Renesas 70T3519S200BC

Overview

70T3519S200BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and pipelined or flow-through output modes. It delivers 3.4ns clock-to-data-out (tCD2) at 200MHz, supports simultaneous read/write access to the same memory location, and operates across commercial temperature range (0°C to +70°C).

For engineers reviewing the 70T3519S200BC datasheet, 70T3519S200BC pinout, 70T3519S200BC application, or 70T3519S200BC equivalent, this device is selected for high-bandwidth inter-processor communication, real-time packet buffering in telecom line cards, and deterministic latency control in FPGA co-processing systems where concurrent port access and sub-5ns timing margins are critical.

Technical Context

The 70T3519S200BC implements fully synchronous operation on both left and right ports with independent clock inputs (CLKL/CLKR), enabling asynchronous domain bridging. Its dual-chip-enable architecture (CE0/CE1 per port) allows seamless depth expansion without external logic, while the address counter with ADS/CNTEN/REPEAT controls supports burst-mode sequential addressing.

JTAG boundary scan (IEEE 1149.1 compliant) is integrated for testability, and sleep mode (via ZZL/ZZR) reduces dynamic current to ≤15mA while preserving JTAG accessibility. The device uses separate VDD (2.5V ±100mV) and VDDQ (2.5V or 3.3V ±150mV) supplies, with OPT pins configuring I/O voltage levels independently per port.

Key Specifications

Pinout & Package

70T3519S200BC is housed in a 256-pin Ball Grid Array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin configuration (3.3V if OPT = VDD, 2.5V if OPT = VSS). NC pins include A17L, A17R, A16L, and A16R per datasheet note.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33 and R1EX25616AS-200, the 70T3519S200BC uniquely delivers 36-bit width, 200MHz pipelined operation, per-port I/O voltage flexibility, and JTAG-all in a single 256-pin BGA-making it optimal for high-fidelity, low-latency dual-processor memory sharing where pin count and timing determinism are constrained.

Availability

70T3519S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA co-processing, real-time DSP, and redundant control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3519S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T3519S200BC belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor communication in telecom, test equipment, and real-time embedded systems.

FAQ

What is the maximum operating frequency and corresponding access time for 70T3519S200BC?

The 70T3519S200BC is rated for 200MHz operation with a pipelined output mode clock-to-data-valid time (tCD2) of 3.4ns. This specification applies only to the S200 speed grade in commercial temperature range (0°C to +70°C) and requires proper VDD (2.5V ±100mV) and VDDQ (2.5V or 3.3V ±150mV) supply conditions. Flow-through mode yields slower 10ns tCD1.

Does 70T3519S200BC support independent voltage configuration for left and right ports?

Yes, the 70T3519S200BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V signaling with VDDQL = 3.3V; setting OPTL = VSS (0V) configures it for 2.5V signaling with VDDQL = 2.5V. The right port is configured identically but independently using OPTR and VDDQR.

How does the collision detection feature work in 70T3519S200BC?

The 70T3519S200BC asserts COLL (left port) or COLR (right port) within 3.4ns when both ports attempt simultaneous access to the same memory location. These open-drain outputs require external pull-up resistors and serve as hardware-level conflict indicators-enabling immediate arbitration or fault logging without software polling overhead.

What package type and pin count does 70T3519S200BC use?

The 70T3519S200BC is supplied in a 256-pin Ball Grid Array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. Pin assignments follow the BC256/BCG256 footprint. Address pins A16L/A17L and A16R/A17R are no-connect (NC) for this variant, as confirmed in the datasheet pin configuration diagrams.

Is JTAG boundary scan supported on 70T3519S200BC?

Yes, the 70T3519S200BC implements full IEEE 1149.1-compliant JTAG boundary scan functionality with TDI, TDO, TCK, TMS, and TRST pins. This capability is enabled in the 256-pin BGA package; JTAG is explicitly omitted in the 208-pin PQFP (DR208) and fpBGA (BF208) variants per datasheet note.