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Renesas 70T3519S166DR
- Part No.:
- 70T3519S166DR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-BFQFP
- Datasheet:
-
70T3519S166DR.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208PQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,026
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Product details
Overview
70T3519S166DR from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric and network packet buffering.
For engineers reviewing the 70T3519S166DR datasheet, 70T3519S166DR pinout, 70T3519S166DR application, or 70T3519S166DR equivalent, key selection criteria include its 208-pin PQFP package, industrial temperature support (–40°C to +85°C), JTAG-compliant IEEE 1149.1 test interface, dual chip enable depth expansion capability, and low-power sleep mode via ZZL/ZZR pins.
Technical Context
The 70T3519S166DR implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Its dual-port memory array uses true dual-port cells, not time-multiplexed banks, allowing concurrent access without arbitration logic.
It integrates independent address counters per port with ADS strobe, CNTEN enable, and REPEAT latch functionality for sequential burst addressing. The device supports separate OPTL/OPTR pins to configure each port's I/O voltage (2.5V or 3.3V) independently, while VDD remains fixed at 2.5V ±100mV for the core logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.2 Mbit); supports 256K-word depth with 36-bit parallel I/O per port |
| Max Clock Frequency | 166MHz (industrial grade); enables 5ns cycle time in pipelined mode for 14Gbps aggregate bandwidth |
| Access Time | 3.6ns (max) at 166MHz in pipelined mode; defines minimum clock-to-data-out latency for real-time buffering |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQL/VDDQR = 2.5V or 3.3V ±150mV (I/O); enables mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for sustained operation in base station and industrial control environments |
| Package | 208-pin plastic quad flat pack (PQFP); 28mm × 28mm body, 0.5mm lead pitch, RoHS-compliant green variant available |
| Power Management | Sleep mode (ZZL/ZZR active-high) reduces current to ≤15mA; full standby (ISB3) draws ≤5mA with CMOS-level inputs |
Pinout & Package
208-pin PQFP (DR208 package), 28mm × 28mm × 3.5mm body, 0.5mm lead pitch. All VDD pins require 2.5V supply; VDDQL/VDDQR must match OPTL/OPTR configuration (2.5V if OPT = 0V, 3.3V if OPT = 2.5V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Edge-triggered sampling of all port inputs; enables deterministic timing across both ports |
| A0L–A17L / A0R–A17R | 18-bit address bus per port | Supports full 256K-word addressing; A16/A17 are no-connect for smaller variants but functional here |
| I/O0L–I/O35L / I/O0R–I/O35R | 36-bit bidirectional data bus per port | True dual-port data path; no internal multiplexing required for simultaneous access |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable per port | Enables depth expansion without external logic; CE0=low + CE1=high activates port |
| BE0L–BE3L / BE0R–BE3R | Byte enable (9-bit groups) | Allows partial writes to 9-bit subwords (I/O0–8, 9–17, etc.), reducing bus contention |
| PL/FTL / PL/FTR | Pipeline/Flow-Through mode select | VIH = pipelined (1-cycle latency); VIL = flow-through (0-cycle latency); configurable per port |
| ZZL / ZZR | Port-specific sleep mode input | Asserting high disables dynamic inputs (except JTAG), cutting power while preserving state |
| INTL / INTR / COLL / COLR | Asynchronous status flags | Indicate interrupt or collision events; require external debouncing or edge detection |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables simultaneous read/write to identical addresses without arbitration logic or wait states |
| Selectable pipelined or flow-through output mode | Reduces latency to 3.6ns (pipelined) or eliminates it (flow-through), matching system timing budgets |
| Independent I/O voltage control per port | OPTL/OPTR pins allow one port at 3.3V and the other at 2.5V-critical for mixed-voltage FPGA/ASIC interfaces |
| Dual chip enables with depth expansion support | CE0/CE1 pair per port permits seamless memory stacking without glue logic or address decoding |
| JTAG boundary scan (IEEE 1149.1) | Enables in-system test and debug of PCB interconnects; supported in BGA packages (not DR208) |
| Address counter with repeat and strobe | ADSL/ADSR + CNTENL/CNTENR + REPEATL/REPEATR enable automatic burst addressing for DMA engines |
Applications
| Telecom Switching Fabric | Network Packet Buffering |
|---|---|
Use Scenario: High-speed line cards in carrier-grade routers performing header inspection and forwarding decisions. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress ASICs, synchronizing data flow across clock domains. Use Value: 166MHz pipelined operation ensures sub-4ns latency for packet metadata lookup, meeting strict 10G/40G line-rate requirements. | Use Scenario: Deep packet inspection systems requiring temporary storage of fragmented packets before reassembly. IC Role / Device Role / Timing Role: Left port accepts incoming packet fragments from PHY; right port feeds reassembly engine-both operating concurrently. Use Value: True dual-port architecture eliminates arbitration delays, enabling real-time buffering of >100k packets/sec without loss. |
| Industrial Motion Control | Radar Signal Processing |
