Renesas 70T3519S166BC8
- Part No.:
- 70T3519S166BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3519S166BC8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3519S166BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (3.6ns access time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes, JTAG IEEE 1149.1 compliance, and industrial temperature range (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards.
For engineers reviewing the 70T3519S166BC8 datasheet, 70T3519S166BC8 pinout, 70T3519S166BC8 application, or 70T3519S166BC8 equivalent, key selection criteria include dual-port timing coordination, per-port voltage configuration via OPT pins, sleep mode (ZZ) control, collision/interrupt flag behavior, and BGA package layout constraints for high-density routing.
Technical Context
This device implements fully synchronous operation on both ports with register-controlled inputs-address, data, byte enables, and control signals all sampled on the rising edge of CLKL/CLKR. Its dual-port memory array uses true dual-port cells, not pseudo-dual-port or multiplexed architectures, enabling concurrent access without arbitration logic.
It supports two distinct output timing modes: pipelined (tCD2 = 3.6ns max at 166MHz) for burst throughput, and flow-through (tCD1 = 12ns max) for low-latency deterministic access. Collision detection and interrupt flags are generated synchronously with port clocks and cleared by address strobe (ADSL/ADSR) or reset events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.216 Mbit); supports depth expansion via dual chip enables CE0/CE1 without external logic |
| Max Clock Frequency | 166MHz (industrial grade); enables 5ns cycle time in pipelined mode for 14.9 Gbps aggregate bandwidth |
| Access Time | 3.6ns (max) at 166MHz in pipelined mode; defines minimum clock-to-data valid delay for burst reads |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPTL/OPTR pins; VDDQ must match selected level (2.4–2.6V or 3.15–3.45V) |
| Operating Temperature | –40°C to +85°C; validated for industrial applications including base station control planes and industrial PLCs |
| Power Supply | 2.5V ±100mV core (VDD); separate I/O supply (VDDQ) per port; sleep mode (ZZ) reduces current to ≤20mA |
| Package | 256-pin BGA (BC256), 17mm × 17mm × 1.4mm body, 1.0mm ball pitch; RoHS-compliant green variant available |
Pinout & Package
70T3519S166BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 1.0mm ball pitch and 17mm × 17mm footprint. Power and ground balls are distributed across the array to minimize noise and support simultaneous switching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-trigger for all registered inputs on left/right port; determines tCYC2 = 6ns min in pipelined mode |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17 is NC for smaller variants but functional here for full 256K addressing |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel interface per port; byte enables BE0–BE3 allow 9-bit granularity writes without masking logic |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable/disable port independently; dual CE architecture allows seamless depth expansion (e.g., 512K×36) without glue logic |
| PL/FTL / PL/FTR | Output mode select | Configures pipelined (VIH) or flow-through (VIL) output timing; sets tCD2 = 3.6ns or tCD1 = 12ns respectively |
| ZZL / ZZR | Sleep mode control | Asynchronous active-high entry into ultra-low-power state; disables dynamic inputs except JTAG; recovery requires 3 clock cycles |
| INTL / INTR / COLL / COLR | Status flags | Synchronous open-drain outputs indicating port interrupt or memory collision; require external pull-ups for logic-level compatibility |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables concurrent, independent read/write access to identical addresses-critical for real-time FIFO and buffer coherency |
| Per-port I/O voltage selection | OPTL/OPTR pins configure each port for 2.5V or 3.3V signaling, allowing interoperability with mixed-voltage SoCs or FPGAs |
| Dual-cycle deselect (DCD) in pipelined mode | CE/BE deassertion takes two clocks to disable outputs, preventing metastability during rapid enable/disable transitions |
| Integrated address counter with repeat | CNTENL/CNTENR and REPEATL/REPEATR enable auto-incrementing burst access and address rollback-reducing controller overhead |
| JTAG boundary scan (IEEE 1149.1) | Full TAP controller support (TCK/TMS/TDI/TDO/TRST) for production test and in-system debug; not available in PQFP variants |
| Collision and interrupt detection logic | Hardware-generated COLL/INT flags signal simultaneous write-write or write-read conflicts-enabling deterministic error handling |
Applications
| Telecom Packet Buffering | Industrial Motion Control |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames between MAC and PHY layers in a 10G line card. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency frame buffer-left port accepts ingress packets while right port services egress scheduling logic. Use Value: 3.6ns pipelined access and 166MHz clock enable sub-10ns latency per packet segment, meeting strict jitter budgets for real-time traffic shaping. |
Use Scenario: Coordinating position feedback and command updates between FPGA-based motion sequencer and multi-axis servo drives. IC Role / Device Role / Timing Role: Serves as shared memory between control and feedback domains-left port writes trajectory commands, right port reads encoder snapshots. Use Value: True dual-port architecture eliminates arbitration delays, ensuring deterministic <5ns inter-port synchronization critical for sub-microsecond loop closure. |
