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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3539MS133BC

Name: 70T3539MS133BC
Brand: Renesas
SKU: 70T3539MS133BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3539MS133BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3539MS133BC.pdf

Description:: IC SRAM 18MBIT PAR 256CABGA

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Product details

Overview

70T3539MS133BC from IDT (now Renesas) is a high-speed synchronous dual-port SRAM with true dual-access architecture, 512K × 36-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports pipelined or flow-through output modes, features JTAG boundary scan, and operates at 133MHz in industrial temperature range (−40°C to +85°C) for real-time inter-processor communication in telecom switching fabrics.

For engineers reviewing the 70T3539MS133BC datasheet, 70T3539MS133BC pinout, 70T3539MS133BC application, or 70T3539MS133BC equivalent, key selection criteria include simultaneous left/right port access timing, dual chip enable depth expansion capability, collision/interrupt flag support, and independent VDDQ/OPT-controlled I/O voltage configuration per port.

Technical Context

The 70T3539MS133BC implements fully synchronous operation on both ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @133MHz). Its dual-port memory array allows concurrent read/write to the same location without arbitration logic.

It integrates dedicated address counter logic with ADS strobe, CNTEN enable, and REPEAT latch per port, plus hardware collision detection and interrupt generation. The device supports Dual Cycle Deselect (DCD) in pipelined mode and includes sleep mode (ZZL/ZZR) for dynamic power reduction while preserving JTAG accessibility.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 36 bits (18 Mbit total); enables 36-bit parallel data paths per port for high-bandwidth inter-processor links.
Max Clock Frequency	133 MHz (industrial grade); delivers 6 ns cycle time and 12 Gbps aggregate bandwidth across both ports.
Access Time	4.2 ns (max) in pipelined mode; ensures sub-5 ns clock-to-data valid latency for deterministic real-time response.
Supply Voltages	VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150/±100 mV per port (I/O), selected independently via OPTL/OPTR pins.
Operating Temperature	−40°C to +85°C; qualified for industrial embedded systems including base station control planes and packet processing modules.
Package	256-pin BGA (17 mm × 17 mm, 1.0 mm ball pitch); supports high-density PCB layouts with thermal and signal integrity optimization.
JTAG Support	IEEE 1149.1-compliant TAP controller (TCK, TMS, TDI, TDO, TRST); enables in-system test, debug, and boundary scan without external test fixtures.

Pinout & Package

70T3539MS133BC is housed in a 256-pin Ball Grid Array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. All VDD pins require connection to 2.5 V; VDDQ pins must match OPT pin state (3.3 V if OPT = VDD, 2.5 V if OPT = VSS).

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Edge-triggered master clock for left/right port registers; determines all timing parameters (tCYC, tCD, setup/hold windows).
A0L–A18L / A0R–A18R	Address inputs	19-bit address bus per port; accesses full 512K depth (2¹⁹ = 524,288 locations); supports burst addressing via internal counter.
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit parallel data path per port; byte-enable (BE0–BE3) allows granular 9-bit writes; tri-state controlled by OE and CE.
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs	Enables depth expansion without external logic: CE0L=LOW + CE1L=HIGH activates left port; both HIGH disables port.
R/WL / R/WR	Read/write direction control	Active-HIGH write enable; synchronous with CLK; combined with OE and BE controls read/write granularity and direction.
OEL / OER	Output enable	Asynchronous control of output drivers; overrides R/W state to place I/Os in high-Z (tri-state) regardless of clock or CE state.
PL/FTL / PL/FTR	Pipeline/Flow-through mode select	DC-level input (VIH/VIL) selecting output timing: pipelined (1-cycle delay, tCD2 = 4.2 ns) or flow-through (no delay, tCD1 = 15 ns).
INTL / INTR	Interrupt flag output	Open-drain active-low flag asserted when port collision or user-triggered event occurs; requires external pull-up for logic-level compatibility.
COLL / COLR	Collision detection output	Active-low signal indicating simultaneous access to identical memory location from both ports; enables hardware arbitration or error logging.
ZZL / ZZR	Sleep mode control	Asynchronous input disabling dynamic inputs (except JTAG); reduces current to ≤25 mA while retaining register state and JTAG accessibility.
TDI / TDO / TCK / TMS / TRST	JTAG boundary scan interface	Standard 5-pin IEEE 1149.1 interface supporting device identification, interconnect test, and in-circuit programming verification.

