Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3519S166BF8

Name: 70T3519S166BF8
Brand: Renesas
SKU: 70T3519S166BF8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 70T3519S166BF8

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3519S166BF8.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,711

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

70T3519S166BF8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. It is used in real-time packet buffering for telecom line cards and FPGA co-processor data exchange.

For engineers reviewing the 70T3519S166BF8 datasheet, 70T3519S166BF8 pinout, 70T3519S166BF8 application, or 70T3519S166BF8 equivalent, key selection criteria include dual-port timing coordination, per-port voltage configuration via OPT pins, industrial temperature support (−40°C to +85°C), and BGA package compatibility with JTAG IEEE 1149.1 compliance.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Its dual-chip-enable architecture allows depth expansion without external logic, while counter enable and repeat features support burst-mode sequential addressing.

The memory integrates interrupt and collision detection logic, sleep mode (ZZL/ZZR) for dynamic power reduction, and separate byte enables (BE0–BE3) for 9-bit granularity writes. JTAG boundary scan is supported only in BGA packages (not PQFP), and pipelined output mode delivers 3.6ns tCD2 at 166MHz.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 36 bits (9Mbit total); supports independent concurrent access on left/right ports
Max Clock Frequency	166MHz (industrial temp); enables 5ns cycle time in pipelined mode for high-throughput data streaming
Access Time (tCD2)	3.6ns (pipelined, industrial); defines minimum clock-to-data-out latency for deterministic timing-critical systems
Supply Voltages	VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (configurable via OPTL/OPTR)
Operating Temperature	−40°C to +85°C (industrial grade); validated for sustained operation in base station and industrial controller environments
Package	208-pin fine-pitch BGA (BF208/BFG208); 15mm × 15mm × 1.4mm body, 0.8mm ball pitch
Power Management	Sleep mode (ZZL/ZZR) reduces current to ≤20mA; full standby (ISB3) draws ≤20mA with CMOS-level inputs

Pinout & Package

70T3519S166BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package (BF208/BFG208), with 15mm × 15mm footprint and 0.8mm ball pitch. Power and ground balls are distributed across the array to minimize noise and ensure stable core/I/O supply decoupling.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Edge-triggered master timing reference for all registered inputs/outputs on respective port
CE0L/CE1L, CE0R/CE1R	Dual chip enable inputs	Enable depth expansion: CE0X=VIL & CE1X=VIH activates port; both high disables port
A0L–A17L, A0R–A17R	Address inputs	18-bit address bus per port; A17 is NC for smaller variants but functional here for 256K addressing
I/O0L–I/O35L, I/O0R–I/O35R	Bidirectional data I/O (36-bit)	True dual-port data path; supports independent read/write on same location with collision detection
OPTL / OPTR	I/O voltage select input	Set to VDD (2.5V) → 3.3V I/O interface; set to VSS (0V) → 2.5V I/O interface; configures VDDQL/VDDQR supply level
ZZL / ZZR	Sleep mode control	Asserted high disables dynamic inputs (except JTAG), reducing power; static inputs (PL/FT, OPT) remain active
INTL / INTR, COLL / COLR	Interrupt and collision flags	Open-drain outputs signaling memory contention (collision) or user-defined event (interrupt) on respective port

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous, independent read/write access to identical addresses-critical for real-time producer-consumer FIFOs
Selectable pipelined or flow-through output	Pipelined mode cuts tCD to 3.6ns at 166MHz; flow-through adds latency but eliminates pipeline stalls in burst reads
Dual-cycle deselect (DCD) in pipelined mode	Ensures clean bus release after two clocks when chip enable deasserts-prevents metastability in multi-device systems
Per-port voltage configuration	OPTL/OPTR pins independently configure each port for 2.5V or 3.3V I/O levels-enables mixed-voltage system interfacing
JTAG IEEE 1149.1 compliance	Supported in BF208 fpBGA package only; enables boundary-scan testing without requiring dedicated test pads or probes
Counter enable & repeat logic	Hardware address counter advances on CLK edge when CNTENL/R = low; REPEATL/R reloads last ADS-loaded address

Applications

Telecom Packet Buffering	FPGA Co-Processor Interface
Use Scenario: High-speed line cards buffer incoming/outgoing Ethernet or SONET packets between MAC and framer ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency, non-blocking shared memory between ingress and egress data paths. Use Value: Simultaneous access eliminates arbitration delay; 166MHz pipelined mode sustains >12Gbps aggregate bandwidth for 10G+ interfaces.	Use Scenario: FPGA-based vision processor exchanges frame buffers and metadata with an ARM host CPU. IC Role / Device Role / Timing Role: 70T3519S166BF8 serves as low-latency scratchpad memory with independent clock domains for FPGA and CPU. Use Value: Per-port voltage selection (2.5V for FPGA, 3.3V for CPU) avoids level shifters; collision detection prevents data corruption during concurrent access.
Industrial Motion Controller	Radar Signal Processing
Use Scenario: Real-time PLC executes servo loop updates while logging diagnostics and accepting HMI commands. IC Role / Device Role / Timing Role: Left port handles deterministic motion control writes; right port services non-real-time diagnostics reads. Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliability in uncooled enclosures; sleep mode reduces idle power by >90%.	Use Scenario: Phased-array radar front-end stores ADC samples and FFT coefficients between processing stages. IC Role / Device Role / Timing Role: Dual-port architecture enables ping-pong buffering: one port writes new samples while the other reads processed data. Use Value: 3.6ns tCD2 guarantees sub-4ns data availability for next-stage computation; interrupt flags signal buffer full/empty conditions.

