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Renesas 70T3519S166BF
- Part No.:
- 70T3519S166BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3519S166BF.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,937
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Product details
Overview
70T3519S166BF from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 3.3V/2.5V I/O supplies per port, and features pipelined or flow-through output modes for burst data transfer in telecom line cards and network packet buffers.
For engineers reviewing the 70T3519S166BF datasheet, 70T3519S166BF pinout, 70T3519S166BF application, or 70T3519S166BF equivalent, key selection criteria include its 208-pin fpBGA package, industrial temperature support (–40°C to +85°C), JTAG-compliant IEEE 1149.1 test interface, dual chip enables for depth expansion, and collision/interrupt flag outputs for real-time arbitration in multi-processor systems.
Technical Context
This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz) and 5ns cycle time capability. Its dual-port memory array uses true dual-port cells, not pseudo-dual-port or FIFO-emulated structures.
The architecture includes independent address counters per port with ADS strobe, CNTEN enable, and REPEAT latch functionality, plus separate OPT pins to configure each port's I/O voltage (3.3V or 2.5V) without affecting the 2.5V core supply. Sleep mode (ZZL/ZZR) reduces dynamic power while preserving JTAG accessibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.2 Mbit); supports 256K-word depth with 36-bit parallel I/O per port |
| Max Clock Frequency | 166MHz (industrial grade); enables 14Gbps aggregate bandwidth with pipelined output mode |
| Access Time | 3.6ns (max, industrial temp); defines minimum clock-to-data-out latency in pipelined mode |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 3.3V ±150mV or 2.5V ±100mV per port, selected via OPTL/OPTR |
| Operating Temperature | –40°C to +85°C; validated for industrial applications including base station control planes and industrial PLCs |
| Package | 208-pin fine-pitch BGA (BF208/BFG208); 15mm × 15mm body, 0.8mm ball pitch, RoHS-compliant green variant available |
| Power Management | Four standby modes (ISB1–ISB4) and sleep mode (Izz ≤ 20mA); ZZ assertion disables dynamic inputs except JTAG |
Pinout & Package
70T3519S166BF is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package designated BF208/BFG208, with 15mm × 15mm footprint and 0.8mm ball pitch. All VDD pins require 2.5V connection; VDDQ pins must match OPT pin configuration (3.3V if OPT = VDD, 2.5V if OPT = VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Edge-triggered master timing reference for all registered inputs/outputs on respective port |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17 is NC for 128K/64K variants but functional for 256K configuration |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; byte-enable controlled (BE0–BE3, 9-bit granularity) |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable depth expansion without external logic; CE0=low + CE1=high activates port |
| R/WL / R/WR | Read/write direction control | Active-high write enable; synchronous with CLK edge, determines data flow direction per access |
| OEL / OER | Output enable | Asynchronous control; tri-states I/O drivers independently of clock or CE state |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input (VIH/VIL) selecting pipelined (1-cycle latency) or flow-through (0-cycle latency) output timing |
| INTL / INTR | Interrupt flag output | Open-drain active-low signal indicating internal event (e.g., counter overflow, collision detection) |
| COLL / COLR | Collision detection flag | Asserted when simultaneous accesses target same address; enables hardware arbitration without software polling |
| ZZL / ZZR | Sleep mode control | Asynchronous input disabling dynamic circuitry per port; preserves JTAG and static inputs during low-power operation |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables concurrent, independent read/write operations on identical addresses-critical for inter-processor communication buffers |
| Dual-cycle deselect (DCD) in pipelined mode | Prevents metastability during rapid chip enable toggling; ensures reliable deactivation across two clock cycles |
| Independent I/O voltage selection per port | OPTL/OPTR pins allow one port to interface with 3.3V FPGA logic while the other connects to 2.5V ASIC, eliminating level shifters |
| Hardware address counter with repeat function | ADSL/ADSR + CNTENL/CNTENR + REPEATL/REPEATR enable burst sequential addressing without CPU intervention |
| JTAG boundary scan (IEEE 1149.1) | Full TAP controller support (TDI/TDO/TCK/TMS/TRST) for production test and in-system debug on fpBGA package |
| Industrial-grade thermal and voltage tolerance | Validated at –40°C to +85°C with 2.5V ±100mV core supply-suitable for uncooled telecom chassis and factory automation controllers |
Applications
| Telecom Line Card Buffer | Multi-Core Processor Shared Memory |
|---|---|
|
Use Scenario: Storing packet headers and metadata in high-speed Ethernet switch fabric line cards requiring deterministic latency. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared buffer between ingress parser and egress scheduler engines. Use Value: 3.6ns access time and pipelined output mode ensure sub-10ns round-trip latency for header lookup and modification. |
