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Renesas 70T3539MS133BCGI

Name: 70T3539MS133BCGI
Brand: Renesas
SKU: 70T3539MS133BCGI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3539MS133BCGI

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3539MS133BCGI.pdf

Description:: IC SRAM 18MBIT PAR 256CABGA

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Product details

Overview

70T3539MS133BCGI from IDT (now Renesas) is a high-speed synchronous dual-port static RAM with true dual-port architecture, 512K × 36-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports simultaneous read/write access to the same memory location and delivers 4.2ns clock-to-data-out in pipelined mode at 133MHz for industrial applications.

For engineers reviewing the 70T3539MS133BCGI datasheet, 70T3539MS133BCGI pinout, 70T3539MS133BCGI application, or 70T3539MS133BCGI equivalent, key selection considerations include dual-port timing coordination, independent voltage rail configuration (VDD = 2.5V, VDDQ per port), JTAG boundary-scan support, collision/interrupt flag handling, and BGA-256 thermal-mechanical constraints in high-bandwidth inter-processor or FPGA-to-ASIC bridging systems.

Technical Context

This device implements fully synchronous dual-port operation with separate clock inputs (CLKL/CLKR), independent chip enables (CE0L/CE1L, CE0R/CE1R), and byte-enable controls (BE0–BE3 per port) enabling depth expansion without external logic. Its address counter with ADS/CNTEN/REPEAT registers supports burst-mode sequential access without external address generation.

The core uses true dual-port SRAM cells with input/output registers on all control, address, and data lines-enabling 1.5ns setup and 0.5ns hold times at 166MHz. Pipelined or flow-through output modes are selected per port via PL/FTL and PL/FTR pins, with tCD2 = 4.2ns (pipelined) or tCD1 = 15ns (flow-through) at 133MHz.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 36 bits (18 Mbit total); enables 36-bit parallel data paths per port
Max Clock Frequency	133 MHz (industrial grade); supports 7.5 ns cycle time in pipelined mode
Access Time (tCD2)	4.2 ns (pipelined output); determines minimum latency between clock edge and valid data
Core Supply Voltage	VDD = 2.5 V ±100 mV; fixed low-voltage core reduces dynamic power vs. 3.3V SRAMs
I/O Voltage Support	Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing
Operating Temperature	−40°C to +85°C; qualified for industrial embedded control and telecom infrastructure
Package	256-pin BGA (17 mm × 17 mm, 1.0 mm pitch); requires controlled-impedance PCB layout for signal integrity

Pinout & Package

70T3539MS133BCGI is housed in a 256-ball fine-pitch BGA (package code BCG256), with 1.0 mm ball pitch and 17 mm × 17 mm body size. Power delivery includes dedicated VDD (core), VDDQL/VDDQR (port-specific I/O), and extensive VSS grounding (64 balls). Thermal pad not present; thermal management relies on solder joint conduction and board copper area.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock input	Synchronous edge-triggered timing reference for left/right port operations; no internal PLL
A0L–A18L / A0R–A18R	Address inputs	19-bit address bus per port; supports full 512K depth (2¹⁹ = 524,288 words)
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O	36-bit parallel data path per port; byte-wise control via BE0–BE3 (9-bit granularity)
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs	Enables depth expansion: CE0=low + CE1=high activates port; both high disables port
R/WL / R/WR	Read/write direction control	Active-high write enable; synchronous with clock edge; determines data flow direction per access
OEL / OER	Output enable	Asynchronous control of output drivers; overrides clock-driven output state
PL/FTL / PL/FTR	Pipeline/Flow-through mode select	DC-level input (VIH/VIL) selecting pipelined (1-cycle delay) or flow-through (0-cycle delay) output timing
ZZL / ZZR	Sleep mode control	Asynchronous shutdown of dynamic inputs (except JTAG); reduces current to ≤25 mA in full standby
TDI / TDO / TCK / TMS / TRST	JTAG boundary-scan interface	IEEE 1149.1-compliant test access port; operates independently during sleep mode
INTL / INTR / COLL / COLR	Interrupt & collision flags	Open-drain outputs signaling port contention (collision) or user-triggered interrupt events

