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Renesas 70T3539MS133BCI8

Name: 70T3539MS133BCI8
Brand: Renesas
SKU: 70T3539MS133BCI8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3539MS133BCI8

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3539MS133BCI8.pdf

Description:: IC SRAM 18MBIT PAR 256CABGA

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Product details

Overview

70T3539MS133BCI8 from IDT (now Renesas) is a high-speed synchronous dual-port SRAM with true dual-port architecture, 512K × 36-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports simultaneous read/write access to the same memory location and delivers 4.2ns clock-to-data-out in pipelined mode at 133MHz - ideal for real-time packet buffering in telecom line cards and FPGA co-processor interconnects.

For engineers reviewing the 70T3539MS133BCI8 datasheet, 70T3539MS133BCI8 pinout, 70T3539MS133BCI8 application, or 70T3539MS133BCI8 equivalent, key selection criteria include industrial-grade temperature support (−40°C to +85°C), dual-cycle deselect for pipelined output timing, JTAG boundary-scan testability, and independent voltage control per port via OPTL/OPTR pins.

Technical Context

The 70T3539MS133BCI8 implements fully synchronous operation on both left and right ports with dedicated clocks (CLKL/CLKR), address strobes (ADSL/ADSR), and byte-enable groups (BE0–BE3 per port). Its internal address counter enables burst-mode sequential access without external address generation.

Collision detection (COLL/COLR) and interrupt flag (INTL/INTR) outputs provide hardware-level synchronization between ports, while sleep mode (ZZL/ZZR) reduces dynamic current to ≤25mA with full JTAG accessibility retained. Pipelined and flow-through output modes are selected per port via PL/FTL and PL/FTR pins.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 36 bits (18 Mbit total); enables 36-bit parallel data paths for high-throughput inter-processor communication
Max Clock Frequency	133 MHz (industrial grade); supports 7.5 ns cycle time in pipelined mode for deterministic latency-critical systems
Access Time	4.2 ns (max) clock-to-data-out in pipelined mode; ensures sub-5 ns timing margin for 200+ Mbps serial link buffers
Supply Voltages	VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150 mV per port (selectable via OPTL/OPTR)
Operating Temperature	−40°C to +85°C; qualified for industrial embedded applications including base station control planes and motor drive controllers
Package	256-pin BGA (17 mm × 17 mm, 1.0 mm pitch); compatible with standard SMT reflow profiles and high-density PCB layouts
Power Consumption	ISB3 = 12–25 mA (full standby); Izz = 12–25 mA (sleep mode); enables low-power idle states in always-on network appliances

Pinout & Package

70T3539MS133BCI8 is housed in a 256-pin Ball Grid Array (BGA) package with 17 mm × 17 mm body and 1.0 mm ball pitch. All VDD pins require 2.5 V; VDDQ pins must match port I/O voltage (2.5 V or 3.3 V per OPT setting); VSS pins connect to ground.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific clock inputs	Synchronous edge-triggered timing reference for all control/data transfers on respective port; supports independent clock domains
A0L–A18L / A0R–A18R	Address inputs (19-bit)	Directly select one of 512K addresses per port; ADSL/ADSR enable address latching on rising clock edge
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data I/O (36-bit)	True dual-port data path: simultaneous read from one port and write to same address on other port without arbitration logic
CE0L/CE1L / CE0R/CE1R	Dual chip enables per port	Enable depth expansion without external logic: CE0X = low + CE1X = high activates port; both high places port in standby
PL/FTL / PL/FTR	Pipeline/Flow-through mode select	VIH = pipelined (1-cycle latency); VIL = flow-through (0-cycle latency); configurable per port for mixed-timing system integration
ZZL / ZZR	Sleep mode control	Asserting high disables dynamic inputs (except JTAG), reducing power to ≤25 mA while preserving boundary-scan capability
TCK/TMS/TDI/TDO/TRST	JTAG test interface	Fully compliant IEEE 1149.1 boundary-scan; enables in-system verification and interconnect testing without functional interruption

