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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3539MS166BC

Name: 70T3539MS166BC
Brand: Renesas
SKU: 70T3539MS166BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3539MS166BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3539MS166BC.pdf

Description:: IC SRAM 18MBIT PAR 256CABGA

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Product details

Overview

70T3539MS166BC from IDT (now Renesas) is a high-speed synchronous dual-port static RAM with true dual-access architecture, 512K × 36-bit organization, 2.5V core supply, and selectable 2.5V/3.3V I/O interfaces per port. It delivers 3.6ns clock-to-data-out (pipelined mode) and supports 166MHz operation for real-time inter-processor communication in telecom line cards and FPGA co-processing systems.

For engineers reviewing the 70T3539MS166BC datasheet, 70T3539MS166BC pinout, 70T3539MS166BC application, or 70T3539MS166BC equivalent, key selection criteria include pipelined vs. flow-through output timing, independent port voltage configuration via OPT pins, collision/interrupt flag handling, JTAG boundary-scan support, and industrial-grade (-40°C to +85°C) thermal stability at full speed.

Technical Context

The 70T3539MS166BC implements fully synchronous dual-port operation with separate clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and dual-cycle deselect (DCD) for pipelined output mode. Its memory array uses true dual-port SRAM cells enabling simultaneous read/write access to identical addresses without arbitration logic.

Each port features independent power domains: 2.5V core (VDD) and configurable I/O supply (VDDQ) set by OPTL/OPTR pins-supporting mixed-voltage system integration. Critical timing functions-including address counter enable (CNTEN), repeat (REPEAT), and address strobe (ADSL/ADSR)-are synchronized to respective port clocks and decoupled from chip-enable states.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	512K × 36 bits (18 Mbit total); enables 36-bit parallel data exchange between two independent bus masters.
Max Clock Frequency	166 MHz (commercial grade); supports 6 ns cycle time in pipelined mode for 12 Gbps aggregate bandwidth.
Access Time	3.6 ns (pipelined), 12 ns (flow-through); determines minimum latency for deterministic real-time data handoff.
I/O Voltage Support	Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows seamless interfacing with legacy 3.3V FPGAs and modern 2.5V ASICs.
Operating Temperature	-40°C to +85°C (industrial); validated for continuous operation at 133 MHz under full thermal stress.
Power Management	Dual CE-based standby modes and ZZ sleep mode; reduces dynamic current to 12 mA (ISB3) or 12 mA (Izz) during idle.
JTAG Interface	IEEE 1149.1-compliant TAP controller (TCK, TMS, TDI, TDO, TRST); enables in-system test and debug without external probes.

Pinout & Package

70T3539MS166BC is housed in a 256-pin BGA (17 mm × 17 mm, 1.0 mm ball pitch), with dedicated power/ground balls distributed across the array to minimize noise coupling between ports. VDD (2.5V core) and VDDQ (2.5V/3.3V I/O) supplies are segregated per port, and all VSS balls must be connected to a low-impedance ground plane.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-specific synchronous clock input	Drives all internal registers on left/right port; defines timing reference for setup/hold and access cycles.
A0L–A18L / A0R–A18R	19-bit address inputs per port	Directly selects one of 524,288 (2¹⁹) memory locations; no external address decoding required.
I/O0L–I/O35L / I/O0R–I/O35R	36-bit bidirectional data bus per port	Supports byte-wise write enable (BE0–BE3) for partial-word updates without read-modify-write overhead.
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs per port	Enables depth expansion: CE0L=LOW + CE1L=HIGH activates left port; both HIGH disables port entirely.
R/WL / R/WR	Read/write direction control per port	Synchronous edge-triggered; combined with OE and BE signals to define precise read/write window timing.
OEL / OER	Asynchronous output enable per port	Tri-states I/O bus independently of clock; critical for bus sharing and hot-swap-safe memory access.
OPTL / OPTR	I/O voltage select input per port	Set to VDD (2.5V) → 3.3V I/O levels; set to VSS (0V) → 2.5V I/O levels; configures VDDQX supply requirement.
ZZL / ZZR	Port-specific sleep mode input	Asserted HIGH disables dynamic inputs (except JTAG), reducing power to 12 mA while preserving memory state.
INTL / INTR	Interrupt flag output per port	Signals completion of write or counter-triggered event; used for handshake-driven firmware synchronization.
COLL / COLR	Collision detection output per port	Asserts when simultaneous access to same address occurs; enables software/hardware arbitration recovery paths.

