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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3519S166BFG

Name: 70T3519S166BFG
Brand: Renesas
SKU: 70T3519S166BFG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3519S166BFG

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3519S166BFG.pdf

Description:: IC SRAM 9MBIT PARALLEL 208CABGA

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Product details

Overview

70T3519S166BFG from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 166MHz (3.6ns access time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes, JTAG IEEE 1149.1 compliance, and industrial temperature range (–40°C to +85°C). It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70T3519S166BFG datasheet, 70T3519S166BFG pinout, 70T3519S166BFG application, or 70T3519S166BFG equivalent, key selection criteria include dual-port timing synchronization, per-port VDDQ voltage selectability via OPT pins, sleep mode (ZZ) current <20mA, and 208-pin fpBGA (BFG208) package compatibility with high-density routing constraints.

Technical Context

This device implements fully synchronous operation on both ports with independent clock inputs (CLKL/CLKR), dual chip enables (CE0/CE1 per port) for depth expansion, and address counter logic with ADS/CNTEN/REPEAT controls. It uses self-timed write cycles and input registers to achieve minimal setup/hold times (e.g., 1.5ns address setup @ 200MHz).

The memory array employs true dual-port cells, supporting concurrent access without arbitration. Each port has independent byte enables (BE0–BE3), output enable (OEL/OER), and pipeline/flow-through mode selection (PL/FTL/PL/FTR), with collision detection and interrupt flags (COLL/INTR, COLR/INTR) generated synchronously to respective clocks.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9Mbit total); supports burst data transfers in telecom and networking ASIC interfaces.
Max Clock Frequency	166MHz (industrial grade); enables 5ns cycle time in pipelined mode for deterministic latency-critical systems.
Access Time	3.6ns (max, industrial); guarantees sub-4ns clock-to-data valid (tCD2) for tight timing closure in FPGA co-processor buffers.
I/O Voltage Support	Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows mixed-voltage system integration without level shifters.
Operating Temperature	–40°C to +85°C; qualified for base station and industrial control environments with thermal cycling reliability.
Package	208-pin fine-pitch BGA (BFG208); 15mm × 15mm body with 0.8mm ball pitch for high I/O count in space-constrained PCBs.
Power Supply	2.5V ±100mV core (VDD); separate VDDQL/VDDQR rails decouple port I/O domains for noise isolation.

Pinout & Package

70T3519S166BFG is housed in a 208-pin fine-pitch Ball Grid Array (BFG208) package with 0.8mm ball pitch and 15mm × 15mm footprint. Power and ground balls are distributed across the array to minimize impedance and support simultaneous switching noise (SSN) requirements.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock inputs	Synchronous edge-triggered timing reference for all left/right port operations; enables independent clock domain interfacing.
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17 is functional for 256K configuration (not NC as in 128K/64K variants).
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit wide data path per port; supports byte-wise writes via BE0–BE3 (9-bit granularity).
CE0L/CE1L / CE0R/CE1R	Dual chip enables	Enable depth expansion without external logic; CE0=low + CE1=high activates port, while both high places port in power-down.
PL/FTL / PL/FTR	Output mode select	Configures pipelined (VIH) or flow-through (VIL) output timing; critical for matching FPGA register stages or ASIC pipeline depths.
ZZL / ZZR	Sleep mode control	Asynchronous low-power entry; disables dynamic inputs (except JTAG), reducing current to ≤20mA while preserving state.

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write to identical addresses-essential for handshake-free inter-processor communication in DSP clusters.
Per-port VDDQ voltage selection	OPTL/OPTR pins configure each port for 2.5V or 3.3V I/O levels independently, eliminating level-shifter components in mixed-voltage SoC interfaces.
Collision detection & interrupt flags	COLL/COLR and INTL/INTR outputs signal simultaneous access conflicts within one clock cycle, enabling hardware-based arbitration without software polling.
Dual-cycle deselect (DCD)	CE/BE signals require two clock cycles to deactivate in pipelined mode, preventing metastability during rapid enable/disable transitions in burst-mode controllers.
JTAG boundary scan (IEEE 1149.1)	Full TAP controller support (TCK/TMS/TDI/TDO/TRST) enables in-system test and debug of high-pin-count BGA solder joints and interconnect integrity.

