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Renesas 70T3519S200BC8
- Part No.:
- 70T3519S200BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3519S200BC8.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,775
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Product details
Overview
70T3519S200BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 200MHz (5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes - used in high-bandwidth packet buffering for telecom line cards and FPGA co-processor memory subsystems.
For engineers reviewing the 70T3519S200BC8 datasheet, 70T3519S200BC8 pinout, 70T3519S200BC8 application, or 70T3519S200BC8 equivalent, key selection criteria include its 200MHz commercial-grade timing, independent port voltage configuration (2.5V core / 2.5V or 3.3V I/O), JTAG-compliant IEEE 1149.1 test support, and 256-pin BGA package with industrial-grade thermal range availability.
Technical Context
This device implements fully synchronous dual-port operation on both left and right ports, with register-controlled address, data, and control inputs to minimize setup/hold requirements. Its self-timed write architecture enables fast cycle times without external timing constraints.
The memory integrates independent pipelined/flow-through output mode selection per port via PL/FTL and PL/FTR pins, plus counter-enable and repeat-address logic for burst-mode addressing - all synchronized to rising-edge clock transitions with sub-nanosecond input timing margins at 200MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.2 Mbit total); supports depth expansion via dual chip enables CE0/CE1 without external logic |
| Max Clock Frequency | 200 MHz (5 ns cycle time); only available in commercial grade (0°C to +70°C) for this speed bin |
| Access Time | 3.4 ns clock-to-data-out (pipelined mode); enables tight timing closure in FPGA-attached memory interfaces |
| Supply Voltages | VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150 mV per port, selected independently via OPTL/OPTR |
| Operating Temperature | Commercial: 0°C to +70°C; industrial -40°C to +85°C supported at 166/133 MHz (not at 200 MHz) |
| Package | 256-pin Ball Grid Array (BGA); 17 mm × 17 mm body, 1.0 mm ball pitch, RoHS-compliant green variant available |
| JTAG Support | IEEE 1149.1 compliant; includes TCK, TMS, TDI, TDO, TRST; not available in PQFP or fpBGA variants |
Pinout & Package
70T3519S200BC8 is housed in a 256-pin BGA (package code BC256/BCG256), with 1.0 mm ball pitch and 17 mm × 17 mm footprint. Power delivery uses multiple dedicated VDD (2.5 V core), VDDQL/VDDQR (port-selectable I/O), and VSS pins distributed across the array for low-noise operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Rising-edge triggered; controls all registered inputs/outputs on respective port |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17 is NC for 128K/64K configurations |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data bus | 36-bit wide per port; byte-enable controlled (BE0–BE3 for 9-bit bytes) |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable inputs | Enable/disable port independently; double-buffered in pipelined mode for depth expansion |
| PL/FTL / PL/FTR | Output mode select | VIH = pipelined (1-cycle latency), VIL = flow-through (0-cycle latency); DC-stable during operation |
| OPTL / OPTR | I/O voltage option control | VDD = 3.3V I/O interface; VSS = 2.5V I/O interface; sets VDDQX supply requirement |
| ZZL / ZZR | Port sleep mode input | Asserting VIH disables dynamic inputs (except JTAG), reducing standby current to ≤15 mA/port |
| TCK/TMS/TDI/TDO/TRST | JTAG boundary scan interface | Fully compliant with IEEE 1149.1; 10 MHz max TCK frequency; not supported in PQFP/fpBGA packages |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses - critical for real-time inter-processor communication buffers |
| Selectable pipelined or flow-through output | Reduces system latency (0-cycle flow-through) or improves timing margin (1-cycle pipelined) per port independently |
| Independent I/O voltage per port | Allows interfacing with 2.5V FPGAs and 3.3V ASICs simultaneously without level shifters |
| Dual chip enables with depth expansion support | Eliminates need for external decode logic when stacking multiple devices for wider/deeper memory maps |
| Automatic power-down via CE0/CE1 | Drives port into low-power standby (ISB1 ≤270 mA) without software intervention or clock gating |
| JTAG boundary scan compliance | Enables production testability and debug visibility in dense PCB layouts without physical probe access |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line interface cards where ingress and egress paths require concurrent memory access. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency shared buffer between serializer/deserializer and traffic manager ASICs. Use Value: Simultaneous read/write capability eliminates arbitration overhead; 200MHz operation sustains >14 Gbps aggregate bandwidth. | Use Scenario: Providing low-latency scratchpad memory for Xilinx or Intel FPGA-based digital signal processors performing real-time FFT or filtering. IC Role / Device Role / Timing Role: High-speed local memory mapped to FPGA fabric via parallel bus, synchronized to FPGA clock domain. Use Value: Pipelined output mode aligns with FPGA register stages; independent 2.5V I/O matches FPGA bank voltage. |
| Industrial Motion Control | Avionics Data Acquisition |