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous, independent read/write access to identical memory addresses-eliminates arbitration logic and guarantees deterministic latency.
Selectable pipelined or flow-through output	Configurable per port via PL/FT pin: pipelined mode achieves 4.2 ns tCD2 for high-throughput streaming; flow-through offers zero-cycle latency for low-latency control applications.
Dual chip enables (CE0/CE1)	Supports seamless depth expansion across multiple devices without additional decode logic-reduces BOM count and routing complexity in large memory subsystems.
Hardware collision and interrupt flags	Dedicated COLL/INT outputs provide immediate, cycle-accurate notification of concurrent access conflicts or user-defined events-enabling real-time fault handling without software polling.
Independent I/O voltage selection per port	OPTL/OPTR pins configure VDDQX to 2.5 V or 3.3 V per port-allows mixed-voltage system integration (e.g., 2.5 V FPGA interfacing with 3.3 V microcontroller).
Integrated address counter with repeat function	ADSL/ADSR + CNTENL/CNTENR + REPEATL/REPEATR enable automatic address incrementing and address recall-reducing CPU overhead in sequential buffer management.

Applications

Telecom Switch Fabric Memory	Real-Time DSP Co-Processor Buffer
Use Scenario: High-speed packet header lookup and forwarding in carrier-grade Ethernet switches using two ASICs sharing a common memory pool. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared FIFO/buffer between ingress and egress pipelines, enabling zero-wait-state handoff with deterministic 4.2 ns read latency. Use Value: Eliminates arbitration delays and serialization bottlenecks-supports line-rate 10G+ throughput with sub-10 ns inter-port data visibility.	Use Scenario: Real-time audio/video frame buffering between a DSP and host ARM processor in broadcast encoding equipment. IC Role / Device Role / Timing Role: Left port interfaces DSP (3.3 V LVTTL), right port interfaces ARM (2.5 V), with independent clock domains synchronized via handshake signals. Use Value: Enables voltage-level translation and asynchronous domain bridging without level shifters-reducing component count and signal integrity risk.
Industrial PLC Dual-Core Communication	Radar Signal Processing FIFO
Use Scenario: Inter-core messaging between safety-certified and non-safety-certified MCU cores in programmable logic controllers. IC Role / Device Role / Timing Role: Provides lock-free shared memory with hardware collision detection (COLL/INT) for fail-safe status exchange and command dispatch. Use Value: Guarantees atomic access detection and interrupt-driven error recovery-meeting IEC 61508 SIL-3 functional safety requirements.	Use Scenario: High-speed radar echo data capture between ADC front-end and FFT accelerator in automotive ADAS systems. IC Role / Device Role / Timing Role: Pipelined-mode operation (tCD2 = 4.2 ns) synchronizes with 133 MHz sampling clocks; JTAG enables in-field calibration verification. Use Value: Delivers sustained 12 Gbps bandwidth for multi-channel chirp storage-supporting >100 dB dynamic range without pipeline stalls.

Telecom Switch Fabric Memory

Real-Time DSP Co-Processor Buffer

Use Scenario: High-speed packet header lookup and forwarding in carrier-grade Ethernet switches using two ASICs sharing a common memory pool.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared FIFO/buffer between ingress and egress pipelines, enabling zero-wait-state handoff with deterministic 4.2 ns read latency.

Use Value: Eliminates arbitration delays and serialization bottlenecks-supports line-rate 10G+ throughput with sub-10 ns inter-port data visibility.

Use Scenario: Real-time audio/video frame buffering between a DSP and host ARM processor in broadcast encoding equipment.

IC Role / Device Role / Timing Role: Left port interfaces DSP (3.3 V LVTTL), right port interfaces ARM (2.5 V), with independent clock domains synchronized via handshake signals.

Use Value: Enables voltage-level translation and asynchronous domain bridging without level shifters-reducing component count and signal integrity risk.

Industrial PLC Dual-Core Communication

Radar Signal Processing FIFO

Use Scenario: Inter-core messaging between safety-certified and non-safety-certified MCU cores in programmable logic controllers.

IC Role / Device Role / Timing Role: Provides lock-free shared memory with hardware collision detection (COLL/INT) for fail-safe status exchange and command dispatch.

Use Value: Guarantees atomic access detection and interrupt-driven error recovery-meeting IEC 61508 SIL-3 functional safety requirements.

Use Scenario: High-speed radar echo data capture between ADC front-end and FFT accelerator in automotive ADAS systems.