Key Features

Feature	Design Value
True dual-port SRAM cell architecture	Enables simultaneous read and write to identical memory addresses-critical for lock-free inter-processor communication
Dual-cycle deselect (DCD) in pipelined mode	Allows seamless transition between active and deselected states without bus contention or timing violations
Per-port voltage selection (2.5V/3.3V)	OPTL/OPTR pins configure VDDQX rails independently-supports heterogeneous SoC/FPGA interfaces without level shifters
Integrated address counter with REPEAT	Eliminates external counter logic for burst transfers; REPEAT reloads last ADS-loaded address on demand
Collision detection and interrupt flags	Hardware-generated COLL/INT signals reduce software polling overhead in real-time deterministic systems
JTAG boundary-scan compliance	Enables IEEE 1149.1 test access during production and field diagnostics-even while in ZZ sleep mode

Applications

Telecom Line Card Buffering	FPGA-to-ASIC Data Bridge
Use Scenario: High-throughput packet buffering between line-side PHY and switch fabric ASIC in 10G/25G Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acting as asynchronous FIFO buffer with independent clock domains (PHY clock vs. fabric clock). Use Value: 133MHz pipelined operation provides 4.2ns tCD2 latency, enabling sub-10ns inter-port data transfer critical for cut-through switching.	Use Scenario: Real-time data exchange between Xilinx UltraScale+ FPGA and custom ASIC in radar signal processing subsystems. IC Role / Device Role / Timing Role: Shared memory resource with FPGA writing processed samples and ASIC reading for beamforming computation. Use Value: True dual-port architecture eliminates arbitration logic; collision flags alert firmware to resolve concurrent access before data corruption.
Industrial PLC Dual-Core Coordination	Medical Imaging Frame Store
Use Scenario: Synchronization of safety-critical motion control tasks across dual ARM Cortex-R5 cores in IEC 61508-certified PLCs. IC Role / Device Role / Timing Role: Deterministic shared memory with interrupt signaling for task handoff and status updates between lockstep cores. Use Value: −40°C to +85°C rating ensures reliability in uncontrolled cabinet environments; JTAG support enables in-system verification.	Use Scenario: Temporary storage of 16-bit grayscale ultrasound frames (1024×768) during real-time image reconstruction. IC Role / Device Role / Timing Role: High-bandwidth frame buffer accessed concurrently by acquisition engine (write port) and display controller (read port). Use Value: 36-bit width matches 16-bit pixel + metadata packing; 4.2ns tCD2 enables >200 MB/s sustained throughput per port.

Telecom Line Card Buffering

FPGA-to-ASIC Data Bridge

Use Scenario: High-throughput packet buffering between line-side PHY and switch fabric ASIC in 10G/25G Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as asynchronous FIFO buffer with independent clock domains (PHY clock vs. fabric clock).

Use Value: 133MHz pipelined operation provides 4.2ns tCD2 latency, enabling sub-10ns inter-port data transfer critical for cut-through switching.

Use Scenario: Real-time data exchange between Xilinx UltraScale+ FPGA and custom ASIC in radar signal processing subsystems.

IC Role / Device Role / Timing Role: Shared memory resource with FPGA writing processed samples and ASIC reading for beamforming computation.

Use Value: True dual-port architecture eliminates arbitration logic; collision flags alert firmware to resolve concurrent access before data corruption.

Industrial PLC Dual-Core Coordination

Medical Imaging Frame Store

Use Scenario: Synchronization of safety-critical motion control tasks across dual ARM Cortex-R5 cores in IEC 61508-certified PLCs.

IC Role / Device Role / Timing Role: Deterministic shared memory with interrupt signaling for task handoff and status updates between lockstep cores.

Use Value: −40°C to +85°C rating ensures reliability in uncontrolled cabinet environments; JTAG support enables in-system verification.

Use Scenario: Temporary storage of 16-bit grayscale ultrasound frames (1024×768) during real-time image reconstruction.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer accessed concurrently by acquisition engine (write port) and display controller (read port).

