Renesas 70T3519S166BFG8

Overview

70T3519S166BFG8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture, 2.5V core supply, selectable 2.5V/3.3V I/O interfaces per port, and industrial-grade operation up to 166MHz (3.6ns access). It enables simultaneous read/write access to the same memory location in telecom switching fabric and real-time DSP buffer applications.

For engineers reviewing the 70T3519S166BFG8 datasheet, 70T3519S166BFG8 pinout, 70T3519S166BFG8 application, or 70T3519S166BFG8 equivalent, key selection criteria include pipelined vs. flow-through output mode timing, independent port voltage configuration via OPT pins, collision/interrupt flag behavior, and BGA package thermal and routing constraints for high-density PCBs.

Technical Context

This device implements fully synchronous dual-port operation with separate clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write logic enabling 5ns cycle time at 200MHz. Each port supports independent power-down via dual chip enables (CE0X/CE1X) and sleep mode (ZZX) with JTAG IEEE 1149.1 compliance.

The memory array uses true dual-port cells with dedicated input registers per port, supporting burst data transfers and counter-based sequential addressing via ADSX/CNTENX/REPEATX controls. Pipelined output mode introduces one-cycle latency but reduces tCYC to 6ns at 166MHz, while flow-through mode delivers 3.6ns tCD with higher setup/hold margin.

Key Specifications

Pinout & Package

208-pin fine-pitch Ball Grid Array (BFG208) package with 15mm × 15mm footprint, 0.8mm ball pitch, and 1.4mm height. Requires separate 2.5V core (VDD) and configurable I/O (VDDQ) supplies per port; all VSS pins must be grounded.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-166AXC and IDT70V9269L15PF, the 70T3519S166BFG8 provides unique per-port voltage selection, pipelined output mode for higher throughput, and industrial-temperature 166MHz operation in a compact fpBGA-making it optimal for space-constrained, mixed-voltage, high-bandwidth embedded systems.

Availability

70T3519S166BFG8 is available at Aetrix Electronics and suitable for telecom switching fabric, DSP real-time buffering, and industrial motion control applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3519S166BFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in networking equipment, test instrumentation, and real-time control systems requiring simultaneous access and deterministic timing.

FAQ

What is the maximum operating frequency of the 70T3519S166BFG8 under industrial temperature conditions?

The 70T3519S166BFG8 is rated for 166MHz operation across the full industrial temperature range of –40°C to +85°C. This speed grade is validated with 3.6ns maximum clock-to-data valid (tCD2) in pipelined output mode and requires adherence to specified AC timing parameters including tCH2 (2.4ns min) and tCL2 (2.4ns min) for reliable functionality.

How does the OPT pin configuration affect the 70T3519S166BFG8's I/O voltage levels and power supply requirements?

For the 70T3519S166BFG8, setting OPTL or OPTR to VDD (2.5V) configures the corresponding port for 3.3V I/O signaling and requires VDDQL or VDDQR to be supplied at 3.3V ±150mV; setting OPTL or OPTR to VSS (0V) configures 2.5V I/O signaling and requires VDDQL or VDDQR at 2.5V ±100mV. Both ports can be independently configured, enabling mixed-voltage system integration without level shifters.

Can the 70T3519S166BFG8 support simultaneous read and write operations to the same memory address on both ports?

Yes, the 70T3519S166BFG8 uses true dual-port memory cells that allow simultaneous read and write access to the same memory location on left and right ports. When contention occurs, the internal collision detection logic asserts COLL or COLR flags within 3.6ns, allowing system firmware to resolve conflicts-ensuring data integrity without hardware arbitration circuitry.

What package type and dimensions does the 70T3519S166BFG8 use, and what are its PCB layout implications?

The 70T3519S166BFG8 uses a 208-pin fine-pitch BGA (BFG208) package measuring 15mm × 15mm with 0.8mm ball pitch. Its layout requires strict adherence to VDD/VDDQ decoupling (multiple 0.1µF + 10µF capacitors per supply rail), ground plane continuity beneath the die, and controlled-impedance routing for CLK/ADS signals to meet tSA/tHA timing margins-especially critical for 166MHz operation.

Does the 70T3519S166BFG8 support JTAG boundary scan, and which package variants include this feature?

Yes, the 70T3519S166BFG8 supports IEEE 1149.1 JTAG boundary scan via dedicated TDI, TDO, TCK, TMS, and TRST pins. This feature is available in the BFG208 (208-pin fpBGA) and BC256 (256-pin BGA) packages, but explicitly excluded from the DR208 (208-pin PQFP) variant due to pin count limitations as noted in the datasheet.