Applications

Telecom Line Card Buffering	Real-Time DSP Co-Processor Interface
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade aggregation switches where deterministic latency is mandatory. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking frame buffer between line interface unit (LIU) and traffic manager ASIC, with left port handling ingress and right port egress. Use Value: 3.6ns access time and pipelined output mode ensure sub-5ns round-trip latency, meeting ITU-T G.8261 jitter tolerance for 10Gbps transport layers.	Use Scenario: Shared memory between dual-core DSPs executing parallel filter algorithms in radar signal processing subsystems. IC Role / Device Role / Timing Role: Serves as zero-wait-state shared scratchpad; left port connected to Core A's AXI bus, right port to Core B's AXI bus, synchronized via common clock domain. Use Value: True dual-port architecture eliminates arbitration logic and software semaphores, increasing effective throughput by >35% versus single-port SRAM with bus multiplexer.
Industrial PLC Motion Control	Medical Imaging Data Pipeline
Use Scenario: Real-time exchange of position setpoints and encoder feedback between motion controller FPGA and servo drive microcontroller in CNC machines. IC Role / Device Role / Timing Role: Acts as deterministic handshake buffer: FPGA writes trajectory data to left port; MCU reads via right port with guaranteed 166MHz throughput and collision detection on concurrent access. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode (<20mA) support fanless enclosures; REPEAT/ADSL counter simplifies sequential buffer addressing.	Use Scenario: Temporary storage of raw CT/MRI voxel data between ADC front-end and GPU-based reconstruction engine in portable diagnostic equipment. IC Role / Device Role / Timing Role: High-bandwidth (14Gbps aggregate) dual-port SRAM bridges 16-bit parallel ADC streams (left port) and PCIe Gen3 x4 DMA controller (right port) with no FIFO bottlenecks. Use Value: 36-bit width matches 16-bit pixel + 16-bit metadata + 4-bit tag; BE0–BE3 enables selective write of pixel vs. metadata lanes without full-word overhead.

Telecom Line Card Buffering

Real-Time DSP Co-Processor Interface

Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade aggregation switches where deterministic latency is mandatory.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking frame buffer between line interface unit (LIU) and traffic manager ASIC, with left port handling ingress and right port egress.

Use Value: 3.6ns access time and pipelined output mode ensure sub-5ns round-trip latency, meeting ITU-T G.8261 jitter tolerance for 10Gbps transport layers.

Use Scenario: Shared memory between dual-core DSPs executing parallel filter algorithms in radar signal processing subsystems.

IC Role / Device Role / Timing Role: Serves as zero-wait-state shared scratchpad; left port connected to Core A's AXI bus, right port to Core B's AXI bus, synchronized via common clock domain.

Use Value: True dual-port architecture eliminates arbitration logic and software semaphores, increasing effective throughput by >35% versus single-port SRAM with bus multiplexer.

Industrial PLC Motion Control

Medical Imaging Data Pipeline

Use Scenario: Real-time exchange of position setpoints and encoder feedback between motion controller FPGA and servo drive microcontroller in CNC machines.

IC Role / Device Role / Timing Role: Acts as deterministic handshake buffer: FPGA writes trajectory data to left port; MCU reads via right port with guaranteed 166MHz throughput and collision detection on concurrent access.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode (<20mA) support fanless enclosures; REPEAT/ADSL counter simplifies sequential buffer addressing.

Use Scenario: Temporary storage of raw CT/MRI voxel data between ADC front-end and GPU-based reconstruction engine in portable diagnostic equipment.

IC Role / Device Role / Timing Role: High-bandwidth (14Gbps aggregate) dual-port SRAM bridges 16-bit parallel ADC streams (left port) and PCIe Gen3 x4 DMA controller (right port) with no FIFO bottlenecks.