Use Scenario: Inter-core communication in industrial PLCs with dual ARM Cortex-R5 processors executing real-time control loops. IC Role / Device Role / Timing Role: Serves as lock-free shared memory region with collision detection flags preventing race conditions. Use Value: COLL/INTR outputs provide hardware-level arbitration signals, eliminating software mutex overhead and jitter. |
| Network Packet Assembly Engine | Radar Signal Processing Buffer |
|
Use Scenario: Assembling fragmented IP packets in 5G baseband units where ingress and egress paths operate at different clock domains. IC Role / Device Role / Timing Role: Left port accepts segmented payload from MAC layer; right port streams reassembled frames to PHY layer. Use Value: Independent 2.5V/3.3V I/O supplies (via OPTL/OPTR) match voltage domains of adjacent MAC and PHY ICs. |
Use Scenario: Storing intermediate FFT results in phased-array radar systems with separate transmit and receive processing chains. IC Role / Device Role / Timing Role: Provides simultaneous write (from ADC pipeline) and read (to DSP engine) access to coherent time-domain samples. Use Value: True dual-port architecture eliminates ping-pong buffer switching, reducing latency by up to 50% versus single-port alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1362BV33 | 256K × 36, 166MHz, 3.3V core/I/O; no 2.5V option, no JTAG, larger 240-pin BGA | Lacks independent I/O voltage selection and sleep mode; requires external level translation for mixed-voltage systems | Select when 3.3V-only system design simplifies power delivery and JTAG is unnecessary |
| Renesas R1EX25616AS-166 | 256K × 36, 166MHz, 2.5V core; fixed 2.5V I/O, no OPT pin, 208-pin PQFP (DR208) only | No voltage-flexible I/O; PQFP limits thermal performance and board density vs. fpBGA | Select when legacy through-hole assembly or lower-cost packaging outweighs fpBGA advantages |
Compared with CY7C1362BV33 and R1EX25616AS-166, the 70T3519S166BF uniquely combines per-port I/O voltage selection, JTAG testability in fpBGA, and industrial-temperature 166MHz operation-making it optimal for space-constrained, mixed-voltage, high-reliability embedded systems.
Availability
70T3519S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for 70T3519S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70T3519S166BF belongs to IDT's high-speed synchronous dual-port SRAM family, engineered for deterministic latency and hardware-coherent multi-processor memory sharing in mission-critical infrastructure.
FAQ
What is the maximum operating frequency of the 70T3519S166BF at industrial temperature?
The 70T3519S166BF is rated for 166MHz operation across the full industrial temperature range (–40°C to +85°C). This is verified in the datasheet Table 9 and confirmed for the BF208 fpBGA package. Note that 200MHz operation is commercial-grade only and unavailable in this package variant.
Does the 70T3519S166BF support independent voltage supplies on left and right ports?
Yes-the 70T3519S166BF supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. The core VDD remains fixed at 2.5V.
How does collision detection work on the 70T3519S166BF?
The 70T3519S166BF asserts COLL (left port) or COLR (right port) when simultaneous accesses-regardless of read/write type-target the same memory address. Detection is hardware-based and asynchronous; flags remain asserted until cleared by subsequent non-colliding access or reset. Timing is specified in Table 11 (tCOLS/tCOLR ≤ 4.2ns).
Is JTAG boundary scan supported on the 70T3519S166BF fpBGA package?
Yes-JTAG (IEEE 1149.1) is fully supported on the 70T3519S166BF in the BF208/BFG208 fpBGA package, with dedicated TDI, TDO, TCK, TMS, and TRST pins. JTAG is explicitly disabled in the DR208 PQFP variant due to pin count limitations, but the fpBGA implementation enables production testing and in-system debug.
What power-saving modes does the 70T3519S166BF offer beyond standard standby?
Beyond conventional CE-based standby (ISB1–ISB4), the 70T3519S166BF provides a dedicated sleep mode activated by asserting ZZL and/or ZZR. In sleep mode, dynamic inputs are disabled (except JTAG), reducing current to ≤20mA (industrial) while preserving static inputs like OPT and PL/FT. Recovery requires three clock cycles (tZZRC).
70T3519S166BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3519S166BF FAQ
1.How can I place an order for 70T3519S166BF through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3519S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3519S166BF reliable?
The price and inventory of 70T3519S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166BF is usually 5 days.
3.What payment methods are accepted for 70T3519S166BF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S166BF transactions.
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4.How is shipping managed for 70T3519S166BF?
70T3519S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3519S166BF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3519S166BF?
For technical support, including 70T3519S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166BF requirements.
6.How does Aetrix verify that 70T3519S166BF is sourced from the original manufacturer or authorized distributors?
All 70T3519S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166BF meets industry standards.
7.What is the process for return or replacement of 70T3519S166BF?
All 70T3519S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3519S166BF part is unused and in its original packaging.
Return procedure for 70T3519S166BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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