Key Features

Feature	Design Value
True Dual-Port Architecture	Enables concurrent read/write access to identical memory locations-eliminates arbitration logic and lock-step delays in multi-core systems.
Selectable Pipelined or Flow-Through Output	Pipelined mode (FT/PIPE = VIH) cuts tCD to 3.6 ns for burst throughput; flow-through (FT/PIPE = VIL) provides zero-cycle latency for deterministic control loops.
Independent Port Voltage Configuration	OPTL/OPTR pins allow left port at 3.3V (FPGA interface) and right port at 2.5V (ASIC interface) simultaneously-no level shifters needed.
Address Counter with Repeat Function	CNTENL/R and REPEATL/R enable auto-incrementing address sequences and instant return to last ADS-loaded address-ideal for FIFO emulation and DMA buffering.
Collision and Interrupt Flags	COLL/COLR and INTL/INTR outputs provide hardware-level event signaling-reduces CPU polling overhead and improves real-time response predictability.
JTAG Boundary-Scan Support	Full IEEE 1149.1 compliance enables production test, in-circuit debugging, and solder-joint integrity verification without physical probe access.

Applications

Telecom Line Card Buffering	FPGA-ASIC Co-Processing Interface
Use Scenario: High-speed packet buffering between line-side PHY and switch fabric ASIC in 10G/25G optical transport equipment. IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking crossbar buffer-left port accepts incoming packets from PHY, right port feeds outgoing packets to switch fabric, both at 166 MHz. Use Value: 3.6 ns pipelined tCD ensures sub-4 ns data availability, enabling deterministic 10 ns packet turnaround and eliminating jitter-induced cell loss.	Use Scenario: Real-time data exchange between Xilinx Ultrascale+ FPGA (3.3V I/O) and custom 28nm ASIC (2.5V I/O) in radar signal processing subsystem. IC Role / Device Role / Timing Role: Memory bridge with independent voltage domains-left port configured at 3.3V for FPGA, right port at 2.5V for ASIC, synchronized via separate clocks. Use Value: Eliminates external level shifters and associated timing skew; OPTL/OPTR configuration reduces BOM count and layout complexity.
Industrial PLC Dual-Core Synchronization	Medical Imaging Data Pipeline
Use Scenario: Shared memory for deterministic task coordination between safety-certified ARM Cortex-R5 (left port) and real-time DSP (right port) in modular PLC controllers. IC Role / Device Role / Timing Role: Collision detection (COLL/COLR) and interrupt flags (INTL/INTR) provide hardware-enforced mutual exclusion for shared control registers and status tables. Use Value: Reduces software arbitration latency from microseconds to nanoseconds-ensuring <1 µs worst-case response for SIL-3 safety-critical tasks.	Use Scenario: Frame buffering between CT scanner front-end ADC (16-bit × 4 channel @ 80 MSPS) and GPU-accelerated reconstruction engine. IC Role / Device Role / Timing Role: Left port captures interleaved ADC samples using address counter auto-increment; right port streams bursts to GPU via PCIe DMA controller. Use Value: CNTENL-driven address sequencing eliminates CPU overhead for sample indexing; 12 Gbps bandwidth sustains 4×80 MSPS raw data flow without backpressure.

Telecom Line Card Buffering

FPGA-ASIC Co-Processing Interface

Use Scenario: High-speed packet buffering between line-side PHY and switch fabric ASIC in 10G/25G optical transport equipment.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking crossbar buffer-left port accepts incoming packets from PHY, right port feeds outgoing packets to switch fabric, both at 166 MHz.

Use Value: 3.6 ns pipelined tCD ensures sub-4 ns data availability, enabling deterministic 10 ns packet turnaround and eliminating jitter-induced cell loss.

Use Scenario: Real-time data exchange between Xilinx Ultrascale+ FPGA (3.3V I/O) and custom 28nm ASIC (2.5V I/O) in radar signal processing subsystem.

IC Role / Device Role / Timing Role: Memory bridge with independent voltage domains-left port configured at 3.3V for FPGA, right port at 2.5V for ASIC, synchronized via separate clocks.

Use Value: Eliminates external level shifters and associated timing skew; OPTL/OPTR configuration reduces BOM count and layout complexity.

Industrial PLC Dual-Core Synchronization

Medical Imaging Data Pipeline

Use Scenario: Shared memory for deterministic task coordination between safety-certified ARM Cortex-R5 (left port) and real-time DSP (right port) in modular PLC controllers.

IC Role / Device Role / Timing Role: Collision detection (COLL/COLR) and interrupt flags (INTL/INTR) provide hardware-enforced mutual exclusion for shared control registers and status tables.

Use Value: Reduces software arbitration latency from microseconds to nanoseconds-ensuring <1 µs worst-case response for SIL-3 safety-critical tasks.