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write access to identical memory locations - eliminates arbitration overhead in symmetric multiprocessing systems
Dual-cycle deselect (DCD)	Guarantees clean bus release after two clock cycles in pipelined mode, preventing metastability during port handoff in FIFO emulation
Independent I/O voltage per port	OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V - simplifies interfacing between legacy 3.3 V FPGAs and modern 2.5 V ASICs
Hardware collision detection	COLL/COLR flags assert within 4.2 ns when both ports attempt write to same address - enables immediate software recovery without polling
Address counter with repeat	CNTENL/CNTENR and REPEATL/REPEATR support auto-incrementing burst reads/writes and instant return to last ADS-loaded address - accelerates DMA transfers

Applications

Telecom Packet Buffering	FPGA-CPU Co-Processor Interface
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory between ingress and egress traffic managers. Use Value: 4.2 ns tCD2 enables frame header inspection and rewrite within single 133 MHz clock cycle, meeting <100 ns end-to-end forwarding SLA.	Use Scenario: High-bandwidth data exchange between Xilinx Kintex FPGA and ARM Cortex-A9 processor in industrial vision controller. IC Role / Device Role / Timing Role: Serves as synchronized mailbox memory with independent clock domains for FPGA logic and CPU subsystem. Use Value: Pipelined output mode and collision flags eliminate software semaphore overhead, achieving 12 Gbps aggregate bandwidth (6 ns cycle time).
Radar Signal Processing Buffer	Real-Time Motion Control Memory
Use Scenario: Holding intermediate FFT results between ADC sampling and DSP computation stages in phased-array radar. IC Role / Device Role / Timing Role: Provides deterministic-access scratchpad memory accessible concurrently by ADC DMA engine and DSP core. Use Value: −40°C to +85°C rating and 133 MHz operation ensure reliable burst capture at 200 MSPS sample rates across environmental extremes.	Use Scenario: Storing position setpoints and encoder feedback in closed-loop servo drives with microsecond jitter requirements. IC Role / Device Role / Timing Role: Acts as time-critical shared register bank between motion controller ASIC and fieldbus interface IC. Use Value: Sleep mode (ZZL/ZZR) cuts standby current to ≤25 mA while retaining JTAG debug access - critical for fanless enclosure thermal management.

Telecom Packet Buffering

FPGA-CPU Co-Processor Interface

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory between ingress and egress traffic managers.

Use Value: 4.2 ns tCD2 enables frame header inspection and rewrite within single 133 MHz clock cycle, meeting <100 ns end-to-end forwarding SLA.

Use Scenario: High-bandwidth data exchange between Xilinx Kintex FPGA and ARM Cortex-A9 processor in industrial vision controller.

IC Role / Device Role / Timing Role: Serves as synchronized mailbox memory with independent clock domains for FPGA logic and CPU subsystem.

Use Value: Pipelined output mode and collision flags eliminate software semaphore overhead, achieving 12 Gbps aggregate bandwidth (6 ns cycle time).

Radar Signal Processing Buffer

Real-Time Motion Control Memory

Use Scenario: Holding intermediate FFT results between ADC sampling and DSP computation stages in phased-array radar.

IC Role / Device Role / Timing Role: Provides deterministic-access scratchpad memory accessible concurrently by ADC DMA engine and DSP core.

Use Value: −40°C to +85°C rating and 133 MHz operation ensure reliable burst capture at 200 MSPS sample rates across environmental extremes.

Use Scenario: Storing position setpoints and encoder feedback in closed-loop servo drives with microsecond jitter requirements.

IC Role / Device Role / Timing Role: Acts as time-critical shared register bank between motion controller ASIC and fieldbus interface IC.