Telecom Packet Buffering

FPGA Co-Processor Interface

Use Scenario: High-speed line cards buffer incoming/outgoing Ethernet or SONET packets between MAC and framer ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency, non-blocking shared memory between ingress and egress data paths.

Use Value: Simultaneous access eliminates arbitration delay; 166MHz pipelined mode sustains >12Gbps aggregate bandwidth for 10G+ interfaces.

Use Scenario: FPGA-based vision processor exchanges frame buffers and metadata with an ARM host CPU.

IC Role / Device Role / Timing Role: 70T3519S166BF8 serves as low-latency scratchpad memory with independent clock domains for FPGA and CPU.

Use Value: Per-port voltage selection (2.5V for FPGA, 3.3V for CPU) avoids level shifters; collision detection prevents data corruption during concurrent access.

Industrial Motion Controller

Radar Signal Processing

Use Scenario: Real-time PLC executes servo loop updates while logging diagnostics and accepting HMI commands.

IC Role / Device Role / Timing Role: Left port handles deterministic motion control writes; right port services non-real-time diagnostics reads.

Use Value: Industrial temperature rating (−40°C to +85°C) ensures reliability in uncooled enclosures; sleep mode reduces idle power by >90%.

Use Scenario: Phased-array radar front-end stores ADC samples and FFT coefficients between processing stages.

IC Role / Device Role / Timing Role: Dual-port architecture enables ping-pong buffering: one port writes new samples while the other reads processed data.

Use Value: 3.6ns tCD2 guarantees sub-4ns data availability for next-stage computation; interrupt flags signal buffer full/empty conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166BZXI	166MHz, 256K × 36, 3.3V core/I/O; no per-port voltage select; 256-pin BGA only	Lacks independent OPT-driven I/O voltage control; requires external level translation if interfacing mixed-voltage devices	Choose when system uses uniform 3.3V logic and board layout already accommodates larger 256-pin BGA
IDT70V3519S166PF8	Same architecture, but 208-pin PQFP (DR208); no JTAG support; higher inductance, lower max frequency in thermal-limited designs	Not suitable for JTAG-enabled production test; less suitable for high-density layouts due to larger footprint and thermal resistance	Choose only for legacy PQFP-compatible designs where JTAG is unnecessary and thermal headroom exceeds 10°C margin

Compared with CY7C1362BV33-166BZXI and IDT70V3519S166PF8, the 70T3519S166BF8 uniquely supports per-port I/O voltage selection and JTAG in its fpBGA package-enabling flexible mixed-voltage integration and automated test coverage without layout compromise.

Availability

70T3519S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3519S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T35xx family was designed specifically for deterministic, low-latency dual-access memory in real-time embedded systems-emphasizing simultaneous port operation, flexible voltage interfaces, and robust industrial-grade reliability.

FAQ

What is the maximum operating frequency of the 70T3519S166BF8 in industrial temperature range?

The 70T3519S166BF8 is rated for 166MHz operation across the full industrial temperature range (−40°C to +85°C) in pipelined output mode. This corresponds to a 6ns clock cycle time (tCYC2) and 3.6ns clock-to-data-out (tCD2), verified per datasheet Table 11 under ISB2 and AC timing conditions.

Does the 70T3519S166BF8 support independent voltage configuration on left and right ports?

Yes-the 70T3519S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. Both ports may operate at different voltages simultaneously.

Is JTAG boundary scan supported on the 70T3519S166BF8 package?

Yes-JTAG IEEE 1149.1 is fully supported on the 70T3519S166BF8's 208-pin fpBGA (BF208/BFG208) package, with dedicated TDI, TDO, TCK, TMS, and TRST pins. JTAG is explicitly excluded from the PQFP (DR208) variant per datasheet Note 9, confirming fpBGA as the only JTAG-capable option in this speed grade.

How does the sleep mode (ZZL/ZZR) affect power consumption of the 70T3519S166BF8?

When ZZL and/or ZZR is asserted high, the 70T3519S166BF8 enters sleep mode, disabling all dynamic inputs except JTAG signals. In industrial temperature range, sleep current (Izz) is guaranteed ≤20mA. This reduces active power by >90% compared to dynamic operation (525mA max), while preserving static input functionality (PL/FT, OPT) and JTAG accessibility.

What memory density and organization does the 70T3519S166BF8 provide?

The 70T3519S166BF8 provides 256K × 36-bit organization (9,216,000 bits total), implemented as a true dual-port SRAM array. Each port has independent 18-bit address buses (A0–A17), supporting full 256K-word addressing. The 36-bit data width maps directly to four 9-bit byte lanes (BE0–BE3), enabling granular write masking.

70T3519S166BF8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3519S166BF8 FAQ

1.How can I place an order for 70T3519S166BF8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S166BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S166BF8 reliable?

The price and inventory of 70T3519S166BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166BF8 is usually 5 days.

3.What payment methods are accepted for 70T3519S166BF8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S166BF8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3519S166BF8?

70T3519S166BF8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S166BF8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S166BF8?

For technical support, including 70T3519S166BF8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166BF8 requirements.

6.How does Aetrix verify that 70T3519S166BF8 is sourced from the original manufacturer or authorized distributors?

All 70T3519S166BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166BF8 meets industry standards.

7.What is the process for return or replacement of 70T3519S166BF8?

All 70T3519S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166BF8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S166BF8 part is unused and in its original packaging.

Return procedure for 70T3519S166BF8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…