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Renesas 70T3539MS166BCG

Part No.:
70T3539MS166BCG
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T3539MS166BCG.pdf
Description:
IC SRAM 18MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,030

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Product details

Overview

70T3539MS166BCG from IDT (now Renesas) is a high-speed synchronous dual-port SRAM with true dual-access architecture, 512K × 36-bit organization, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and pipelined or flow-through output modes. It delivers 3.6ns clock-to-data (tCD2) at 166MHz for real-time inter-processor communication in telecom line cards.

For engineers reviewing the 70T3539MS166BCG datasheet, 70T3539MS166BCG pinout, 70T3539MS166BCG application, or 70T3539MS166BCG equivalent, key selection criteria include simultaneous left/right port access timing, dual-cycle deselect (DCD) support for pipelined output mode, JTAG boundary-scan capability, industrial temperature operation up to +85°C, and BGA256 package compatibility with depth-expansion logic.

Technical Context

The 70T3539MS166BCG implements fully synchronous dual-port operation with independent clock inputs (CLKL/CLKR), separate address strobe enables (ADSL/ADSR), and counter-based address generation controlled by CNTENL/CNTENR and REPEATL/REPEATR. Each port supports byte-selectable writes via four 9-bit BE signals and features dedicated interrupt (INTL/INTR) and collision detection (COLL/COLR) flags.

Its internal architecture includes dual data input registers, self-timed write control, and configurable sleep mode (ZZL/ZZR) that disables dynamic inputs while preserving JTAG accessibility. The device supports mixed-voltage operation: VDD = 2.5V ±100mV for core logic, while VDDQL/VDDQR are independently set to 2.5V or 3.3V based on OPTL/OPTR pin states.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization512K × 36 bits (18 Mbit total); enables 36-bit parallel data exchange between two independent bus domains
Max Clock Frequency166 MHz (commercial grade); defines minimum 6 ns cycle time (tCYC2) for pipelined read/write operations
Access Time3.6 ns (tCD2, pipelined mode); determines latency from CLK rise to valid DOUT at full speed
Supply VoltagesVDD = 2.5V ±100 mV (core); VDDQ = 2.5V or 3.3V ±150/±100 mV per port (I/O); enables mixed-voltage system integration
Operating Temperature–40°C to +85°C (industrial grade); validated for deployment in base station and industrial controller environments
Package256-pin BGA (17 mm × 17 mm, 1.0 mm pitch); matches standard PCB layout for high-density memory subsystems
JTAG SupportIEEE 1149.1-compliant TAP controller (TCK/TMS/TDI/TDO/TRST); enables in-system test and debug without external probes

Pinout & Package

70T3539MS166BCG uses a 256-ball BGA package (body size 17 mm × 17 mm, 1.0 mm ball pitch). Power and ground balls are distributed across the array to minimize noise and ensure stable core/I/O voltage delivery. Pin functions are strictly segregated per port (Left/Right), with no shared signal lines between ports except JTAG and ZZ sleep controls.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKRPort-specific clock inputSynchronizes all register transfers on respective port; enables independent timing domains
A0L–A18L / A0R–A18RAddress inputs19-bit address bus per port; supports full 512K address space (219 = 524,288 locations)
I/O0L–I/O35L / I/O0R–I/O35RBidirectional data bus36-bit parallel I/O per port; each byte (9-bit group) controlled by BE0–BE3
CE0L/CE1L / CE0R/CE1RDual chip enable inputsAllows depth expansion without external logic: CE0=low + CE1=high enables port; both high = power-down
R/WL / R/WRRead/write direction controlActive-high for write; low for read; synchronous with CLK edge and subject to setup/hold timing
OEL / OEROutput enable (asynchronous)Tri-states DOUT immediately when asserted; overrides clocked output behavior
PL/FTL / PL/FTRPipeline/Flow-through mode selectConfigures output latency: VIH = pipelined (1-cycle delay), VIL = flow-through (no added delay)
ZZL / ZZRSleep mode controlAsserting high disables dynamic inputs (except JTAG), reducing current to ≤20 mA per port

Key Features

Feature Design Value
True dual-port memory cellsEnables simultaneous read/write access to identical addresses on left and right ports-critical for lock-free inter-processor messaging
Dual-cycle deselect (DCD)Guarantees clean output disable after two clock cycles in pipelined mode, preventing bus contention during mode transitions
Independent I/O voltage selectionOPTL/OPTR pins allow one port at 3.3V and the other at 2.5V-eliminates level-shifter components in mixed-voltage SoC interfaces
Address counter with repeatCNTENL/R and REPEATL/R enable burst-mode sequential access without external address generation logic
Collision detection logicCOLL/COLR flags assert within 4.2 ns when concurrent accesses target same address-enables deterministic arbitration in real-time systems
Interrupt flag generationINTL/INTR outputs pulse synchronously with CLK upon completion of write or collision event-reduces polling overhead in firmware

Applications

Telecom Line Card Buffering Real-Time DSP Co-Processing

Use Scenario: High-bandwidth packet buffering between framer ASIC and network processor in OC-192 line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress data paths, synchronized to independent clocks.

Use Value: 12 Gbps aggregate bandwidth (166 MHz × 36 bits) eliminates FIFO bottlenecks; pipelined mode ensures deterministic 3.6 ns read latency.

Use Scenario: Shared instruction/data memory between dual-core DSPs executing time-critical radar processing algorithms.