IC Role / Device Role / Timing Role: Pipelined-mode operation (tCD2 = 4.2 ns) synchronizes with 133 MHz sampling clocks; JTAG enables in-field calibration verification.

Use Value: Delivers sustained 12 Gbps bandwidth for multi-channel chirp storage-supporting >100 dB dynamic range without pipeline stalls.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133AXC	512K × 36, 3.3 V core & I/O, no VDDQ/OPT flexibility; lacks JTAG and address counter features.	Requires external level translation for mixed-voltage systems; no hardware collision detection or interrupt flags.	Choose when 3.3 V-only interface suffices and JTAG/testability is not required-lower cost but reduced feature set.
AS7C35128P-133BIN	512K × 36, 2.5 V core/I/O only; no pipelined mode; max 133 MHz only in commercial grade (0°C to +70°C).	Not rated for industrial temperature; lacks dual CE, REPEAT, and collision detection logic.	Choose for cost-sensitive commercial applications where extended temperature range and advanced timing features are unnecessary.

Compared with CY7C1362BV33-133AXC and AS7C35128P-133BIN, the 70T3539MS133BC uniquely combines industrial temperature rating, per-port I/O voltage selection, pipelined/flow-through mode flexibility, and integrated JTAG-making it optimal for rugged, mixed-voltage, high-reliability embedded systems requiring hardware-assisted synchronization.

Availability

70T3539MS133BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, radar signal processing, and real-time DSP co-processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3539MS133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance timing, memory, and analog solutions for communications, computing, and industrial markets.

The 70T3539MS133BC belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency inter-processor communication in mission-critical embedded systems demanding industrial reliability and flexible voltage interfacing.

FAQ

What is the maximum operating frequency of the 70T3539MS133BC in industrial temperature range?

The 70T3539MS133BC is rated for guaranteed operation up to 133 MHz across the full industrial temperature range of −40°C to +85°C. This corresponds to a 7.5 ns clock cycle time (tCYC2) in pipelined mode and ensures deterministic timing compliance without derating under thermal stress.

How does the 70T3539MS133BC support mixed-voltage system design?

The 70T3539MS133BC supports mixed-voltage design through independent OPTL and OPTR pins, allowing left and right ports to operate at either 2.5 V or 3.3 V I/O levels simultaneously. Each port's VDDQ must match its OPT setting-enabling direct interfacing with heterogeneous processors (e.g., 2.5 V FPGA and 3.3 V microcontroller) without external level shifters.

Does the 70T3539MS133BC include hardware collision detection?

Yes, the 70T3539MS133BC includes dedicated hardware collision detection logic that asserts the COLL (left) and COLR (right) outputs when both ports attempt simultaneous access to the same memory address. This signal is active-low, cycle-accurate, and usable for real-time arbitration or fault logging without software intervention.

What is the purpose of the REPEAT function in the 70T3539MS133BC address counter?

The REPEAT function in the 70T3539MS133BC latches the last valid address loaded via ADSL or ADSR. When REPEATL or REPEATR is asserted, the internal address counter resets to that latched value-enabling rapid re-access to critical memory locations (e.g., status registers or command buffers) without CPU address reload overhead.

Can the 70T3539MS133BC enter low-power mode while maintaining JTAG accessibility?

Yes, asserting ZZL or ZZR places the corresponding port into sleep mode, reducing dynamic current to ≤25 mA while preserving JTAG functionality. The TDI, TDO, TCK, TMS, and TRST pins remain fully operational during sleep-allowing boundary scan testing and debugging even in ultra-low-power system states.

70T3539MS133BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 18Mbit

Memory Organization:: 512K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3539MS133BC FAQ

1.How can I place an order for 70T3539MS133BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS133BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS133BC reliable?

The price and inventory of 70T3539MS133BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS133BC is usually 5 days.

3.What payment methods are accepted for 70T3539MS133BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS133BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS133BC?

70T3539MS133BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS133BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS133BC?

For technical support, including 70T3539MS133BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS133BC requirements.

6.How does Aetrix verify that 70T3539MS133BC is sourced from the original manufacturer or authorized distributors?

All 70T3539MS133BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS133BC meets industry standards.

7.What is the process for return or replacement of 70T3539MS133BC?

All 70T3539MS133BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS133BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS133BC part is unused and in its original packaging.

Return procedure for 70T3539MS133BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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