/TDO/TRST) supports production testing and in-system debug without additional test fixtures.
Counter enable and repeat functionality	Hardware address counter with REPEATL/REPEATR allows burst transfers across contiguous memory locations using single ADS strobe.

Applications

Telecom Switch Fabric Buffer	Network Packet Processor Cache
Use Scenario: Storing packet headers and metadata in line-rate Ethernet switches with parallel ingress/egress paths. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler; CLKL synchronized to ingress clock, CLKR to egress clock. Use Value: Simultaneous header read (by scheduler) and write (by parser) eliminates serialization bottlenecks, sustaining 133 MHz × 36-bit throughput per port.	Use Scenario: Accelerating lookup table access in multi-core packet classification engines where two cores concurrently query forwarding databases. IC Role / Device Role / Timing Role: Shared memory resource providing low-latency, conflict-free access to TCAM or hash table entries via independent left/right ports. Use Value: Collision detection (COLL/COLR) flags alert software to concurrent access conflicts, enabling deterministic retry handling without bus arbitration overhead.
Digital Signal Processing Co-Processor	Real-Time Industrial Controller Memory
Use Scenario: Interfacing FPGA-based FFT accelerators with ARM-based host processors in radar signal processing units. IC Role / Device Role / Timing Role: Synchronous dual-port bridge: left port connected to FPGA fabric (3.3V), right port to ARM AXI bus (2.5V) via level-shifting interface. Use Value: Independent OPTL/OPTR configuration enables native voltage compatibility-no external level shifters required for cross-domain data exchange.	Use Scenario: Storing real-time motion control parameters and sensor fusion buffers in PLCs requiring deterministic response under industrial ambient conditions. IC Role / Device Role / Timing Role: Industrial-grade memory subsystem supporting –40°C to +85°C operation with sleep mode (ZZL/ZZR) for energy-constrained edge nodes. Use Value: Full standby current ≤20 mA and sleep mode current ≤20 mA meet IEC 61131-2 power budget requirements for fanless embedded controllers.

Telecom Switch Fabric Buffer

Network Packet Processor Cache

Use Scenario: Storing packet headers and metadata in line-rate Ethernet switches with parallel ingress/egress paths.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress parser and egress scheduler; CLKL synchronized to ingress clock, CLKR to egress clock.

Use Value: Simultaneous header read (by scheduler) and write (by parser) eliminates serialization bottlenecks, sustaining 133 MHz × 36-bit throughput per port.

Use Scenario: Accelerating lookup table access in multi-core packet classification engines where two cores concurrently query forwarding databases.

IC Role / Device Role / Timing Role: Shared memory resource providing low-latency, conflict-free access to TCAM or hash table entries via independent left/right ports.

Use Value: Collision detection (COLL/COLR) flags alert software to concurrent access conflicts, enabling deterministic retry handling without bus arbitration overhead.

Digital Signal Processing Co-Processor

Real-Time Industrial Controller Memory

Use Scenario: Interfacing FPGA-based FFT accelerators with ARM-based host processors in radar signal processing units.

IC Role / Device Role / Timing Role: Synchronous dual-port bridge: left port connected to FPGA fabric (3.3V), right port to ARM AXI bus (2.5V) via level-shifting interface.

Use Value: Independent OPTL/OPTR configuration enables native voltage compatibility-no external level shifters required for cross-domain data exchange.

Use Scenario: Storing real-time motion control parameters and sensor fusion buffers in PLCs requiring deterministic response under industrial ambient conditions.

IC Role / Device Role / Timing Role: Industrial-grade memory subsystem supporting –40°C to +85°C operation with sleep mode (ZZL/ZZR) for energy-constrained edge nodes.

Use Value: Full standby current ≤20 mA and sleep mode current ≤20 mA meet IEC 61131-2 power budget requirements for fanless embedded controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133BZI	128K × 36-bit density; 133MHz max; 3.3V-only core/I/O; no OPT-selectable I/O voltage.	Lacks per-port voltage flexibility and 256K depth; requires external level shifting for mixed-voltage systems.	Choose when system uses uniform 3.3V logic and 128K depth suffices-lower cost, simpler power design.
AS7C3256B-133JIN	256K × 32-bit (not 36-bit); 133MHz; 3.3V core/I/O; no JTAG; no sleep mode or collision detection.	Missing 4-bit width, interrupt/collision flags, and IEEE 1149.1 testability-unsuitable for telecom or safety-critical designs.	Consider only for cost-sensitive, non-critical buffering where 32-bit width and absence of diagnostics are acceptable.

Compared with CY7C1362BV33-133BZI and AS7C3256B-133JIN, the 70T3519S133DRI uniquely delivers 256K × 36-bit capacity with per-port I/O voltage selection, integrated collision/interrupt signaling, and industrial-grade JTAG debug-making it the sole option for high-integrity, mixed-voltage dual-port memory systems.

Availability

70T3519S133DRI is available at Aetrix Electronics and suitable for telecom infrastructure, network packet processing, and industrial motion control applications requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70T3519S133DRI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in telecom switching, packet processing, and real-time control systems-emphasizing deterministic timing, mixed-voltage interoperability, and built-in diagnostics.

FAQ

What is the maximum operating frequency of the 70T3519S133DRI at industrial temperature?

The 70T3519S133DRI is rated for 133 MHz operation across the full industrial temperature range (–40°C to +85°C). This corresponds to a guaranteed 7.5 ns clock cycle time (tCYC2) in pipelined mode, with 4.2 ns clock-to-data-out (tCD2) and 1.5 ns address setup time (tSA), all validated under worst-case voltage and temperature conditions.

Does the 70T3519S133DRI support independent I/O voltage selection on left and right ports?

Yes, the 70T3519S133DRI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V-enabling direct interfacing with heterogeneous logic families.

How does collision detection work in the 70T3519S133DRI?

The 70T3519S133DRI asserts COLL (left port) or COLR (right port) low within 4.2 ns when both ports attempt simultaneous access (read or write) to the same memory address. The flag remains asserted until the conflicting access completes, and resets automatically-providing hardware-level synchronization without software polling or external arbitration logic.

What package type is used for the 70T3519S133DRI?

The 70T3519S133DRI is packaged in a 208-pin fine-pitch Ball Grid Array (fpBGA) with designation BF208/BFG208. The package measures 15 mm × 15 mm with 0.8 mm ball pitch and is qualified for industrial temperature operation-distinct from the 256-pin BGA (BC256) and 208-pin PQFP (DR208) variants in the same family.

Does the 70T3519S133DRI include JTAG boundary scan capability?

Yes, the 70T3519S133DRI implements full IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRST pins. This capability is supported in the fpBGA (BF208) package and enables production testing, in-system verification, and debug visibility-unlike the DR208 PQFP variant which omits JTAG due to pin count limitations.

70T3519S133DRI Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-BFQFP

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-PQFP (28x28)

70T3519S133DRI FAQ

1.How can I place an order for 70T3519S133DRI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S133DRI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S133DRI reliable?

The price and inventory of 70T3519S133DRI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S133DRI is usually 5 days.

3.What payment methods are accepted for 70T3519S133DRI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S133DRI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S133DRI?

70T3519S133DRI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S133DRI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S133DRI?

For technical support, including 70T3519S133DRI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S133DRI requirements.

6.How does Aetrix verify that 70T3519S133DRI is sourced from the original manufacturer or authorized distributors?

All 70T3519S133DRI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S133DRI meets industry standards.

7.What is the process for return or replacement of 70T3519S133DRI?

All 70T3519S133DRI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S133DRI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S133DRI part is unused and in its original packaging.

Return procedure for 70T3519S133DRI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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