| Avionics Data Concentrator | Medical Imaging Pipeline |
|
Use Scenario: Aggregating ARINC 429 and MIL-STD-1553B sensor data streams into a unified time-stamped dataset for flight control processing. IC Role / Device Role / Timing Role: Acts as a time-aligned buffer-left port captures timestamped sensor words, right port feeds processed data to safety-critical CPU. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation in uncontrolled avionics bays with thermal cycling. |
Use Scenario: Holding raw pixel blocks during real-time CT reconstruction, where FPGA-accelerated back-projection writes while DSP reads completed slices. IC Role / Device Role / Timing Role: Provides zero-wait-state, concurrent access path for pipeline stages-eliminating FIFO bottlenecks in 12-bit/100MHz imaging chains. Use Value: 36-bit width matches standard image bus widths; per-port VDDQ selection allows direct interfacing with 2.5V FPGA I/O banks and 3.3V ADC interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 166MHz, 256K × 36, 3.3V core & I/O; no 2.5V option; lacks JTAG and collision detection logic | Requires external voltage translation for 2.5V systems; no hardware collision flag-software polling needed | Choose when cost sensitivity outweighs mixed-voltage flexibility and hardware interrupt requirements |
| AS7C3256B-166JCIN | 166MHz, 256K × 32 (not 36-bit); 3.3V only; no per-port voltage control or sleep mode (ZZ) | 32-bit width necessitates data packing/unpacking for 36-bit protocols; higher static power due to missing ZZ | Choose only if 32-bit bus alignment suffices and JTAG/testability is non-critical |
Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70T3519S166BC8 uniquely delivers per-port voltage configurability, hardware collision detection, and IEEE 1149.1 JTAG-making it the only option for mixed-voltage, safety-critical, or high-test-coverage designs requiring deterministic dual-port arbitration.
Availability
70T3519S166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for 70T3519S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xx family was designed specifically for deterministic, low-latency dual-port memory applications in telecom line cards, industrial controllers, and military/aerospace systems demanding simultaneous access, mixed-voltage I/O, and robust testability.
FAQ
What is the maximum operating frequency of the 70T3519S166BC8 in industrial temperature range?
The 70T3519S166BC8 is rated for 166MHz operation across the full industrial temperature range (–40°C to +85°C), with guaranteed 3.6ns maximum access time in pipelined mode. This specification is validated for the BC256 BGA package; the BF208 fpBGA variant does not support 166MHz in industrial grade.
How does the OPT pin configure I/O voltage levels on the 70T3519S166BC8?
On the 70T3519S166BC8, OPTL sets the left port's I/O voltage: VIH = 2.5V selects 3.3V operation (requiring VDDQL = 3.3V), while VIL = 0V selects 2.5V operation (requiring VDDQL = 2.5V). OPTR performs the same function independently for the right port, enabling asymmetric voltage configurations.
Does the 70T3519S166BC8 support JTAG boundary scan, and which package options include it?
Yes, the 70T3519S166BC8 supports full IEEE 1149.1 JTAG boundary scan via dedicated TCK/TMS/TDI/TDO/TRST pins. JTAG is available only in the 256-pin BGA (BC256) and 208-pin fpBGA (BF208) packages-not in the PQFP (DR208) variant due to pin count limitations.
What is the function of the ZZ pin on the 70T3519S166BC8, and how does it affect power consumption?
The ZZL and ZZR pins on the 70T3519S166BC8 are asynchronous sleep mode controls. When asserted high, they disable dynamic inputs (except JTAG) and reduce standby current to ≤20mA per port. Recovery requires three clock cycles, and static inputs (PL/FT, OPT) remain functional during sleep.
How does collision detection work on the 70T3519S166BC8, and what triggers the COLR/COLL flags?
The 70T3519S166BC8 generates COLR (right port) or COLL (left port) flags when a write operation on one port targets the same address currently being written to-or read from-by the opposite port. The flags are synchronous to the respective port's clock and reset by subsequent ADS assertion or system reset.
70T3519S166BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3519S166BC8 FAQ
1.How can I place an order for 70T3519S166BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3519S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3519S166BC8 reliable?
The price and inventory of 70T3519S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166BC8 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3519S166BC8?
For technical support, including 70T3519S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166BC8 requirements.
6.How does Aetrix verify that 70T3519S166BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3519S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166BC8 meets industry standards.
7.What is the process for return or replacement of 70T3519S166BC8?
All 70T3519S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3519S166BC8 part is unused and in its original packaging.
Return procedure for 70T3519S166BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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