Renesas 70T3519S166BCI

Overview

70T3519S166BCI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. Used in real-time packet buffering for telecom line cards and FPGA co-processor interconnects.

For engineers reviewing the 70T3519S166BCI datasheet, 70T3519S166BCI pinout, 70T3519S166BCI application, or 70T3519S166BCI equivalent, key selection criteria include industrial-grade timing (–40°C to +85°C), dual-cycle deselect capability, JTAG-compliant IEEE 1149.1 test support, and BGA package compatibility with depth-expansion chip enables.

Technical Context

This device implements fully synchronous dual-port operation on left and right ports, each with independent clock (CLKL/CLKR), address (A0L–A17L / A0R–A17R), and control (CE0/CE1, R/W, OE, BE0–BE3) signals. It uses self-timed write logic and input data registers to achieve minimal setup/hold times - 1.5ns setup and 0.5ns hold at 200MHz - enabling sub-6ns cycle time in pipelined mode.

The memory integrates address counter logic with ADS strobe, CNTEN enable, and REPEAT latch functionality for burst-mode sequential addressing. Collision detection and interrupt flags (COLL/COLR, INTL/INTR) are hardware-asserted on simultaneous access to identical addresses, with guaranteed flag set/reset times of ≤3.6ns (industrial 166MHz).

Key Specifications

Pinout & Package

70T3519S166BCI is housed in a 256-pin Ball Grid Array (BC256) package with 1.0mm ball pitch and 17mm × 17mm footprint. Power delivery uses distributed VDD (core), VDDQL/VDDQR (port-specific I/O), and VSS pins; all VDD must be connected to 2.5V, and VDDQ must match OPT pin configuration (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166BZI and AS7C3256B-166JCIN, the 70T3519S166BCI uniquely delivers independent 2.5V/3.3V I/O per port, hardware collision detection with sub-4ns response, and pipelined output mode - critical for latency-constrained, mixed-voltage, real-time systems.

Availability

70T3519S166BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3519S166BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T35xx family was designed specifically for deterministic, low-latency inter-processor communication - emphasizing true dual-port concurrency, hardware arbitration, and mixed-voltage interoperability in mission-critical embedded systems.

FAQ

What is the maximum operating frequency of the 70T3519S166BCI at industrial temperature?

The 70T3519S166BCI is rated for 166MHz operation across the full industrial temperature range of –40°C to +85°C. This is verified per datasheet Table 9 and Table 11, with guaranteed 3.6ns access time and 6ns cycle time in pipelined mode. The 200MHz speed grade (S200) is commercial-only and not offered in this BCI variant.

Does the 70T3519S166BCI support independent voltage supplies for each port's I/O interface?

Yes, the 70T3519S166BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V - enabling direct interfacing with mixed-voltage ASICs without level shifters.

How does the collision detection mechanism work in the 70T3519S166BCI?

The 70T3519S166BCI uses dedicated hardware logic to detect simultaneous access (read or write) to the same memory address on both ports. When detected, it asserts COLL (left port) and COLR (right port) flags within 3.6ns (max) - guaranteed per AC Table 11. These open-drain outputs require external pull-ups and enable immediate system-level arbitration without software polling overhead.

What package type and pin count does the 70T3519S166BCI use?

The 70T3519S166BCI uses a 256-pin Ball Grid Array (BC256) package with 1.0mm ball pitch and a 17mm × 17mm body size. Pin configuration is defined in datasheet Figure 2, including dedicated VDD, VDDQL/VDDQR, VSS, and dual-port signal groups. This BGA variant supports JTAG and full industrial-speed operation - unlike the 208-pin PQFP (DR208) which omits JTAG.

Can the 70T3519S166BCI operate in a low-power sleep mode, and how is it controlled?

Yes, the 70T3519S166BCI supports hardware sleep mode via the ZZL and ZZR pins. Asserting either pin high disables dynamic inputs (except JTAG), reducing current to 5–20mA (typ/max). Sleep mode recovery requires three clock cycles (tZZRC), and JTAG remains functional during sleep - allowing debug access without waking the core logic.