Use Value: Sleep mode (ZZL/ZZR) cuts standby current to ≤25 mA while retaining JTAG debug access - critical for fanless enclosure thermal management.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133AXC	3.3 V core; no 2.5 V option; 166 MHz max (commercial only); lacks JTAG and address counter features	Requires 3.3 V system-wide; unsuitable for industrial temp or mixed-voltage designs; no built-in burst address generation	Select only if existing design uses Cypress footprint and operates strictly at 0°C–70°C with 3.3 V I/O
AS7C331024B-133BIN	Single-port architecture; 133 MHz max; no collision detection or dual chip enables; 2.5 V only	Cannot support true concurrent access; requires external arbitration logic; incompatible with pipelined timing models	Consider only for cost-sensitive, non-concurrent applications where dual-port functionality is not required

Compared with CY7C1362BV33-133AXC and AS7C331024B-133BIN, the 70T3539MS133BCI8 uniquely combines industrial temperature support, per-port voltage selection, hardware collision detection, and JTAG testability - making it the only viable option for ruggedized, mixed-voltage, real-time dual-access memory systems.

Availability

70T3539MS133BCI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, radar signal processing, and FPGA-based embedded systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3539MS133BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T3539MS133BCI8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic-latency, multi-processor interconnect and real-time buffering applications demanding concurrent access and industrial reliability.

FAQ

What is the maximum operating frequency of the 70T3539MS133BCI8 at industrial temperature?

The 70T3539MS133BCI8 is rated for 133 MHz operation across the full industrial temperature range of −40°C to +85°C. This is confirmed by AC Electrical Characteristics Table 11 in the datasheet, which specifies tCYC2 = 7.5 ns (max) and tCD2 = 4.2 ns (max) under industrial conditions - directly supporting 133 MHz clocking with timing margin.

Does the 70T3539MS133BCI8 support independent I/O voltage selection on each port?

Yes, the 70T3539MS133BCI8 supports independent I/O voltage selection per port using OPTL and OPTR pins. Setting OPTL to VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V; setting OPTR to VSS (0 V) configures the right port for 2.5 V I/O levels with VDDQR = 2.5 V - enabling mixed-voltage system integration without level shifters.

How does collision detection work on the 70T3539MS133BCI8?

The 70T3539MS133BCI8 asserts COLL (left port) or COLR (right port) within 4.2 ns when both ports attempt a write to the same memory address simultaneously. These open-drain outputs require pull-up resistors and enable immediate hardware-triggered recovery - eliminating software polling delays and ensuring deterministic response in safety-critical motion control loops.

Can the 70T3539MS133BCI8 operate in flow-through output mode?

Yes, the 70T3539MS133BCI8 supports flow-through output mode on either port by driving PL/FTL or PL/FTR low. In this mode, tCD1 = 15 ns (max), providing zero-cycle latency between clock edge and valid output - essential for applications like real-time digital oscilloscope waveform capture where minimal pipeline delay is mandatory.

Is JTAG boundary-scan supported on the 70T3539MS133BCI8?

Yes, the 70T3539MS133BCI8 includes full IEEE 1149.1-compliant JTAG boundary-scan functionality via TCK, TMS, TDI, TDO, and TRST pins. JTAG remains fully operational even when ZZL/ZZR sleep mode is asserted - enabling in-system test and debug without powering up the full memory array.

70T3539MS133BCI8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 18Mbit

Memory Organization:: 512K x 36

Memory Interface:: Parallel

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 4.2 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3539MS133BCI8 FAQ

1.How can I place an order for 70T3539MS133BCI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS133BCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS133BCI8 reliable?

The price and inventory of 70T3539MS133BCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS133BCI8 is usually 5 days.

3.What payment methods are accepted for 70T3539MS133BCI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS133BCI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS133BCI8?

70T3539MS133BCI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS133BCI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS133BCI8?

For technical support, including 70T3539MS133BCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS133BCI8 requirements.

6.How does Aetrix verify that 70T3539MS133BCI8 is sourced from the original manufacturer or authorized distributors?

All 70T3539MS133BCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS133BCI8 meets industry standards.

7.What is the process for return or replacement of 70T3539MS133BCI8?

All 70T3539MS133BCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS133BCI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS133BCI8 part is unused and in its original packaging.

Return procedure for 70T3539MS133BCI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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