Renesas 70T3589S133BC8
- Part No.:
- 70T3589S133BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3589S133BC8.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3589S133BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture, 2.5V core supply, and independently configurable 2.5V/3.3V I/O interfaces per port. It supports simultaneous read/write access to the same memory location at up to 133MHz (4.2ns tCD2), features pipelined or flow-through output modes, and operates across industrial temperature range (–40°C to +85°C) in 256-pin BGA packaging - used in real-time packet buffering for telecom line cards.
For engineers reviewing the 70T3589S133BC8 datasheet, 70T3589S133BC8 pinout, 70T3589S133BC8 application, or 70T3589S133BC8 equivalent, key selection considerations include dual-port timing coordination, independent VDDQ/OPT voltage configuration per port, JTAG-compliant boundary scan support, and sleep-mode current optimization (5–15mA) for power-sensitive embedded systems.
Technical Context
This device implements fully synchronous operation on both left and right ports with separate clock inputs (CLKL/CLKR), enabling deterministic timing control for time-critical inter-processor communication. Its dual-chip-enable architecture (CE0X/CE1X) allows depth expansion without external logic, while counter enable (CNTENX) and repeat (REPEATX) signals support burst address generation without host intervention.
The memory integrates interrupt and collision detection flags (INTR/COLR, INTL/COLL), pipelined output mode (PL/FTX), and automatic self-timed write cycles - all synchronized to rising clock edges. Sleep mode (ZZX) disables dynamic inputs except JTAG, preserving testability during low-power states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9-Mbit total); enables single-chip storage for 32-bit data paths with parity or ECC overhead. |
| Max Clock Frequency | 133MHz (7.5ns tCYC2); supports 133MT/s throughput per port in pipelined mode. |
| Access Time (tCD2) | 4.2ns max (pipelined); delivers sub-5ns data valid after clock edge for tight timing budgets. |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port - selectable via OPTX pins. |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade reliability in base station and industrial control applications. |
| Package | 256-pin BGA (BC256), 17mm × 17mm × 1.4mm body, 1.0mm ball pitch; compatible with standard SMT reflow profiles. |
| Power Consumption | ISB3 = 5–20mA (full standby), Izz = 5–15mA (sleep mode); enables low-quiescent-power system design. |
Pinout & Package
256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. Power distribution includes 24× VDD (2.5V core), 20× VDDQ (I/O supply), and 48× VSS ground balls. JTAG interface (TCK/TMS/TDI/TDO/TRST) is fully supported per IEEE 1149.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A17L / A0R–A17R | Address Inputs (Left/Right) | A16/A17 are No Connects for 70T3589; usable address range is A0–A15 (64K depth). |
| I/O0L–I/O35L / I/O0R–I/O35R | Bi-directional Data Bus | 36-bit parallel interface per port; byte enables (BE0–BE3) allow 9-bit granularity writes. |
| CLKL / CLKR | Port Clock Inputs | Fully independent clocks enable asynchronous port operation; critical for latency isolation in multi-core systems. |
| CE0L/CE1L / CE0R/CE1R | Dual Chip Enables | Two enables per port allow seamless depth expansion without glue logic or address decoding. |
| PL/FTL / PL/FTR | Output Mode Select | Configures pipelined (VIH) or flow-through (VIL) output timing - determines tCD2 vs tCD1 latency behavior. |
| ZZL / ZZR | Sleep Mode Control | Asserting VIH disables dynamic inputs (except JTAG), reducing current to 5–15mA while preserving test access. |
| OPTL / OPTR | I/O Voltage Selector | Set to VDD (2.5V) for 3.3V I/O operation (VDDQ = 3.3V); set to VSS (0V) for 2.5V I/O (VDDQ = 2.5V). |
| INTR / COLR / INTL / COLL | Status Flags | Open-drain outputs signal interrupt or memory collision events; require external pull-ups for level translation. |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Simultaneous read/write to identical addresses on left/right ports - eliminates arbitration logic in shared-memory interconnects. |
| Independent I/O Voltage Control | OPTL/OPTR pins configure each port for 2.5V or 3.3V signaling - enables mixed-voltage system integration without level shifters. |
| Pipelined Output Mode | Reduces effective access time to 4.2ns at 133MHz - improves throughput in burst-oriented applications like FIFO buffering. |
| Hardware Address Counter | CNTENX/REPEATX/ADSL enable auto-incrementing or repeating address sequences - offloads address generation from host processor. |
| JTAG Boundary Scan | IEEE 1149.1-compliant TAP controller supports production test and in-system debug without additional test points. |
| Low-Power Sleep Mode | ZZX assertion cuts dynamic current to ≤15mA while retaining JTAG accessibility - ideal for duty-cycled subsystems. |
Applications
| Telecom Packet Buffering | Multi-Core Processor Interconnect |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in carrier-grade line cards where deterministic latency is required. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared buffer between ingress and egress processing engines. Use Value: Simultaneous access eliminates bus contention; 4.2ns pipelined tCD2 ensures frame header parsing completes before payload arrives. | Use Scenario: Enabling cache-coherent communication between two ARM Cortex-A cores in an SoC-based industrial controller. IC Role / Device Role / Timing Role: Shared memory resource with independent clocks (CLKL/CLKR) isolates timing domains between cores. Use Value: Collision detection (COLL/COLR) flags prevent data corruption during concurrent writes; interrupt flags (INTR/INTL) signal completion without polling. |
