Renesas 70T3539MS166BC8
- Part No.:
- 70T3539MS166BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3539MS166BC8.pdf
- Description:
- IC SRAM 18MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3539MS166BC8 from IDT (now Renesas) is a high-speed synchronous dual-port SRAM with true dual-port architecture, 512K × 36-bit organization (18 Mb), 2.5V core supply, and selectable 2.5V/3.3V I/O interfaces per port. It supports simultaneous independent read/write access on left and right ports with pipelined or flow-through output modes, enabling real-time data exchange in telecom packet buffers and FPGA co-processor memory subsystems.
For engineers reviewing the 70T3539MS166BC8 datasheet, 70T3539MS166BC8 pinout, 70T3539MS166BC8 application, or 70T3539MS166BC8 equivalent, key selection criteria include its 166 MHz operation (6 ns cycle time), dual-cycle deselect for pipelined mode, JTAG boundary scan support, industrial temperature range (–40°C to +85°C), and 256-pin BGA package with independent voltage control per port.
Technical Context
This device implements fully synchronous dual-port operation with separate clock, address, data, and control registers on each port. Its internal architecture includes dual address strobe logic (ADSL/ADSR), counter-enable and repeat-address functionality, and collision/interrupt flag generation for inter-port coordination.
The memory array uses true dual-port cells enabling concurrent access to identical addresses without arbitration. Each port features independently configurable I/O voltage (via OPTL/OPTR), sleep mode (ZZL/ZZR), and output timing mode (PL/FTL & PL/FTR), allowing heterogeneous system integration - e.g., one port interfacing a 2.5V FPGA fabric while the other connects to a 3.3V legacy controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36 bits (18 Mb total); enables 36-bit parallel data paths per port for high-bandwidth buffering. |
| Max Clock Frequency | 166 MHz (commercial grade); delivers 12 Gbps aggregate bandwidth (6 ns cycle time). |
| Access Time | 3.6 ns (pipelined mode, 166 MHz); ensures sub-4 ns data valid after clock edge for tight-timing systems. |
| Supply Voltages | VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150 mV per port (I/O & controls); supports mixed-voltage system design. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in base station, industrial PLC, and avionics environments. |
| Package | 256-pin BGA (17 mm × 17 mm, 1.0 mm pitch); compatible with standard surface-mount assembly and thermal management. |
| JTAG Support | IEEE 1149.1-compliant TAP controller (TCK, TMS, TDI, TDO, TRST); enables in-system test and debug without external probes. |
Pinout & Package
70T3539MS166BC8 is housed in a 256-pin Ball Grid Array (BGA) package with 17 mm × 17 mm body size and 1.0 mm ball pitch. All VDD pins require connection to 2.5 V; VDDQ pins must be set to 2.5 V or 3.3 V depending on OPT pin configuration per port; all VSS pins connect to ground.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Drives internal register pipeline; rising-edge triggered; enables deterministic timing across both ports. |
| A0L–A18L / A0R–A18R | Address inputs (19-bit) | Directly selects one of 524,288 (512K) memory locations per port; no external address latching required. |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data bus (36-bit) | Supports byte-wise write enable (BE0–BE3) for partial writes; tri-state controlled by OE and CE signals. |
| CE0L/CE1L / CE0R/CE1R | Dual chip enable inputs | Enables depth expansion without external logic; CE0=low + CE1=high activates port; both high places port in standby. |
| R/WL / R/WR | Read/write direction control | Synchronous active-high signal; determines data flow direction on next clock edge; no setup/hold dependency on data. |
| OEL / OER | Output enable (asynchronous) | Immediately places I/O pins in high-impedance state regardless of clock phase; critical for bus sharing. |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input (VIH/VIL) selecting output latency: pipelined = 1-cycle delay, flow-through = combinational path. |
| INTL / INTR | Interrupt flag output | Asserted when internal condition (e.g., collision detection or counter overflow) requires host CPU attention. |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, independent read/write access to same address location - essential for lock-free inter-processor communication. |
| Dual-cycle deselect (DCD) | Guarantees clean output disable in pipelined mode with two-cycle deactivation, preventing bus contention during mode transitions. |
| Independent I/O voltage per port | OPTL/OPTR pins configure VDDQX to 2.5 V or 3.3 V per port, eliminating level shifters in mixed-voltage SoC/FPGA designs. |
| Address counter with repeat function | ADSL/CNTENL/REPEATL logic auto-increments or reuses last loaded address - simplifies burst transfers and DMA buffer management. |
| Collision and interrupt detection | COLL/INTR flags signal concurrent access to same address or internal event, enabling software/hardware arbitration without polling. |
| Low-power sleep mode | ZZL/ZZR assertion disables dynamic inputs (except JTAG), reducing current to ≤20 mA while preserving memory contents. |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between ingress and egress line cards in a carrier-grade switch. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between two ASICs - one writing incoming packets, the other reading for classification and forwarding. Use Value: 166 MHz pipelined operation enables full-line-rate 10G Ethernet buffering with <6 ns cycle time, eliminating packet loss under burst traffic. |
Use Scenario: Providing low-latency, high-bandwidth scratchpad memory between a Xilinx UltraScale+ FPGA and an ARM Cortex-A53 application processor. IC Role / Device Role / Timing Role: Left port interfaces FPGA fabric at 2.5 V; right port connects to processor AXI bus at 3.3 V; JTAG enables runtime memory diagnostics. Use Value: Independent voltage control per port eliminates level-shifter ICs; 36-bit width matches common AXI-64/128 burst alignment requirements. |
| Industrial Motion Controller | Avionics Data Acquisition |
|
