Renesas 70T3519S200BCG

Overview

70T3519S200BCG from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 200MHz (5ns cycle time), supports 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and delivers 14Gbps aggregate bandwidth. It is used in high-throughput packet buffering for telecom line cards and network processors.

For engineers reviewing the 70T3519S200BCG datasheet, 70T3519S200BCG pinout, 70T3519S200BCG application, or 70T3519S200BCG equivalent, key selection criteria include pipelined vs. flow-through output mode timing, independent port voltage configuration via OPT pins, collision/interrupt flag behavior, and BGA package thermal-mechanical compatibility with high-density PCB layouts.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @200MHz). Its dual-chip-enable architecture allows seamless depth expansion without external logic, while the address counter with ADS/CNTEN/REPEAT enables burst-mode sequential addressing.

The JTAG interface complies with IEEE 1149.1 and supports boundary scan in the 256-pin BGA package; sleep mode (ZZL/ZZR) disables dynamic inputs except JTAG, reducing current to ≤15mA. Core VDD is fixed at 2.5V ±100mV, while each port's I/O voltage (VDDQ) is independently configurable to 2.5V or 3.3V via dedicated OPTL/OPTR pins.

Key Specifications

Pinout & Package

70T3519S200BCG is housed in a 256-pin BGA (package code BCG256) with 1.0mm ball pitch and 17mm × 17mm footprint. Power and ground balls are distributed across the array to minimize noise and support stable high-speed operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-200AXC and IDT70V27L25PF8, the 70T3519S200BCG uniquely combines 200MHz pipelined performance, per-port I/O voltage flexibility, hardware collision detection, and JTAG testability in a compact BGA-making it optimal for high-end networking and real-time embedded systems where latency, integration density, and debug capability are critical.

Availability

70T3519S200BCG is available at Aetrix Electronics and suitable for telecom infrastructure, network processor design, and real-time industrial control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3519S200BCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in networking, telecom, and real-time embedded systems-emphasizing synchronous operation, flexible I/O voltage, and robust system-level features like collision detection and JTAG.

FAQ

What is the maximum operating frequency of the 70T3519S200BCG?

The 70T3519S200BCG is rated for 200MHz operation (5ns cycle time) in commercial temperature range (0°C to +70°C). This speed grade is only available in the 256-pin BGA package and is not offered in industrial temperature range or fpBGA/PQFP variants.

Does the 70T3519S200BCG support independent I/O voltage selection on each port?

Yes, the 70T3519S200BCG supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTX to VDD (2.5V) configures that port for 3.3V I/O levels with VDDQX = 3.3V; setting OPTX to VSS (0V) configures 2.5V I/O levels with VDDQX = 2.5V. Both ports may operate at different voltages simultaneously.

How does the pipelined output mode affect timing in the 70T3519S200BCG?

In pipelined mode (PL/FTX = VIH), the 70T3519S200BCG reduces clock-to-data-out delay to 3.4ns (tCD2) versus 10ns in flow-through mode (tCD1). This one-cycle latency shift improves system throughput but requires managing output phase alignment-especially in systems where read data is consumed on the next clock edge.

What is the function of the ZZL and ZZR pins on the 70T3519S200BCG?

ZZL and ZZR are independent sleep mode enable inputs for the left and right ports. When asserted high, they disable dynamic inputs (except JTAG signals), reducing active current to ≤15mA. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain functional during sleep, allowing wake-up via external control without full reset.

Can the 70T3519S200BCG detect memory access collisions between ports?

Yes, the 70T3519S200BCG includes dedicated hardware collision detection logic. When both ports attempt write access to the same address in the same cycle, the COLL (left) and COLR (right) open-drain output flags assert within 3.4ns (tCOLS), providing immediate hardware notification without software intervention or arbitration overhead.