Use Value: 36-bit width matches 16-bit pixel + metadata packing; 4.2ns tCD2 enables >200 MB/s sustained throughput per port.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1355BV33-133BZI	3.3V-only core and I/O; no VDDQ voltage selection; 165-ball BGA; tCD = 5.0ns @133MHz	Lacks per-port voltage flexibility and JTAG; suitable only for 3.3V-only systems with less stringent timing	Choose when legacy 3.3V design compatibility outweighs need for mixed-voltage operation or advanced debug features
AS7C331025B-133BIN	Asynchronous dual-port (not synchronous); no clock inputs; 15ns access time; 208-pin TQFP	No pipelined mode, no JTAG, no collision detection; requires external handshake logic for burst transfers	Prefer only for cost-sensitive, lower-speed applications where synchronous timing coordination is unnecessary

Compared with CY7C1355BV33-133BZI and AS7C331025B-133BIN, the 70T3539MS133BCGI uniquely combines industrial-grade 133MHz synchronous operation, per-port I/O voltage selection, hardware collision detection, and IEEE 1149.1 JTAG-all in a single 256-BGA package-making it optimal for new high-reliability, mixed-voltage embedded designs.

Availability

70T3539MS133BCGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, medical imaging systems, and aerospace avionics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70T3539MS133BCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in microcontrollers, analog, power management, and high-performance memory solutions for industrial, automotive, and communications markets.

The 70T3539M family was designed specifically for deterministic, low-latency inter-processor communication in real-time embedded systems-emphasizing simultaneous access, voltage flexibility, and hardware-assisted synchronization.

FAQ

What is the maximum operating frequency of the 70T3539MS133BCGI in pipelined mode?

The 70T3539MS133BCGI supports up to 133 MHz in pipelined output mode (PL/FT = VIH), delivering a 7.5 ns clock cycle time and 4.2 ns clock-to-data-out (tCD2) at industrial temperature (−40°C to +85°C). This specification is guaranteed per the datasheet revision DSC 5678/10 and applies to both ports independently when configured for pipelined operation.

Can the left and right ports of the 70T3539MS133BCGI operate at different I/O voltages?

Yes-the 70T3539MS133BCGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This enables direct interfacing with mixed-voltage FPGAs or ASICs without external level shifters.

Does the 70T3539MS133BCGI support JTAG boundary-scan while in sleep mode?

Yes-the 70T3539MS133BCGI maintains full JTAG functionality (TCK, TMS, TDI, TDO, TRST) even when ZZL and ZZR are asserted to enter sleep mode. The JTAG TAP controller remains active and accessible, allowing in-system test and debug operations without waking the core or I/O circuitry-critical for low-power diagnostic scenarios.

How does collision detection work on the 70T3539MS133BCGI?

The 70T3539MS133BCGI asserts COLL (left port) or COLR (right port) open-drain outputs within 4.2 ns of detecting simultaneous read/write access to the same memory address. These flags remain active until cleared by a subsequent non-conflicting access or reset. They provide hardware-level notification to avoid software polling and enable deterministic resolution in real-time systems using the 70T3539MS133BCGI.

What is the power consumption of the 70T3539MS133BCGI in full standby mode?

In full standby mode (both CE0 and CE1 high per port, all inputs at CMOS levels), the 70T3539MS133BCGI draws ≤20 mA (typical 12 mA) at VDD = 2.5V and TA = +25°C. At industrial temperature extremes (−40°C/+85°C), ISB3 is specified ≤25 mA max-significantly lower than active operation (≤740 mA), enabling energy-efficient idle states in always-on embedded systems using the 70T3539MS133BCGI.

70T3539MS133BCGI Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 18Mbit

Memory Organization:: 512K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3539MS133BCGI FAQ

1.How can I place an order for 70T3539MS133BCGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS133BCGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS133BCGI reliable?

The price and inventory of 70T3539MS133BCGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS133BCGI is usually 5 days.

3.What payment methods are accepted for 70T3539MS133BCGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS133BCGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS133BCGI?

70T3539MS133BCGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS133BCGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS133BCGI?

For technical support, including 70T3539MS133BCGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS133BCGI requirements.

6.How does Aetrix verify that 70T3539MS133BCGI is sourced from the original manufacturer or authorized distributors?

All 70T3539MS133BCGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS133BCGI meets industry standards.

7.What is the process for return or replacement of 70T3539MS133BCGI?

All 70T3539MS133BCGI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS133BCGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS133BCGI part is unused and in its original packaging.

Return procedure for 70T3539MS133BCGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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