Use Scenario: Real-time exchange of position, velocity, and torque data between a DSP-based servo controller and a safety-monitoring microcontroller. IC Role / Device Role / Timing Role: Dual-port SRAM serves as deterministic handshake memory - DSP writes sensor fusion results; MCU reads for fail-safe decision logic. Use Value: Collision detection flags alert MCU immediately upon concurrent access, enabling deterministic response within 4.2 ns (tCOLS max) for SIL-3 compliance. |
Use Scenario: Capturing synchronized analog-to-digital samples from multiple flight sensors (IMU, pressure, temperature) before formatting for ARINC-429 transmission. IC Role / Device Role / Timing Role: Left port accepts burst ADC data at 133 MHz; right port streams formatted frames to communication controller; industrial temp rating ensures reliability at altitude. Use Value: –40°C to +85°C operation and 256-pin BGA package meet DO-160E environmental and mechanical requirements for airborne electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 3.3V core & I/O; no 2.5V option; 166 MHz max; 256-pin TQFP (not BGA); lacks JTAG and address counter. | Requires external level shifting for 2.5V systems; unsuitable for space-constrained BGA-only layouts; no built-in diagnostic capability. | Select only if legacy 3.3V-only design and TQFP assembly infrastructure exist; verify PCB layout compatibility. |
| AS7C331024B-166BIN | Asynchronous dual-port; 166 MHz max; 2.5V core/I/O only; 256-pin BGA; no JTAG, no pipelined mode, no collision detection. | Higher timing uncertainty due to asynchronous interface; cannot achieve deterministic 6 ns cycle time; no hardware arbitration support. | Consider only for cost-sensitive, non-real-time applications where pipelined latency and inter-port signaling are unnecessary. |
Compared with CY7C1362BV33-166AXC and AS7C331024B-166BIN, the 70T3539MS166BC8 uniquely combines 2.5V core with flexible per-port I/O voltage, pipelined timing, JTAG testability, and hardware collision/interrupt signaling - making it the only choice for high-reliability, mixed-voltage, real-time embedded systems requiring deterministic dual-port behavior.
Availability
70T3539MS166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, avionics data acquisition, and FPGA-based embedded systems requiring stable component supply across extended product lifecycles.
Supply support for 70T3539MS166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics (formerly Integrated Device Technology, IDT) is a global semiconductor leader specializing in high-performance memory, timing, and connectivity solutions for industrial, automotive, and communications markets.
The 70T3539M family was designed specifically for real-time, low-latency dual-access memory applications in network processors, FPGAs, and safety-critical controllers - emphasizing deterministic timing, mixed-voltage interoperability, and on-chip diagnostics.
FAQ
What is the maximum operating frequency of the 70T3539MS166BC8, and under what conditions is it guaranteed?
The 70T3539MS166BC8 is rated for 166 MHz operation in commercial temperature range (0°C to +70°C), with a guaranteed 6 ns clock cycle time (tCYC2) in pipelined mode. This specification assumes VDD = 2.5 V ±100 mV, VDDQ = 3.3 V ±150 mV or 2.5 V ±100 mV per port, and proper signal integrity per AC Test Conditions (Figure 1). Industrial-grade operation is specified up to 133 MHz (7.5 ns cycle time).
How does the 70T3539MS166BC8 handle simultaneous access to the same memory location from both ports?
The 70T3539MS166BC8 uses true dual-port memory cells that permit simultaneous read/write access to identical addresses without conflict. When both ports access the same location, the device asserts COLL (collision alert) flags on both ports within 4.2 ns (tCOLS max), allowing external logic or firmware to resolve contention. No data corruption occurs - the last write wins deterministically based on relative clock phase alignment.
Can the left and right ports of the 70T3539MS166BC8 operate at different I/O voltage levels?
Yes. The 70T3539MS166BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O operation (requiring VDDQL = 3.3 V), while OPTR = VSS (0 V) configures the right port for 2.5 V I/O (requiring VDDQR = 2.5 V). This enables direct interfacing with heterogeneous voltage domains without external level shifters.
What is the purpose of the REPEAT and CNTEN signals in the 70T3539MS166BC8 address counter function?
CNTEN enables automatic address increment on each clock edge when asserted low; ADSL/ADSR loads the initial address. REPEAT, when asserted, resets the internal counter to the last valid ADS-loaded address - enabling burst transfers to a fixed buffer region or circular buffer wraparound. This eliminates software overhead for address management in DMA-like operations.
Does the 70T3539MS166BC8 support boundary scan testing, and which pins are involved?
Yes. The 70T3539MS166BC8 includes IEEE 1149.1-compliant JTAG boundary scan with dedicated pins: TCK (Test Clock), TMS (Test Mode Select), TDI (Test Data In), TDO (Test Data Out), and TRST (Test Reset). These pins operate at VDD-referenced logic levels (1.7 V to VDD + 0.1 V) and remain functional even in sleep mode (ZZ asserted), enabling in-system test during power-down states.
70T3539MS166BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3539MS166BC8 FAQ
1.How can I place an order for 70T3539MS166BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3539MS166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3539MS166BC8 reliable?
The price and inventory of 70T3539MS166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS166BC8 is usually 5 days.
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Once your 70T3539MS166BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3539MS166BC8?
For technical support, including 70T3539MS166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS166BC8 requirements.
6.How does Aetrix verify that 70T3539MS166BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3539MS166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS166BC8 meets industry standards.
7.What is the process for return or replacement of 70T3539MS166BC8?
All 70T3539MS166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS166BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3539MS166BC8 part is unused and in its original packaging.
Return procedure for 70T3539MS166BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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