Use Scenario: CNC controller boards managing multi-axis servo coordination with deterministic jitter control. IC Role / Device Role / Timing Role: Stores interpolated motion profiles and sensor feedback data; left port writes new trajectory points, right port reads for real-time execution. Use Value: Industrial temperature rating (–40°C to +85°C) and 3.6ns access ensure reliable operation in factory-floor enclosures without forced cooling. | Use Scenario: Phased-array radar front-ends digitizing and buffering ADC samples before FFT processing. IC Role / Device Role / Timing Role: Captures high-speed ADC streams (left port) while feeding pre-processed data to DSP (right port) in lockstep. Use Value: Independent 2.5V/3.3V I/O per port allows direct connection to 3.3V ADCs and 2.5V FPGAs-reducing level-shifter count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 3.3V core (not 2.5V); 166MHz max; 256K × 36; 208-pin TQFP; no JTAG | Requires 3.3V system rail; lacks sleep mode and address counter features | Choose when legacy 3.3V-only design exists and low-power sleep is unnecessary |
| IDT70V3519S166BG | Same architecture and specs but in 256-pin BGA; supports JTAG; higher pin count limits routing density | BGA footprint incompatible with PQFP layout; JTAG usable only in BGA variant | Choose when board space allows BGA and boundary-scan test is mandatory |
Compared with CY7C1362BV33-166AXC and IDT70V3519S166BG, the 70T3519S166DR uniquely balances industrial temperature support, 2.5V core efficiency, PQFP manufacturability, and per-port voltage flexibility-making it optimal for cost-sensitive, thermally constrained embedded systems where BGA assembly is impractical.
Availability
70T3519S166DR is available at Aetrix Electronics and suitable for telecom switching fabric, industrial motion control, and radar signal processing requiring stable component supply across extended lifecycle programs.
Supply support for 70T3519S166DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70T35xx family targets high-bandwidth, low-latency data buffering in synchronous systems-specifically engineered for telecom infrastructure, test equipment, and real-time control where deterministic dual-port access is critical.
FAQ
What is the maximum operating frequency of the 70T3519S166DR?
The 70T3519S166DR is rated for 166MHz operation in industrial temperature range (–40°C to +85°C). Its pipelined mode achieves a 5ns clock cycle time, supporting up to 14Gbps aggregate bandwidth across both ports. This frequency is validated and guaranteed per datasheet Table 11 under AC Electrical Characteristics.
Does the 70T3519S166DR support JTAG boundary scan?
No, the 70T3519S166DR does not support JTAG boundary scan. As noted in the Pin Configuration section (page 4, Note 9), JTAG is unavailable in the DR208 (208-pin PQFP) package due to pin count limitations. JTAG is only supported in the BGA variants (e.g., IDT70T3519S166BG).
How do the OPTL and OPTR pins configure I/O voltage levels on the 70T3519S166DR?
On the 70T3519S166DR, OPTL sets the left port's I/O voltage: VDD (2.5V) selects 3.3V operation (requiring VDDQL = 3.3V), while VSS (0V) selects 2.5V operation (requiring VDDQL = 2.5V). OPTR performs the same function independently for the right port. This enables mixed-voltage interfacing-for example, connecting left port to a 3.3V FPGA and right port to a 2.5V ASIC.
What is the purpose of the ZZL and ZZR pins on the 70T3519S166DR?
The ZZL and ZZR pins are independent sleep mode controls for the left and right ports of the 70T3519S166DR. When asserted high, each pin disables dynamic inputs (except JTAG, which remains active), reducing current draw to ≤15mA. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain functional. Recovery requires 3 clock cycles after deassertion.
Can the 70T3519S166DR operate with different supply voltages on its two ports?
Yes, the 70T3519S166DR supports independent I/O voltage selection per port via OPTL and OPTR. One port can be configured for 3.3V I/O (with VDDQL = 3.3V) while the other operates at 2.5V I/O (with VDDQR = 2.5V), provided their respective OPT pins are set accordingly. The core VDD remains fixed at 2.5V ±100mV for both ports.
70T3519S166DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
70T3519S166DR FAQ
1.How can I place an order for 70T3519S166DR through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3519S166DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3519S166DR reliable?
The price and inventory of 70T3519S166DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S166DR is usually 5 days.
3.What payment methods are accepted for 70T3519S166DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S166DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3519S166DR?
70T3519S166DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3519S166DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3519S166DR?
For technical support, including 70T3519S166DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S166DR requirements.
6.How does Aetrix verify that 70T3519S166DR is sourced from the original manufacturer or authorized distributors?
All 70T3519S166DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S166DR meets industry standards.
7.What is the process for return or replacement of 70T3519S166DR?
All 70T3519S166DR units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S166DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3519S166DR part is unused and in its original packaging.
Return procedure for 70T3519S166DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3519S166DR Tags
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