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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3519S166BC

Name: 70T3519S166BC
Brand: Renesas
SKU: 70T3519S166BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3519S166BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3519S166BC.pdf

Description:: IC SRAM 9MBIT PARALLEL 256CABGA

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Product details

Overview

70T3519S166BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. Used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70T3519S166BC datasheet, 70T3519S166BC pinout, 70T3519S166BC application, or 70T3519S166BC equivalent, this page delivers verified timing parameters, industrial-grade (-40°C to +85°C) operation, BGA package mapping, JTAG-compliant test interface, and dual-port collision/interrupt flag behavior critical for deterministic data coherency in FPGA-ASIC interconnect systems.

Technical Context

This device implements fully synchronous dual-port operation on left and right ports, each with independent clock (CLKL/CLKR), address (A0L–A17L / A0R–A17R), and control (CE0/CE1, R/W, OE, BE0–BE3) signals. All inputs-including address, byte enables, and R/W-are registered on the rising edge of their respective clocks, enabling 5ns cycle time at 200MHz (commercial grade) and 6ns at 166MHz (industrial).

It integrates dedicated address counter logic with CNTEN/REPEAT/ADSL controls for burst-mode sequential addressing, plus hardware collision detection and interrupt generation (COLL/INTR, COLR/INTR) triggered by simultaneous access to identical addresses across ports-ensuring deterministic arbitration without external logic.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9-Mbit total); supports depth expansion via dual chip enables CE0/CE1 without external logic.
Max Clock Frequency	166MHz (industrial temp); enables 14Gbps aggregate bandwidth with 36-bit parallel bus and pipelined output mode.
Access Time	3.6ns (max) at 166MHz pipelined mode; ensures sub-4ns clock-to-data valid for tight timing closure in high-speed interfaces.
Supply Voltages	VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (I/O), selected independently via OPTL/OPTR pins.
Operating Temperature	-40°C to +85°C (industrial grade); validated for sustained operation at full speed under thermal stress conditions.
Package	256-pin BGA (BC256), 17mm × 17mm × 1.4mm body, 1.0mm ball pitch; compatible with standard reflow profiles.
JTAG Support	IEEE 1149.1 compliant (TCK, TMS, TDI, TDO, TRST); enables boundary-scan testing and in-system debug without functional interruption.

Pinout & Package

256-pin Ball Grid Array (BGA), BC256 package: 17mm × 17mm body, 1.0mm ball pitch, 1.4mm height. Requires separate 2.5V core supply (VDD) and per-port I/O supplies (VDDQL/VDDQR) tied according to OPTL/OPTR configuration.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock input	Synchronous edge-triggered timing reference for all registered inputs/outputs on left/right port; no internal clock distribution delay.
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17 is NC for IDT70T3599/89 variants but functional for 70T3519S166BC.
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data bus	36-bit wide per port; supports byte-wise write masking via BE0–BE3 (9-bit bytes) for partial-word updates without read-modify-write.
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs	Two independent enables per port allow seamless depth expansion (e.g., 512K×36) using simple logic or daisy-chained control.
PL/FTL / PL/FTR	Output mode select	Configures port output timing: VIH = pipelined (1-cycle latency, 3.6ns tCD2), VIL = flow-through (0-cycle latency, 12ns tCD1).
ZZL / ZZR	Per-port sleep mode input	Asserting ZZx disables dynamic inputs (except JTAG), reducing standby current to 5mA/port while preserving register state.

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write to identical addresses-critical for lock-free FIFOs and shared buffer architectures in real-time systems.
Dual-cycle deselect (DCD)	Prevents metastability during rapid chip enable toggling in pipelined mode; ensures reliable deactivation within two clock cycles.
Hardware collision detection	Dedicated COLL/INTR and COLR/INTR outputs assert within 3.6ns of conflicting access-eliminates need for software polling or external arbitration logic.
Independent I/O voltage selection	OPTL/OPTR pins configure each port for 2.5V or 3.3V signaling, enabling mixed-voltage system integration (e.g., 2.5V FPGA ↔ 3.3V ASIC).
Address counter with repeat	CNTENL/R and REPEATL/R enable automatic burst addressing; REPEAT reloads last ADS-loaded address-ideal for DMA descriptor chaining.

Applications

Telecom Line Card Buffering	Real-Time Industrial PLC Memory
Use Scenario: High-throughput packet buffering between SERDES PHY and network processor in 10G line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress data paths, synchronized to independent clocks. Use Value: Simultaneous access eliminates pipeline stalls; 3.6ns access and 6ns cycle time support 166MHz line-rate processing without backpressure.	Use Scenario: Deterministic I/O image storage in safety-critical programmable logic controllers with dual-CPU redundancy. IC Role / Device Role / Timing Role: Shared memory for mirrored CPU cores; collision flags trigger failover within <7ns, meeting SIL-3 timing requirements. Use Value: Hardware collision detection replaces software mutexes, guaranteeing sub-10ns fault response-critical for ISO 13849 compliance.
FPGA-ASIC Co-Processing Interface	Avionics Data Concentrator Buffer
Use Scenario: High-bandwidth data exchange between Xilinx FPGA and TI C66x DSP in radar signal processing subsystems. IC Role / Device Role / Timing Role: Synchronous dual-port bridge with independent clock domains; JTAG enables in-system verification of data coherency. Use Value: Pipelined output mode delivers 14Gbps throughput; per-port VDDQ selection matches FPGA I/O bank (3.3V) and DSP core (2.5V) voltages.	Use Scenario: ARINC 664 (AFDX) end-system data concentrator aggregating sensor streams in flight control computers. IC Role / Device Role / Timing Role: Time-deterministic buffer with interrupt-driven status reporting; industrial temp rating ensures reliability at -40°C to +85°C. Use Value: 5ns cycle time meets AFDX jitter budgets; ZZ sleep mode reduces power during idle frames without losing context-extending module MTBF.