IC Role / Device Role / Timing Role: Provides atomic memory access for lock-step execution; collision detection flags trigger hardware arbitration.

Use Value: Simultaneous access to same address avoids software mutex overhead; 4.2 ns collision alert enables sub-cycle response.

Industrial PLC Data Exchange Avionics Sensor Fusion Hub

Use Scenario: Real-time I/O mapping between safety-critical PLC CPU and fieldbus interface module operating at different clock domains.

IC Role / Device Role / Timing Role: Serves as deterministic inter-processor mailbox with JTAG visibility for functional safety verification.

Use Value: Industrial temperature rating (–40°C to +85°C) and sleep mode (≤20 mA) meet IEC 61508 SIL-3 power constraints.

Use Scenario: Aggregating time-stamped inertial and GPS sensor data for Kalman filtering in flight control computers.

IC Role / Device Role / Timing Role: Acts as timestamp-aligned buffer where left port accepts sensor streams and right port feeds filter engine.

Use Value: Independent address counters (CNTENL/R) enable autonomous burst capture; ADS strobes guarantee sample alignment across ports.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-166BZXI3.3V-only core and I/O; no VDDQ voltage select; 165-pin TQFP packageLacks mixed-voltage flexibility and BGA density; requires level shifters for 2.5V SoCsSelect only if legacy 3.3V-only design and TQFP assembly are mandatory
AS7C331025B-166BINAsynchronous dual-port interface; no clock domain separation; 166 MHz max only at 3.3VNo pipelined mode, no JTAG, no collision/interrupt flags-requires external arbitration logicChoose only for cost-sensitive, non-real-time applications without strict timing determinism

Compared with CY7C1362BV33-166BZXI and AS7C331025B-166BIN, the 70T3539MS166BCG uniquely combines 2.5V core + selectable I/O voltage, pipelined/flow-through mode, integrated collision/interrupt signaling, and JTAG-all in a space-efficient 256-BGA package optimized for high-reliability embedded systems.

Availability

70T3539MS166BCG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and real-time DSP applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3539MS166BCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics (formerly Integrated Device Technology) is a global semiconductor leader specializing in high-performance memory, timing, and analog solutions for communications, computing, and industrial markets.

The 70T3539MS166BCG belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency inter-processor communication in systems demanding simultaneous multi-domain access and real-time responsiveness.

FAQ

What is the maximum operating frequency of the 70T3539MS166BCG in pipelined mode?

The 70T3539MS166BCG supports up to 166 MHz in pipelined output mode (FT/PIPE = VIH), achieving a 6 ns clock cycle time (tCYC2) and 3.6 ns clock-to-data delay (tCD2). This specification applies to commercial-grade operation (0°C to +70°C); industrial-grade units are rated to 133 MHz (7.5 ns tCYC2).

How does the 70T3539MS166BCG handle simultaneous access to the same memory location from both ports?

The 70T3539MS166BCG uses true dual-port memory cells that permit concurrent read/write operations to identical addresses. When conflict occurs, the device asserts COLL (left) or COLR (right) flags within 4.2 ns, and the last write wins. No bus locking or arbitration circuitry is required-collision status is reported synchronously for firmware handling.

Can the left and right ports of the 70T3539MS166BCG operate at different I/O voltage levels?

Yes. The 70T3539MS166BCG allows independent I/O voltage configuration: OPTL sets VDDQL to 2.5V or 3.3V for the left port, and OPTR sets VDDQR accordingly for the right port. This enables one port to interface with a 2.5V FPGA while the other connects to a 3.3V microcontroller-without external level shifters.

What is the purpose of the REPEATL and REPEATR pins on the 70T3539MS166BCG?

REPEATL and REPEATR reset the internal address counter to the last valid address loaded via ADSL or ADSR, respectively. This enables burst-mode sequential access without continuous address bus updates-ideal for streaming sensor data or instruction fetch in DSP co-processing applications using the 70T3539MS166BCG.

Does the 70T3539MS166BCG support JTAG boundary-scan testing?

Yes. The 70T3539MS166BCG integrates a full IEEE 1149.1-compliant JTAG TAP controller with TCK, TMS, TDI, TDO, and TRST pins. Boundary-scan operates independently of sleep mode (ZZL/ZZR) and remains functional even when core logic is powered down-enabling in-system test and debug throughout the product lifecycle.

70T3539MS166BCG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T3539MS166BCG FAQ

1.How can I place an order for 70T3539MS166BCG through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3539MS166BCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3539MS166BCG reliable?

The price and inventory of 70T3539MS166BCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3539MS166BCG is usually 5 days.

3.What payment methods are accepted for 70T3539MS166BCG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3539MS166BCG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3539MS166BCG?

70T3539MS166BCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3539MS166BCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3539MS166BCG?

For technical support, including 70T3539MS166BCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3539MS166BCG requirements.

6.How does Aetrix verify that 70T3539MS166BCG is sourced from the original manufacturer or authorized distributors?

All 70T3539MS166BCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3539MS166BCG meets industry standards.

7.What is the process for return or replacement of 70T3539MS166BCG?

All 70T3539MS166BCG units undergo pre-shipment inspection (PSI). If there is an issue with 70T3539MS166BCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3539MS166BCG part is unused and in its original packaging.

Return procedure for 70T3539MS166BCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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