Use Scenario: Real-time coordination of multi-axis servo controllers requiring deterministic exchange of position/velocity data between master and slave nodes. IC Role / Device Role / Timing Role: Shared memory hub accessed concurrently by two microcontrollers running complementary safety-critical tasks. Use Value: Collision detection flags (COLL/COLR) provide hardware-level synchronization; industrial temp rating (-40°C to +85°C) ensures reliability in harsh environments. | Use Scenario: Capturing high-rate sensor telemetry (e.g., inertial measurement units) in flight data recorders where deterministic write latency is mandatory. IC Role / Device Role / Timing Role: Burst-write buffer accepting ADC samples via one port while host processor reads completed frames via second port. Use Value: Self-timed write guarantees consistent 5ns cycle time regardless of address transition pattern; ZZ sleep mode reduces power during idle intervals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200AXC | 3.3V core; no 2.5V I/O option; 208-pin TQFP; lacks JTAG and counter/repeat features | Requires external level translation for 2.5V FPGA interfaces; no built-in address sequencing logic | Choose when board space permits TQFP and system does not require JTAG test or burst addressing |
| IDT70V27L25PF8 | Lower density (128K × 18); 25 MHz max; 100-pin TQFP; asynchronous interface | Not suitable for high-speed synchronous systems; lacks pipelined mode and dual-voltage I/O | Choose only for legacy cost-sensitive designs with relaxed bandwidth and timing requirements |
Compared with CY7C1362BV33-200AXC and IDT70V27L25PF8, the 70T3519S200BC8 delivers higher bandwidth (14 Gbps vs ≤3.2 Gbps), flexible per-port voltage configuration, and integrated JTAG - making it optimal for new high-performance embedded memory subsystems where timing determinism and testability are critical.
Availability
70T3519S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA acceleration, industrial motion control, and avionics data acquisition requiring stable component supply across product lifecycles.
Supply support for 70T3519S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xx family was designed specifically for ultra-low-latency, high-bandwidth dual-port memory applications in networking equipment, test instrumentation, and real-time embedded systems demanding deterministic access and robust signal integrity.
FAQ
What is the maximum operating frequency of the 70T3519S200BC8 and under what conditions?
The 70T3519S200BC8 is rated for 200 MHz operation (5 ns clock cycle time) in commercial temperature range (0°C to +70°C). This speed is guaranteed only in the 256-pin BGA package (BC256/BCG256) with proper decoupling and signal integrity layout. Industrial temperature support (-40°C to +85°C) is limited to 166 MHz and 133 MHz speed grades, not the S200 variant.
Does the 70T3519S200BC8 support independent voltage selection for each port's I/O interface?
Yes, the 70T3519S200BC8 supports independent I/O voltage selection per port using OPTL and OPTR pins. Setting OPTL to VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V; setting it to VSS (0 V) configures 2.5 V I/O with VDDQL = 2.5 V. The same applies independently to the right port via OPTR and VDDQR.
How does the pipelined versus flow-through output mode affect timing in the 70T3519S200BC8?
In pipelined mode (PL/FTL or PL/FTR = VIH), output data is delayed by one clock cycle (tCD2 ≤3.4 ns), improving setup margin for downstream receivers. In flow-through mode (PL/FTL or PL/FTR = VIL), data appears on the next rising clock edge (tCD1 ≤10 ns), minimizing latency but requiring tighter board-level timing closure. Both modes are configurable per port.
What is the function of the ZZL and ZZR pins on the 70T3519S200BC8?
The ZZL and ZZR pins are port-specific sleep mode inputs. When asserted high (VIH), they disable all dynamic inputs on that port - except JTAG signals - reducing standby current to ≤15 mA. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain active. Sleep mode recovery requires three clock cycles after deassertion.
Is JTAG boundary scan supported on the 70T3519S200BC8, and which package types include it?
Yes, the 70T3519S200BC8 supports full IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRST pins. This feature is available only in the 256-pin BGA (BC256/BCG256) package. It is explicitly excluded from the DR208 PQFP and BF208 fpBGA packages due to pin count limitations.
70T3519S200BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3519S200BC8 FAQ
1.How can I place an order for 70T3519S200BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3519S200BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3519S200BC8 reliable?
The price and inventory of 70T3519S200BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3519S200BC8 is usually 5 days.
3.What payment methods are accepted for 70T3519S200BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3519S200BC8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3519S200BC8?
70T3519S200BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3519S200BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3519S200BC8?
For technical support, including 70T3519S200BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3519S200BC8 requirements.
6.How does Aetrix verify that 70T3519S200BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3519S200BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3519S200BC8 meets industry standards.
7.What is the process for return or replacement of 70T3519S200BC8?
All 70T3519S200BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3519S200BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3519S200BC8 part is unused and in its original packaging.
Return procedure for 70T3519S200BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3519S200BC8 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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