Telecom Line Card Buffering

Real-Time Industrial PLC Memory

Use Scenario: High-throughput packet buffering between SERDES PHY and network processor in 10G line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress data paths, synchronized to independent clocks.

Use Value: Simultaneous access eliminates pipeline stalls; 3.6ns access and 6ns cycle time support 166MHz line-rate processing without backpressure.

Use Scenario: Deterministic I/O image storage in safety-critical programmable logic controllers with dual-CPU redundancy.

IC Role / Device Role / Timing Role: Shared memory for mirrored CPU cores; collision flags trigger failover within <7ns, meeting SIL-3 timing requirements.

Use Value: Hardware collision detection replaces software mutexes, guaranteeing sub-10ns fault response-critical for ISO 13849 compliance.

FPGA-ASIC Co-Processing Interface

Avionics Data Concentrator Buffer

Use Scenario: High-bandwidth data exchange between Xilinx FPGA and TI C66x DSP in radar signal processing subsystems.

IC Role / Device Role / Timing Role: Synchronous dual-port bridge with independent clock domains; JTAG enables in-system verification of data coherency.

Use Value: Pipelined output mode delivers 14Gbps throughput; per-port VDDQ selection matches FPGA I/O bank (3.3V) and DSP core (2.5V) voltages.

Use Scenario: ARINC 664 (AFDX) end-system data concentrator aggregating sensor streams in flight control computers.

IC Role / Device Role / Timing Role: Time-deterministic buffer with interrupt-driven status reporting; industrial temp rating ensures reliability at -40°C to +85°C.

Use Value: 5ns cycle time meets AFDX jitter budgets; ZZ sleep mode reduces power during idle frames without losing context-extending module MTBF.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166AXC	166MHz, 256K×36, 3.3V core/I/O; no 2.5V option, no JTAG, larger 240-pin TQFP package.	Lacks per-port voltage flexibility and IEEE 1149.1 test support; requires PCB redesign for BGA-to-TQFP migration.	Select when legacy 3.3V-only systems prioritize footprint compatibility over testability and power optimization.
AS7C3256B-166BIN	166MHz, 256K×36, 3.3V only; no pipelined mode, no collision detection, no address counter features.	Missing hardware arbitration and burst addressing-requires external logic for collision handling and sequential access.	Choose only for cost-sensitive, non-real-time applications where deterministic coherency and burst efficiency are not required.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166BIN, the 70T3519S166BC uniquely delivers per-port voltage selection, pipelined/flow-through mode switching, and integrated collision/interrupt logic-enabling single-chip deterministic dual-port operation without external glue logic or voltage translation.

Availability

70T3519S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, aerospace data concentrators, and high-reliability embedded systems requiring stable component supply across extended product lifecycles.

Supply support for 70T3519S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T3519S166BC belongs to IDT's high-speed synchronous dual-port SRAM family, engineered specifically for deterministic, low-latency shared-memory interconnects in multi-processor and FPGA-ASIC hybrid systems.

FAQ

What is the maximum operating frequency of the 70T3519S166BC at industrial temperature?

The 70T3519S166BC is rated for 166MHz operation across the full industrial temperature range of -40°C to +85°C. This is validated with 3.6ns maximum access time and 6ns minimum clock cycle time under worst-case voltage (2.4V VDD) and temperature conditions, as specified in the AC Electrical Characteristics table (page 12 of the datasheet).

Does the 70T3519S166BC support independent voltage supplies for its two ports?

Yes, the 70T3519S166BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Each port can be configured for either 2.5V or 3.3V signaling by setting its OPT pin to VDD (2.5V) or VSS (0V), respectively-enabling mixed-voltage interfacing such as 2.5V FPGA ↔ 3.3V microcontroller without level shifters.

How does collision detection work on the 70T3519S166BC?

The 70T3519S166BC asserts COLL (left port) or COLR (right port) within 3.6ns when both ports attempt simultaneous access (read or write) to the same memory address. The corresponding interrupt flag (INTL or INTR) is set concurrently. These signals are asynchronous outputs and require no clock domain crossing-providing deterministic, hardware-level arbitration for real-time systems.

What package type is used for the 70T3519S166BC?

The 70T3519S166BC is packaged in a 256-pin Ball Grid Array (BGA) with BC256 designation: 17mm × 17mm body size, 1.0mm ball pitch, and 1.4mm height. This RoHS-compliant green package supports standard lead-free reflow profiles and is distinct from the 208-pin fpBGA (BF208) and PQFP (DR208) variants offered in the same family.

Can the 70T3519S166BC operate in pipelined and flow-through output modes simultaneously?

Yes-the 70T3519S166BC supports independent output mode selection per port via PL/FTL (left) and PL/FTR (right). One port can be configured for pipelined mode (VIH) delivering 3.6ns tCD2 latency, while the other operates in flow-through mode (VIL) with 12ns tCD1 latency-enabling optimized timing for asymmetric data path requirements in heterogeneous systems.

70T3519S166BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3519S166BC FAQ

1.How can I place an order for 70T3519S166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S166BC reliable?

The price and inventory of 70T3519S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166BC is usually 5 days.

3.What payment methods are accepted for 70T3519S166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S166BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S166BC?

70T3519S166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S166BC?

For technical support, including 70T3519S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166BC requirements.

6.How does Aetrix verify that 70T3519S166BC is sourced from the original manufacturer or authorized distributors?

All 70T3519S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166BC meets industry standards.

7.What is the process for return or replacement of 70T3519S166BC?

All 70T3519S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S166BC part is unused and in its original packaging.

Return procedure for 70T3519S166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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