Use Scenario: Frame buffering between CT scanner front-end ADC (16-bit × 4 channel @ 80 MSPS) and GPU-accelerated reconstruction engine.

IC Role / Device Role / Timing Role: Left port captures interleaved ADC samples using address counter auto-increment; right port streams bursts to GPU via PCIe DMA controller.

Use Value: CNTENL-driven address sequencing eliminates CPU overhead for sample indexing; 12 Gbps bandwidth sustains 4×80 MSPS raw data flow without backpressure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166AXC	512K × 36, 3.3V core & I/O, no OPT-selectable voltage, no JTAG, -40°C to +85°C rated at 133 MHz only	Lacks mixed-voltage flexibility and boundary-scan; requires external level translation when interfacing 2.5V devices	Choose when cost sensitivity outweighs voltage flexibility and debug capability; verify thermal derating for 166 MHz operation.
AS7C33512PFS-166BIN	512K × 36, 2.5V core/I/O only, no pipelined mode, tCD = 5.5 ns (flow-through only), no address counter or REPEAT function	Missing pipelined output and auto-addressing features; limited to simpler buffering roles without burst optimization	Prefer where deterministic zero-latency access suffices and advanced timing features are unused-reduces firmware complexity.

Compared with CY7C1362BV33-166AXC and AS7C33512PFS-166BIN, the 70T3539MS166BC uniquely combines 166 MHz pipelined performance, per-port voltage configurability, JTAG testability, and hardware address management-making it optimal for high-reliability, mixed-voltage, real-time embedded systems requiring minimal software intervention.

Availability

70T3539MS166BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 70T3539MS166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) designs high-performance memory and interface solutions for mission-critical infrastructure, emphasizing signal integrity, thermal reliability, and long-term manufacturability.

The 70T3539M family targets high-bandwidth, low-latency inter-processor communication in telecom, test equipment, and real-time control systems-where deterministic timing, dual-port concurrency, and industrial-grade robustness are mandatory.

FAQ

What is the maximum guaranteed operating frequency of the 70T3539MS166BC?

The 70T3539MS166BC is specified for 166 MHz operation in commercial temperature range (0°C to +70°C) with pipelined output mode. In industrial range (-40°C to +85°C), it is guaranteed up to 133 MHz. Both ratings assume proper power supply decoupling, signal integrity, and adherence to AC timing parameters including tCH2/tCL2 and tCD2.

How does the OPTL and OPTR pin configuration affect I/O voltage levels on the 70T3539MS166BC?

On the 70T3539MS166BC, OPTL = VDD (2.5V) configures the left port for 3.3V I/O signaling and requires VDDQL = 3.3V; OPTL = VSS (0V) configures it for 2.5V I/O with VDDQL = 2.5V. OPTR operates identically for the right port. This independence allows mixed-voltage system integration without external level shifters.

Does the 70T3539MS166BC support true simultaneous read/write access to the same memory address?

Yes-the 70T3539MS166BC uses true dual-port SRAM cells that permit concurrent read and write operations to identical addresses on left and right ports. Collision detection (COLL/COLR) flags assert when this occurs, enabling hardware-aware arbitration without data corruption or bus contention.

What is the purpose of the ZZL and ZZR pins on the 70T3539MS166BC?

The ZZL and ZZR pins on the 70T3539MS166BC activate port-specific sleep mode when driven HIGH. This disables dynamic inputs (except JTAG), reducing standby current to 12 mA per port while preserving memory contents. Sleep mode recovery requires three clock cycles (tZZRC), and JTAG remains fully functional during sleep.

Can the 70T3539MS166BC be used for depth expansion, and how is it implemented?

Yes-the 70T3539MS166BC supports depth expansion using dual chip enables (CE0/CE1). For example, two devices can be stacked: CE0L = LOW/CE1L = HIGH enables first device; CE0L = HIGH/CE1L = LOW enables second. No additional logic is required, and pipelined timing waveforms remain consistent across expanded configurations.

70T3539MS166BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 18Mbit

Memory Organization:: 512K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3539MS166BC FAQ

1.How can I place an order for 70T3539MS166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS166BC reliable?

The price and inventory of 70T3539MS166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS166BC is usually 5 days.

3.What payment methods are accepted for 70T3539MS166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS166BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS166BC?

70T3539MS166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS166BC?

For technical support, including 70T3539MS166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS166BC requirements.

6.How does Aetrix verify that 70T3539MS166BC is sourced from the original manufacturer or authorized distributors?

All 70T3539MS166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS166BC meets industry standards.

7.What is the process for return or replacement of 70T3539MS166BC?

All 70T3539MS166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS166BC part is unused and in its original packaging.

Return procedure for 70T3539MS166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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