Use Value: 36-bit width matches 16-bit pixel + 16-bit metadata + 4-bit tag; BE0–BE3 enables selective write of pixel vs. metadata lanes without full-word overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166BZXI	3.3V-only core/I/O; no per-port VDDQ select; 166MHz max in -40°C to +85°C; 208-pin TQFP (not BGA)	Lacks voltage flexibility and BGA footprint; requires PCB redesign and level-shifting for 2.5V logic domains	Choose only if legacy TQFP layout reuse is mandatory and system uses uniform 3.3V I/O.
IDT70V27L16PF8-166PFI	16-bit width (vs. 36-bit); 128K × 16 density; 208-pin PQFP; no JTAG; no sleep mode (ZZ)	Lower bandwidth (≤8Gbps); incompatible data width requires multiple devices or bus multiplexing; no boundary scan test support	Select only for cost-sensitive, lower-bandwidth applications where 36-bit width and JTAG are non-essential.

Compared with CY7C1362BV33-166BZXI and IDT70V27L16PF8-166PFI, the 70T3519S166BFG provides unique per-port voltage configurability, 36-bit native width, and integrated JTAG-enabling higher integration density, mixed-voltage interoperability, and production testability without trade-offs in speed or temperature range.

Availability

70T3519S166BFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant green packaging.

Supply support for 70T3519S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T35xx family was designed specifically for high-reliability, low-latency dual-port memory applications in telecom line cards, DSP subsystems, and real-time control systems demanding simultaneous multi-master access and deterministic timing.

FAQ

What is the maximum operating frequency of the 70T3519S166BFG at industrial temperature?

The 70T3519S166BFG is rated for 166MHz operation across the full industrial temperature range (–40°C to +85°C), with guaranteed 3.6ns maximum access time and 6ns clock cycle time in pipelined mode. This specification is validated per IDT datasheet DSC 5666/14 and applies specifically to the BFG208 package variant.

Does the 70T3519S166BFG support independent I/O voltage selection on left and right ports?

Yes, the 70T3519S166BFG supports independent I/O voltage selection via OPTL and OPTR pins: setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V, while OPTR = VSS (0V) sets the right port to 2.5V I/O with VDDQR = 2.5V. This per-port flexibility is confirmed in datasheet sections 6 and 8.

What package type is used for the 70T3519S166BFG, and what are its mechanical dimensions?

The 70T3519S166BFG uses a 208-pin fine-pitch Ball Grid Array (BFG208) package with a 15mm × 15mm body size and 0.8mm ball pitch. This is distinct from the BC256 (256-pin BGA) and DR208 (208-pin PQFP) variants, and is explicitly listed in the ordering information and pin configuration diagrams of the official datasheet.

How does the collision detection feature work in the 70T3519S166BFG?

The 70T3519S166BFG generates COLL (left port) and COLR (right port) active-high flags when simultaneous accesses to the same memory address occur across ports. Detection is synchronous to the respective port's clock, with guaranteed set/reset times of ≤4.2ns (tCOLS/tCOLR), enabling hardware arbitration logic to respond within one clock cycle without CPU intervention.

Is JTAG boundary scan supported on the 70T3519S166BFG, and which pins are used?

Yes, JTAG boundary scan compliant with IEEE 1149.1 is supported on the 70T3519S166BFG. The required pins are TCK (pin R4), TMS (pin T4), TDI (pin B2), TDO (pin C3), and TRST (pin R3), all located on the BFG208 package. JTAG functionality is retained even in ZZ sleep mode, as specified in datasheet note 4 on page 6.

70T3519S166BFG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 9Mbit

Memory Organization:: 256K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3519S166BFG FAQ

1.How can I place an order for 70T3519S166BFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3519S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3519S166BFG reliable?

The price and inventory of 70T3519S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166BFG is usually 5 days.

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70T3519S166BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3519S166BFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3519S166BFG?

For technical support, including 70T3519S166BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166BFG requirements.

6.How does Aetrix verify that 70T3519S166BFG is sourced from the original manufacturer or authorized distributors?

All 70T3519S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166BFG meets industry standards.

7.What is the process for return or replacement of 70T3519S166BFG?

All 70T3519S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166BFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3519S166BFG part is unused and in its original packaging.

Return procedure for 70T3519S166BFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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