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Renesas 70T3539MS133BCI

Part No.:
70T3539MS133BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3539MS133BCI.pdf
Description:
IC SRAM 18MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,934

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Product details

Overview

70T3539MS133BCI from IDT (now Renesas) is a high-speed synchronous dual-port static RAM with true dual-port architecture, 512K × 36-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports simultaneous read/write access to the same memory location and delivers 4.2ns clock-to-data-out in pipelined mode at 133MHz for industrial applications including packet buffering in telecom line cards and real-time DSP co-processing.

For engineers reviewing the 70T3539MS133BCI datasheet, 70T3539MS133BCI pinout, 70T3539MS133BCI application, or 70T3539MS133BCI equivalent, key selection criteria include dual-port latency tolerance, independent voltage scaling per port, JTAG boundary-scan support, collision/interrupt flag handling, and BGA-256 thermal-mechanical compatibility in high-density routing environments.

Technical Context

The 70T3539MS133BCI implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @133MHz). Its dual-cycle deselect (DCD) logic and pipelined/flow-through output mode selection via PL/FT pins allow flexible timing alignment across multi-chip depth-expanded memory systems.

Each port features independent chip enables (CE0/CE1), byte enables (BE0–BE3), address strobe (ADS), counter enable (CNTEN), and repeat logic-supporting burst-addressed sequential reads without external counters. Collision detection and interrupt flags are generated synchronously to respective port clocks, enabling deterministic inter-port coordination in real-time control loops.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 36 bits (18 Mbit total); supports independent concurrent access to identical addresses on both ports
Max Clock Frequency 133 MHz (industrial grade); enables 6 ns cycle time in pipelined mode for deterministic low-latency throughput
Access Time 4.2 ns (max) clock-to-data-out in pipelined mode; ensures sub-8 ns round-trip latency for inter-processor communication
Supply Voltages VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150/±100 mV per port (I/Os), selected independently via OPTL/OPTR
Operating Temperature −40°C to +85°C; qualified for industrial embedded systems requiring sustained reliability under thermal cycling
Package 256-pin BGA (17 mm × 17 mm, 1.0 mm ball pitch); supports high-density PCB layouts with controlled impedance routing
Power Management Four standby modes (ISB1–ISB4) and sleep mode (ZZL/ZZR); reduces dynamic current to ≤25 mA in full standby

Pinout & Package

70T3539MS133BCI is housed in a 256-ball BGA package (package code BC256/BCG256) with 1.0 mm ball pitch, 17 mm × 17 mm body size, and 1.4 mm height. Power and ground balls are distributed across the array for low-inductance decoupling; VDD (2.5 V core) and VDDQ (2.5 V or 3.3 V I/O) are segregated per port.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Drives internal registers on rising edge; defines all timing windows (setup/hold, cycle time) per port independently
A0L–A18L / A0R–A18R Address inputs 19-bit address bus per port; supports full 512K depth addressing; ADSL/ADSR latches address on rising clock
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional data I/O (36-bit) Byte-wise controllable via BE0–BE3 (9-bit granularity); tri-state enabled by OE and CE states
CE0L/CE1L / CE0R/CE1R Dual chip enables Enable/disable port activity; CE0=LOW + CE1=HIGH activates port; allows depth expansion without glue logic
R/WL / R/WR Read/write direction control Synchronous active-HIGH signal; determines data flow direction on next clock edge; overrides OE state
OEL / OER Output enable Asynchronous control; places I/Os in high-Z when HIGH, regardless of clock or R/W state
PL/FTL / PL/FTR Pipeline/Flow-through mode select DC input (VIH = pipelined, VIL = flow-through); selects between 1-cycle latency (pipelined) or 0-cycle latency (flow-through) output
INTL / INTR Interrupt flag output Active-HIGH synchronous pulse indicating completion of write or collision event; requires external edge-triggered interrupt controller
COLL / COLR Collision detection flag Asserted when simultaneous access to same address occurs; enables arbitration logic without polling overhead
ZZL / ZZR Sleep mode enable Asynchronous input; disables dynamic inputs (except JTAG) and reduces ICC to ≤25 mA; retains memory contents
TCK/TMS/TDI/TDO/TRST JTAG boundary-scan interface IEEE 1149.1 compliant; supports in-system test, configuration verification, and debug visibility without halting operation

Key Features

Feature Design Value
True dual-port memory cells Enables simultaneous read/write to identical addresses on left and right ports-critical for lock-free inter-processor communication
Selectable pipelined or flow-through output Reduces system-level latency variability: pipelined mode gives predictable 1-cycle delay; flow-through gives zero-cycle delay for tight timing budgets
Independent per-port I/O voltage selection OPTL/OPTR pins configure each port for 2.5V or 3.3V signaling-allows seamless interfacing with mixed-voltage SoCs or FPGAs
Hardware address counter with repeat Eliminates external counter logic: CNTEN advances address on clock; REPEAT reloads last ADS-loaded address-ideal for burst DMA transfers
Collision and interrupt flags Hardware-asserted synchronous signals (COLx/INTx) reduce software polling overhead and enable deterministic response in real-time OS contexts
Four-tier standby power management ISB1–ISB4 modes scale current from 280 mA (active port) to 12 mA (full CMOS standby); ZZ sleep mode cuts to ≤25 mA while preserving data

Applications

Telecom Packet Buffering DSP Co-Processor Memory

Use Scenario: Line card ASICs buffer incoming/outgoing Ethernet or SONET frames before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared FIFO between ingress and egress engines, with left port writing packets and right port reading for processing.