| Radar Signal Processing | Industrial PLC Data Exchange |
Use Scenario: Real-time buffering of ADC samples and FFT results in phased-array radar systems operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability memory interfacing with FPGA-based signal chain, using pipelined mode for predictable 133MHz throughput. Use Value: Industrial temp grade and 2.5V core supply ensure stable operation under thermal cycling; ZZL/ZZR enable power gating between radar pulses. | Use Scenario: Exchanging motion control parameters and sensor feedback between PLC CPU and motion controller over backplane. IC Role / Device Role / Timing Role: Dual-port SRAM serves as handshake-free data exchange zone with dedicated left/right address spaces. Use Value: Dual chip enables (CE0L/CE1L) allow expansion to 512K×36 without redesign; BE0–BE3 enable partial-word updates for status registers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 3.3V core; no independent VDDQ/OPT configuration; 166MHz max in commercial grade only. | Lacks industrial temp support at 133MHz; requires external level shifting for mixed-voltage designs. | Choose only if system uses 3.3V-only I/O and operates within 0°C to +70°C ambient. |
| IDT70V9279L133PFI | Lower density (128K×36); 3.3V core; supports 133MHz in industrial grade but lacks JTAG. | No boundary scan capability; limited to simpler test environments; smaller footprint but lower capacity. | Select when board space is constrained and JTAG is not required for production test or field diagnostics. |
Compared with CY7C1362BV33-133AXC and IDT70V9279L133PFI, the 70T3589S133BC8 uniquely combines industrial-temperature 133MHz operation, independent per-port I/O voltage selection, and full IEEE 1149.1 JTAG support - making it optimal for ruggedized, mixed-voltage, test-critical embedded systems.
Availability
70T3589S133BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and defense electronics requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70T3589S133BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.
The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in networking equipment, radar systems, and multi-processor architectures - emphasizing simultaneous access, flexible voltage operation, and industrial reliability.
FAQ
What is the maximum operating frequency of the 70T3589S133BC8 in industrial temperature range?
The 70T3589S133BC8 is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C). This is confirmed by AC Electrical Characteristics Table 11, which specifies tCYC2 = 7.5ns (133MHz) and tCD2 = 4.2ns max under industrial conditions. The 166MHz speed grade is not available in industrial grade for this specific part number.
Does the 70T3589S133BC8 support JTAG boundary scan?
Yes, the 70T3589S133BC8 supports IEEE 1149.1-compliant JTAG boundary scan. Pins TCK, TMS, TDI, TDO, and TRST are present and functional in the 256-pin BGA (BC256) package. JTAG is explicitly excluded only in the DR208 PQFP variant - not applicable to the BC8 suffix of 70T3589S133BC8.
How does the OPT pin affect I/O voltage levels on the 70T3589S133BC8?
On the 70T3589S133BC8, the OPTL and OPTR pins independently configure each port's I/O interface: setting OPTX to VDD (2.5V) selects 3.3V-compatible operation (requiring VDDQX = 3.3V), while setting OPTX to VSS (0V) selects 2.5V-compatible operation (requiring VDDQX = 2.5V). This enables mixed-voltage system integration without external level shifters.
What is the function of the ZZ pin on the 70T3589S133BC8?
The ZZL and ZZR pins on the 70T3589S133BC8 activate sleep mode when driven high (VIH). In this state, all dynamic inputs are disabled except JTAG signals, reducing current consumption to 5–15mA (Izz). Static inputs (PL/FTX, OPTX, and ZZX themselves) remain active, allowing wake-up via clock or control signal transitions.
Can the 70T3589S133BC8 perform simultaneous read and write operations on the same memory address?
Yes, the 70T3589S133BC8 uses true dual-port memory cells that permit simultaneous read and write access to the exact same memory location - one port reading while the other writes. This behavior is fundamental to its architecture and is explicitly stated in the Features section of the datasheet, eliminating need for external arbitration logic in shared-memory designs.
70T3589S133BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3589S133BC8 FAQ
1.How can I place an order for 70T3589S133BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3589S133BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 70T3589S133BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S133BC8 is usually 5 days.
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6.How does Aetrix verify that 70T3589S133BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3589S133BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S133BC8 meets industry standards.
7.What is the process for return or replacement of 70T3589S133BC8?
All 70T3589S133BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S133BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3589S133BC8 part is unused and in its original packaging.
Return procedure for 70T3589S133BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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