Use Value: Simultaneous access eliminates arbitration delays; 4.2ns tCD2 ensures <8 ns inter-engine handoff latency at 133MHz clocking.

Use Scenario: FPGA-based motor control system runs real-time PID loop on one processor while feeding sensor data to a second DSP core.

IC Role / Device Role / Timing Role: 70T3539MS133BCI serves as coherent shared memory between processors, with collision flags preventing data corruption during concurrent updates.

Use Value: Hardware collision detection replaces software semaphores; pipelined mode aligns with DSP's deterministic instruction pipeline.

Industrial PLC Data Exchange Test Equipment Pattern Memory

Use Scenario: Programmable logic controller exchanges I/O status and control commands between CPU and fieldbus interface module.

IC Role / Device Role / Timing Role: Left port connects to CPU bus; right port interfaces to fieldbus ASIC; both operate at 2.5V for noise immunity in electrically noisy factory environments.

Use Value: Independent VDDQ selection isolates voltage domains; interrupt flags signal state changes without polling, reducing CPU load.

Use Scenario: Automated test equipment stores stimulus/response patterns for semiconductor wafer probing, requiring fast random-access reads/writes.

IC Role / Device Role / Timing Role: Functions as pattern RAM accessed simultaneously by pattern generator (write) and comparator (read) engines.

Use Value: True dual-port architecture enables continuous streaming without wait states; 133MHz operation supports >1 Gbps pattern throughput.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZI 512K × 36, 3.3V core & I/O, no per-port voltage selection; lacks JTAG and address counter features Requires external level-shifting for mixed-voltage systems; no hardware collision detection or interrupt flags Choose when cost sensitivity outweighs need for advanced power management and inter-port coordination logic
AS7C331024B-133BIN 1M × 36 organization, 2.5V core, 2.5V/3.3V I/O per port, but only commercial temperature range (0°C to +70°C) Higher density but not rated for industrial ambient; lacks DCD logic and dual-cycle deselect capability Choose for higher-capacity needs in non-industrial environments where extended temperature operation is unnecessary

Compared with CY7C1362BV33-133BZI and AS7C331024B-133BIN, the 70T3539MS133BCI uniquely combines industrial temperature rating, per-port I/O voltage flexibility, JTAG testability, and hardware collision/interrupt signaling-making it optimal for deterministic real-time embedded systems where reliability and inter-processor coordination are critical.

Availability

70T3539MS133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and test equipment requiring stable component supply across extended lifecycle commitments and volume production ramps.

Supply support for 70T3539MS133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) designs high-performance memory, timing, and interface solutions for mission-critical embedded systems, with deep expertise in synchronous SRAM and real-time connectivity.

The 70T3539MS133BCI belongs to Renesas' high-speed dual-port SRAM product line, engineered specifically for deterministic inter-processor communication in industrial automation, telecom infrastructure, and test instrumentation where simultaneous access, low latency, and robust power management are essential.

FAQ

What is the maximum operating frequency of the 70T3539MS133BCI in industrial temperature range?

The 70T3539MS133BCI is rated for up to 133 MHz operation across −40°C to +85°C. This corresponds to a minimum clock cycle time of 7.5 ns in pipelined mode and guarantees 4.2 ns clock-to-data-out timing under worst-case industrial conditions, validated per AC Electrical Characteristics Table 11 in the official datasheet.

Does the 70T3539MS133BCI support independent I/O voltage selection on left and right ports?

Yes, the 70T3539MS133BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V; setting OPTR = VSS (0 V) configures the right port for 2.5 V I/O levels with VDDQR = 2.5 V-enabling mixed-voltage system integration without level shifters.

How does collision detection work on the 70T3539MS133BCI?

The 70T3539MS133BCI asserts COLL or COLR synchronously to the respective port clock when both ports attempt read/write access to the same memory address within one clock cycle. The flag remains asserted until cleared by a subsequent non-colliding access, enabling hardware-driven arbitration without software polling overhead-critical for real-time deterministic response.

What is the purpose of the REPEATL and REPEATR pins on the 70T3539MS133BCI?

REPEATL and REPEATR are asynchronous inputs that reset the internal address counter to the last valid address loaded via ADSL or ADSR. When asserted, they enable rapid re-access to a known memory location-useful for burst-mode DMA transfers or circular buffer implementations without external address generation logic.

Can the 70T3539MS133BCI enter low-power sleep mode while retaining memory contents?

Yes, asserting ZZL or ZZR places the corresponding port into sleep mode, disabling dynamic inputs (except JTAG) and reducing ICC to ≤25 mA. Memory contents are retained during sleep, and recovery requires exactly three clock cycles (tZZRC), as specified in AC Electrical Characteristics Table 11. Both ports can be placed in sleep mode independently.

70T3539MS133BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3539MS133BCI FAQ

1.How can I place an order for 70T3539MS133BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS133BCI reliable?

The price and inventory of 70T3539MS133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS133BCI is usually 5 days.

3.What payment methods are accepted for 70T3539MS133BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS133BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS133BCI?

70T3539MS133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS133BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS133BCI?

For technical support, including 70T3539MS133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS133BCI requirements.

6.How does Aetrix verify that 70T3539MS133BCI is sourced from the original manufacturer or authorized distributors?

All 70T3539MS133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS133BCI meets industry standards.

7.What is the process for return or replacement of 70T3539MS133BCI?

All 70T3539MS133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS133BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS133BCI part is unused and in its original packaging.

Return procedure for 70T3539MS133BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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